JPS609737A - Manufacture of laminated board - Google Patents
Manufacture of laminated boardInfo
- Publication number
- JPS609737A JPS609737A JP11712883A JP11712883A JPS609737A JP S609737 A JPS609737 A JP S609737A JP 11712883 A JP11712883 A JP 11712883A JP 11712883 A JP11712883 A JP 11712883A JP S609737 A JPS609737 A JP S609737A
- Authority
- JP
- Japan
- Prior art keywords
- wood
- esterified
- anhydride
- reaction
- added
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 239000002023 wood Substances 0.000 claims description 135
- 239000000203 mixture Substances 0.000 claims description 36
- 239000000463 material Substances 0.000 claims description 31
- 150000001875 compounds Chemical class 0.000 claims description 26
- 150000008065 acid anhydrides Chemical class 0.000 claims description 23
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 22
- 150000007519 polyprotic acids Polymers 0.000 claims description 22
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 11
- 125000003700 epoxy group Chemical group 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 description 28
- 235000013312 flour Nutrition 0.000 description 25
- 239000004593 Epoxy Substances 0.000 description 18
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 17
- 238000005886 esterification reaction Methods 0.000 description 17
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 14
- 239000003054 catalyst Substances 0.000 description 14
- 238000010438 heat treatment Methods 0.000 description 14
- 238000000465 moulding Methods 0.000 description 14
- 239000007795 chemical reaction product Substances 0.000 description 12
- 239000000835 fiber Substances 0.000 description 11
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 11
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 10
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 10
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 10
- 238000002156 mixing Methods 0.000 description 10
- 239000000843 powder Substances 0.000 description 9
- 238000003756 stirring Methods 0.000 description 9
- 238000005406 washing Methods 0.000 description 9
- 150000008064 anhydrides Chemical group 0.000 description 7
- 238000003780 insertion Methods 0.000 description 7
- 230000037431 insertion Effects 0.000 description 7
- -1 oxides Chemical class 0.000 description 7
- 229910000029 sodium carbonate Inorganic materials 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 6
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical compound ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- 239000011094 fiberboard Substances 0.000 description 5
- DLYUQMMRRRQYAE-UHFFFAOYSA-N phosphorus pentoxide Inorganic materials O1P(O2)(=O)OP3(=O)OP1(=O)OP2(=O)O3 DLYUQMMRRRQYAE-UHFFFAOYSA-N 0.000 description 5
- 239000011120 plywood Substances 0.000 description 5
- 238000007142 ring opening reaction Methods 0.000 description 5
- 229940014800 succinic anhydride Drugs 0.000 description 5
- 240000005020 Acaciella glauca Species 0.000 description 4
- 235000018782 Dacrydium cupressinum Nutrition 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 4
- 235000013697 Pinus resinosa Nutrition 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000000123 paper Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000007921 spray Substances 0.000 description 4
- 238000005507 spraying Methods 0.000 description 4
- 241000218645 Cedrus Species 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 238000000862 absorption spectrum Methods 0.000 description 3
- 239000010425 asbestos Substances 0.000 description 3
- 239000004568 cement Substances 0.000 description 3
- 230000032050 esterification Effects 0.000 description 3
- 238000007731 hot pressing Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229910052895 riebeckite Inorganic materials 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 2
- 241000218691 Cupressaceae Species 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- 229920002522 Wood fibre Polymers 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009408 flooring Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 230000035484 reaction time Effects 0.000 description 2
- 238000010025 steaming Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 238000003856 thermoforming Methods 0.000 description 2
- 239000002025 wood fiber Substances 0.000 description 2
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- IVIDDMGBRCPGLJ-UHFFFAOYSA-N 2,3-bis(oxiran-2-ylmethoxy)propan-1-ol Chemical compound C1OC1COC(CO)COCC1CO1 IVIDDMGBRCPGLJ-UHFFFAOYSA-N 0.000 description 1
- CMQUQOHNANGDOR-UHFFFAOYSA-N 2,3-dibromo-4-(2,4-dibromo-5-hydroxyphenyl)phenol Chemical compound BrC1=C(Br)C(O)=CC=C1C1=CC(O)=C(Br)C=C1Br CMQUQOHNANGDOR-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- ULSOWUBMELTORB-UHFFFAOYSA-N 5,6-dichloro-2-benzofuran-1,3-dione Chemical compound C1=C(Cl)C(Cl)=CC2=C1C(=O)OC2=O ULSOWUBMELTORB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 235000018185 Betula X alpestris Nutrition 0.000 description 1
- 235000018212 Betula X uliginosa Nutrition 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- 241000238557 Decapoda Species 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- 229920002488 Hemicellulose Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- 235000008577 Pinus radiata Nutrition 0.000 description 1
- 241000218621 Pinus radiata Species 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- AWMVMTVKBNGEAK-UHFFFAOYSA-N Styrene oxide Chemical compound C1OC1C1=CC=CC=C1 AWMVMTVKBNGEAK-UHFFFAOYSA-N 0.000 description 1
- QHWKHLYUUZGSCW-UHFFFAOYSA-N Tetrabromophthalic anhydride Chemical compound BrC1=C(Br)C(Br)=C2C(=O)OC(=O)C2=C1Br QHWKHLYUUZGSCW-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229960000583 acetic acid Drugs 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000004018 acid anhydride group Chemical group 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 description 1
- 150000001734 carboxylic acid salts Chemical class 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- XENVCRGQTABGKY-ZHACJKMWSA-N chlorohydrin Chemical compound CC#CC#CC#CC#C\C=C\C(Cl)CO XENVCRGQTABGKY-ZHACJKMWSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 229940125904 compound 1 Drugs 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000002537 cosmetic Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 239000012362 glacial acetic acid Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- CKAPSXZOOQJIBF-UHFFFAOYSA-N hexachlorobenzene Chemical compound ClC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl CKAPSXZOOQJIBF-UHFFFAOYSA-N 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229920005610 lignin Polymers 0.000 description 1
- 125000002950 monocyclic group Chemical group 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920001281 polyalkylene Polymers 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000012941 solvent-based polyurethane adhesive Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
しかも(耐熱性、耐摩耗性等に優れた木質系の積!−板
の製法に関する。DETAILED DESCRIPTION OF THE INVENTION Furthermore, the present invention relates to a method for manufacturing a wood-based board with excellent heat resistance, abrasion resistance, etc.
従米、木材小片、特に木粉に硬化性偵脂の液体を含浸ま
たは噴霧塗布したものを板状基材表面に散布し、その上
に化粧シートを積層した後、その表面から凹凸模様を有
するエンボス板をあてがって熱圧成形することにより板
状基材表面に凹凸模様を刻設し、次にこの表面に合成樹
脂塗料を塗布することによシ、積層化粧板を得る方法が
知られていた。この積,1暖化粧板は床材、壁材、家具
用材寺に使用されていた。特に足の感触性、立体的な装
飾性をめる用途には好適な材料であった。しかしながら
、木粉に剛性があるため、凹凸模様を刻設する際、化粧
シートに亀裂などの損傷を受けやすーという欠点を有し
ていた。また最近、木粉等の木材小片を化学処理して、
木材小片に熱可塑性を付与する研究が行なわれており、
脂肪酸エステル化した木材小片、或はベンジル化などの
エーテル化した木材小片の第11用が考えられており、
例え(ゲ、木材小片を無水酢酸、氷酢酸、触媒等から成
る溶71交に一定時間浸(R して、木材中の水酸基に
エステル化反応により無水酢酸を付加したアセチル化木
材小片を得,次に該アセチル化木材小片を板状基材表面
に散布し、その後加熱加圧して一体に成形せしめて積層
板を得る方法が提案されている。Small pieces of wood, especially wood powder, impregnated or sprayed with a hardening grease liquid are sprinkled on the surface of a plate-shaped base material, a decorative sheet is laminated on top of that, and then the surface is embossed with an uneven pattern. A known method was to apply a plate and heat-press it to create a concave-convex pattern on the surface of the plate-like base material, and then apply a synthetic resin paint to this surface to obtain a laminated decorative board. . This 1-layer decorative board was used for flooring, walling, and furniture. It was a particularly suitable material for applications where the tactility of the feet and three-dimensional decorative properties were desired. However, since wood flour is rigid, it has the disadvantage that the decorative sheet is susceptible to damage such as cracks when carving the uneven pattern. Recently, small pieces of wood such as wood powder have been chemically treated,
Research is being conducted to impart thermoplasticity to small pieces of wood.
The 11th use of wood chips esterified with fatty acids or etherified such as benzylated is considered.
For example, a small piece of wood is immersed in a solution consisting of acetic anhydride, glacial acetic acid, a catalyst, etc. for a certain period of time (R) to obtain acetylated wood piece in which acetic anhydride is added to the hydroxyl groups in the wood through an esterification reaction. Next, a method has been proposed in which the acetylated wood pieces are scattered on the surface of a plate-shaped substrate, and then heated and pressed to form the pieces into one piece to obtain a laminate.
一方、本発明者らは木材小片に多塩基酸無水物を反応さ
せて木材中にカルボキシル基を導入したエステル化木材
KTi目し、鋭意研究を重ねたところ、カルボキシル基
含有エステル化木材小片、または未反応多塩基酸無水物
を含有しているカルボキシル基含有エステル化木材小片
に、分子中に2ヶ以上のエポキシ基を含む化合物を添加
して、これらを充分に混合して得られた混合物を板状基
材表面に散布し1次−でこれを那熱加圧して一体に成形
せしめることにより好ましい性質を有する木質系の積層
板が得られることを見い出し、本発明に至ったのである
。On the other hand, the present inventors discovered esterified wood KTi, in which carboxyl groups were introduced into the wood by reacting polybasic acid anhydrides with small pieces of wood, and after extensive research, found that small pieces of esterified wood containing carboxyl groups, or A compound containing two or more epoxy groups in the molecule is added to a small piece of carboxyl group-containing esterified wood containing unreacted polybasic acid anhydride, and the resulting mixture is thoroughly mixed. It was discovered that a wood-based laminate having favorable properties can be obtained by dispersing it on the surface of a plate-shaped base material and then heating and pressurizing it to form an integral body, leading to the present invention.
即ち、本発明Vこおいては、上記の如き製法をとること
により、エステル化木材小片中のカルボキシル基がエポ
キシ化合物中のエポキシ基と付加エステル化反応を起し
て、エステル化木材小片がエポキシ化合物を介して架橋
結合される主反応が起り、更に未反応多塩基酸無水物が
存在し、かつ、板状基材として木質系基材を使用した場
合には、木質系基材表層部の木材中の水酸基が未反応多
塩基酸無水物中の無水酸基と開環エステル化反応を起し
、これによって生じた側鎖のカルボキシル基にエポキシ
化合物中のエポキシ基が付加エステル化反応を起して、
木質系基材の表面が多塩基酸無水物とエポキシ化合物を
介してエステル化木材小片と架橋結合されるものであっ
て、本発明の製法により得られた積層板は表面が強靭で
恢く、かつ緻密性を有し、しかも耐熱性、耐摩耗性等に
1憂れたものである。更に、混合物の組成によっては、
本発明の積層板は驚くべきことには、木材小片が可Φ化
されており、表面が緻密性を有1〜、光沢のあるプラス
チック様の外観を呈するものである。That is, in the present invention V, by employing the above manufacturing method, the carboxyl groups in the esterified wood pieces undergo an addition esterification reaction with the epoxy groups in the epoxy compound, and the esterified wood pieces become epoxy. When the main reaction of crosslinking occurs through the compound, and unreacted polybasic acid anhydride is present, and a wood base material is used as the plate-like base material, the surface layer of the wood base material The hydroxyl groups in the wood undergo a ring-opening esterification reaction with the anhydride groups in the unreacted polybasic acid anhydride, and the epoxy groups in the epoxy compound cause an addition esterification reaction to the carboxyl groups in the side chains produced by this. hand,
The surface of the wood-based base material is cross-linked with the esterified wood chips via a polybasic acid anhydride and an epoxy compound, and the laminate obtained by the manufacturing method of the present invention has a tough and durable surface. It is dense and has poor heat resistance, abrasion resistance, etc. Furthermore, depending on the composition of the mixture,
Surprisingly, the laminate of the present invention has small wood pieces made into Φ, and has a dense surface and a shiny plastic-like appearance.
本発明にkいて使用するカルボキシル基含有エステル化
木材小片とは木材小片に多塩基酸無水物を反応させ、木
材組織中に含まれているセルロース、ヘミセルロース、
リグニン等の化学成分中の水酸基をエステル化すること
により、木材小片中にカルボキシル基を化学的に導入し
たものである。The carboxyl group-containing esterified wood chips used in the present invention are made by reacting wood chips with a polybasic acid anhydride to extract cellulose, hemicellulose contained in the wood tissue,
Carboxyl groups are chemically introduced into small pieces of wood by esterifying hydroxyl groups in chemical components such as lignin.
−木材小片の種類としては、木材チップ、木材繊維、倣
細化した木粉等があり、原木、樹種には特に制PHti
なく、例えば赤マツ、スギ、ヒノキ、カバ、ラワン等が
使用される。- Types of small pieces of wood include wood chips, wood fibers, finely ground wood powder, etc., and logs and tree species are particularly susceptible to PHti control.
For example, red pine, cedar, cypress, birch, lauan, etc. are used.
本発明において用いられる多塩基酸無水物とは多価カル
ボン酸無水物であり、具体的には無水マレイン酸、無水
コ・・り酸、無水フタル酸、無水テトラヒドロフタル酸
、無水テトラブロムフタル酸。The polybasic acid anhydride used in the present invention is a polyvalent carboxylic acid anhydride, and specifically, maleic anhydride, co-phosphoric anhydride, phthalic anhydride, tetrahydrophthalic anhydride, and tetrabromophthalic anhydride. .
無水ヘキサヒドロンタル酸、無水3・6ジクロル7タル
酸、無水4・5ジクロルフタル酸、無水イタコン酸、無
水ヘット酸、無水トリメリット酸、無水ピロメリット酸
等が挙げられる。特に工業的に有利で低摩な無水マレイ
ン酸、無水コ・・り酸、無水フタル酸等が好ましくハ。Examples include hexahydrontalic anhydride, 3.6-dichloroheptallic anhydride, 4.5-dichlorophthalic anhydride, itaconic anhydride, hetacetic anhydride, trimellitic anhydride, pyromellitic anhydride, and the like. Particularly preferred are maleic anhydride, phosphoric anhydride, phthalic anhydride, etc., which are industrially advantageous and have low friction.
木材小片と多塩基酸無水物とのエステル化反応は無触媒
下でも充分に進行するが1反応を促進するためにアルカ
リ金属、或はアルカリ土類金属の炭酸塩、酸化物、水酸
化物、カルボン酸塩またはジメチルベンジルアミン。The esterification reaction between small pieces of wood and a polybasic acid anhydride proceeds satisfactorily even in the absence of a catalyst; however, in order to accelerate the reaction, carbonates, oxides, hydroxides, Carboxylic acid salt or dimethylbenzylamine.
トリエチルアミン等のアミン系化合物、その他、ピリジ
ン、ジメチルアニリン等の触媒を用いてもよ(ハ。また
、エステル化反応はジメチルホルムアミド、ジメチルス
ルホキシド等の溶媒中で反応を行なってもよいが、この
場合、反応後エステル化木材小片を溶媒から分離する必
要がある。本発明者らは先て、無溶媒下で直接に木材小
片に多塩基酸無水物を添加し、反応温度60℃以上で加
熱攪拌することにより、付加によるエステル化反応が円
滑に進み、木材小片に多塩基酸無水物が容易に付加して
1種々のエステル化度のカルボキシル基含有エステル化
木材小片を得ることを見い出した。An amine compound such as triethylamine, or a catalyst such as pyridine or dimethylaniline may be used (c).Also, the esterification reaction may be carried out in a solvent such as dimethylformamide or dimethyl sulfoxide; After the reaction, it is necessary to separate the esterified wood pieces from the solvent.The present inventors first added the polybasic acid anhydride directly to the wood pieces in the absence of a solvent, and heated and stirred the mixture at a reaction temperature of 60°C or higher. It has been found that by doing so, the esterification reaction by addition proceeds smoothly, and the polybasic acid anhydride is easily added to the wood pieces to obtain carboxyl group-containing esterified wood pieces having various degrees of esterification.
上記の反応後、洗浄処理をしないで反応生成物をこのま
ま本発明において使用するエステル化木材小片として用
いるのが有利である。この場合、未反応多塩基酸無水物
がカルボキシル基含有エステル化木材小片中に存在して
いる。まだ上記の反応後1反応生成物を洗浄処理して、
乾燥したものを本発明において使用するエステル化木材
小片として用いてもよい。該エステル化木材小片の多塩
基酸無水物の付加率は木材小片を基準として5〜120
重量%、好ましい範囲は5〜70重量%である。捷た、
木材小片に対する多塩基酸無水物の仕込み量は木材小片
を基準として5〜200重量楚、好ましい範囲は5〜8
0重量%である。After the above-mentioned reaction, it is advantageous to use the reaction product as it is, without any washing treatment, as the esterified wood chips used in the present invention. In this case, unreacted polybasic acid anhydride is present in the carboxyl group-containing esterified wood chips. Still after the above reaction, the reaction product is washed,
Dried pieces may be used as the esterified wood pieces used in the present invention. The addition rate of polybasic acid anhydride to the esterified wood pieces is 5 to 120 based on the wood pieces.
The preferred range is 5 to 70% by weight. I cut it,
The amount of polybasic acid anhydride added to a small piece of wood is 5 to 200 kg by weight based on the small piece of wood, and the preferred range is 5 to 8 kg.
It is 0% by weight.
本発明に齢いて用いられる分子中に2ヶ以上のエポキシ
基を含む化合物としては、例えば、ビスフェノールAと
エピクロルヒドリンよシ得られるビスフェノール型エポ
キシ化合物、フェノール樹脂トエビクロルヒドリンより
得られるノボラック型エポキシ化合物、ハロゲン化ビス
フェノールAとエビクロルヒドリ/より得られるハロゲ
ン化エポキシfヒ合物、ポリアルキレングリコールとエ
ピクロルヒドリンよシ得られるポリアルキレンエーテル
型エポキシ化合物、ポリブタジェンの二重結合部分を過
酢酸等によジェポキシ化したポリブタジェン型エポキシ
化合物、その他、ジイソシアネートとグリンドールから
得られるエポキシ化合物、ビニル化合物どグリンジルア
クリレートまたはメタクリレートとの共重合体等が挙げ
られる。特に工業的に多量生産されてお勺、かつ安価に
入手できるビスフェノール型エポキシ化合物が好ましい
。Examples of compounds containing two or more epoxy groups in the molecule used in the present invention include bisphenol-type epoxy compounds obtained from bisphenol A and epichlorohydrin, and novolac-type epoxy compounds obtained from phenolic resin and epichlorohydrin. compound, a halogenated epoxy compound obtained from halogenated bisphenol A and shrimp chlorohydrin, a polyalkylene ether type epoxy compound obtained from polyalkylene glycol and epichlorohydrin, and a polybutadiene double bond with peracetic acid, etc. Other examples include a jepoxidized polybutadiene type epoxy compound, an epoxy compound obtained from diisocyanate and grindol, and a copolymer of a vinyl compound with grindyl acrylate or methacrylate. Particularly preferred are bisphenol-type epoxy compounds that are industrially produced in large quantities and available at low cost.
これらエポキシ化合物の使用量は混合物中の無水酸基1
箔量に対してエポキシ基03〜2当量好ましくは08〜
1.2当量になるよう(でするのがよ・ハ。The amount of these epoxy compounds used is 1 1 of the acid anhydride groups in the mixture.
03 to 2 equivalents of epoxy groups based on the amount of foil, preferably 08 to
It should be 1.2 equivalents.
本発明におりて用いられる板状基材としては木質系基材
、木質系以外の植物繊維質系基材、石こうボード、けい
酸カルシウム板、石綿セメント板、合成樹脂板、金属板
等が挙げられる。ながんずぐ木質系基材、例えば、単板
、合板、パーティクルボード、ファイバーボード等は好
適である。またこれら木質系基材を製造する製造過程途
上のもの、例えば、接着剤が賓霧塗布された木材繊維を
フォーミングして得られるファイバーマット等も用いる
ことができる。Examples of plate-like substrates used in the present invention include wood-based substrates, plant fiber-based substrates other than wood-based, gypsum boards, calcium silicate boards, asbestos cement boards, synthetic resin boards, metal plates, etc. It will be done. Wood-based substrates such as veneer, plywood, particle board, fiberboard, etc. are suitable. Furthermore, those in the process of manufacturing these wood-based base materials, such as fiber mats obtained by forming wood fibers coated with an adhesive by spraying, can also be used.
次に本発明の製法を手順を追って説明する。まず、木材
中の水酸基に多塩基酸無水物を反応させて得られるカル
ボキシル基含有エステル化木材小片の好ましい製法につ
いて述べるが、本発明はこれに限定されるものではない
。木材小片は真空乾燥器や熱風乾燥器等により乾燥して
木材含水率5係以下にして使用するのが好ましい。次に
この木材小片に多塩基酸無水物を添加し、更に触媒を添
加するか或は添加しないで、この混合物を反応温度60
℃以−ヒで加熱攪拌する。反応は加熱攪拌中に徐々に進
行するが、反応温度60℃未満の場合は木材小片に対す
る多塩酸無水物の付加率が著しく小さいか、または付加
することが全くないため好ましくない。また反応温度6
0℃以上で炭酸ナトリウム等の触媒を添加した反応系に
おいては木材小片に対する付加率が木材小片を基準とし
て100重i%以上にもなる高付加率のエステル化木材
小片が得られる。反応時間は通常5分〜10時間、好ま
しくは10分〜7時間である。エステル化度は反応温度
、反応時間をコントロールすることにより調整すること
ができるものであって、所望のエステル化度の木材小片
が得られるまで反応させる。反応後、製造しようとする
積層板の種類によっては1反応生成物をアセトンおよび
水等で洗浄処理し乾燥させる。乾燥して得られたエステ
ル化木材小片は木材中の水酸基が多塩基酸無水物と開環
エステル化反応を司して、木材小片に多塩基酸無水物が
付加され、側鎖にカルボキシル基が導入されていること
が赤外線吸収スペクトルの分析結果より明白である。こ
のエステル化木材小片を本発明において使用するカルボ
キシル基含有エステル化木材小片として用いるのである
。また前述の如く、一般には上記反応生成物を洗浄処理
しないで、このまま本発明において使用するエステル化
木材小片として用いるのが有利である。この場合、未反
応多塩基酸無水物がカルボキシル基含有エステル化木材
小片中に存在している。Next, the manufacturing method of the present invention will be explained step by step. First, a preferred method for producing carboxyl group-containing esterified wood pieces obtained by reacting hydroxyl groups in wood with a polybasic acid anhydride will be described, but the present invention is not limited thereto. It is preferable to use the wood pieces by drying them using a vacuum dryer, hot air dryer, etc. to reduce the moisture content of the wood to 5 parts or less. A polybasic acid anhydride is then added to the wood chips, and the mixture is heated to a reaction temperature of 60°C with or without further addition of a catalyst.
Heat and stir at ℃ or below. The reaction proceeds gradually during heating and stirring, but if the reaction temperature is less than 60° C., the addition rate of polyhydrochloric anhydride to the wood chips is extremely small, or there is no addition at all, which is not preferable. Also, reaction temperature 6
In a reaction system in which a catalyst such as sodium carbonate is added at 0° C. or higher, esterified wood chips with a high addition rate of 100% by weight or more can be obtained based on the wood chips. The reaction time is usually 5 minutes to 10 hours, preferably 10 minutes to 7 hours. The degree of esterification can be adjusted by controlling the reaction temperature and reaction time, and the reaction is carried out until a wood piece having a desired degree of esterification is obtained. After the reaction, depending on the type of laminate to be manufactured, one reaction product is washed with acetone, water, etc., and dried. The esterified wood pieces obtained by drying undergo a ring-opening esterification reaction between the hydroxyl groups in the wood and the polybasic acid anhydride, and the polybasic acid anhydride is added to the wood pieces, and carboxyl groups are added to the side chains. It is clear from the analysis results of infrared absorption spectra that this has been introduced. These esterified wood pieces are used as carboxyl group-containing esterified wood pieces used in the present invention. Further, as mentioned above, it is generally advantageous to use the reaction product as it is as the esterified wood pieces used in the present invention without washing the product. In this case, unreacted polybasic acid anhydride is present in the carboxyl group-containing esterified wood chips.
さて、本発明においては、まず上記の如ぐして調装され
たカルボキシル基含有エステル化木材小片、または未反
応多塩基酸無水物を含有してbるカルボキシル基含有エ
ステル化木材小片に分子中に2ヶ以上のエポキシ基を含
む化合物を混合するのである。エポキシ化合物としては
前記したビスフェノール型エポキシ化合物が好まし贋。Now, in the present invention, first, the carboxyl group-containing esterified wood pieces prepared as described above or the carboxyl group-containing esterified wood pieces containing unreacted polybasic acid anhydride are added to the carboxyl group-containing esterified wood pieces prepared as described above. Compounds containing two or more epoxy groups are mixed. As the epoxy compound, the above-mentioned bisphenol type epoxy compound is preferred.
分子量が大きくなれば硬化後南脂相の架橋密度が減少す
るので通常200〜2000程1度の平均分子量のもの
がよく、更には液状タイプのものが好ましい。As the molecular weight increases, the crosslinking density of the southern resin phase after curing decreases, so those having an average molecular weight of about 200 to 2,000 degrees are usually preferred, and liquid type ones are more preferable.
また場合によっては粘度を下げるためにモノエポキシ化
合物、例えば、フェニルグリシジルエーテル、スチレン
オキサイド、エピクロルヒドリン等を希釈剤として添加
してもよい。本発明の熱圧成形における硬化反応は触媒
なしで充分Cて進行するが、硬化反応を更にはやめるた
めに従来、エポキシ樹脂の多価カルボン酸や酸無水物硬
化において使用されている触媒、例えば、カルボン酸の
金属塩、三級アミン等を添加してもよい。得られた積層
板の機械的強度を更に向上させるためにガラス繊維を、
まだ、耐燃性を付与するだめに・・ロゲン含有化合物1
例えば、テトラブロムビスフェノールA1テトラクロル
ビスフエノールA1ヘキサクロルベンゼン等を、また、
着色剤として染料、顔料等を同時に添加してもよい。In some cases, a monoepoxy compound such as phenylglycidyl ether, styrene oxide, epichlorohydrin, etc. may be added as a diluent to lower the viscosity. The curing reaction in the hot press molding of the present invention proceeds with sufficient C without a catalyst, but in order to further stop the curing reaction, catalysts conventionally used in the curing of epoxy resins with polycarboxylic acids or acid anhydrides, such as , metal salts of carboxylic acids, tertiary amines, etc. may be added. In order to further improve the mechanical strength of the obtained laminate, glass fiber was added.
It is still necessary to impart flame resistance... Rogen-containing compound 1
For example, tetrabromobisphenol A1 tetrachlorbisphenol A1 hexachlorobenzene, etc.
Dyes, pigments, etc. may be added at the same time as coloring agents.
以上の如くして調製される混合物をプVングー、ニーダ
−、ミキシングロール等の混合機を用いて、更に均一に
混合する。本発明Vこおいて用いられるエステル化木材
小片は、前述の如く、活性なカルボキシル基を付してお
り、エポキシ化合物に対する親和性が良く、エポキシ化
合物と混合する場合に、エステル化木材小片とエポキシ
化合物が極めて効果的に分散し得るのである。そのため
、エステル化木材小片とエポキシ化合物の混合Fa率は
任意の混合比が選択できる。混合後、混合物を一定の粒
子に揃えることが好ましい。その後、該混合物を予備乾
1栗するか、またはしないで板状表面に散布する。混合
物の散布間は板状基材の材質、厚さ、および製造しよう
とする積層板の外観等によって異なる。積層板表面が平
、骨な化粧を、PJ−ようとする場合には混合物の散布
量はQ3kg/m2〜15kg/m”で充分であり、凹
凸模様を刻設する場合には1.51:!r/m2以−1
−の混合物を散布させることが好ましい。また加熱卯圧
後、混合物の硬化収縮応力により積層板にソリが生じる
場合(では、板状基材の裏面に、バランスのため紙に硬
化・11樹脂の液体を含浸させた含浸紙をあてがって、
加熱刀日圧により積IJ一体化させることで積層板のノ
リを防ぐことができる。その他、板状基材の裏面に、本
発明Qて朴いて使用する混合物、或は、硬化性樹脂の液
体を噴霧塗布した木材小片を施して、加熱加圧により積
層一体化させることで積層板のソリを防ぐこともできる
。次いで、板状基材表面に散布された混合物の上に平滑
な境面板、または凹凸模様を有するエンボス板をあてが
って、 P)T要時間、加熱加圧を行なうのである。ま
たこの際、場合によっては上記の混合物の上に化粧シー
トを積層しておいてもよい。加熱加圧条件は積層板の種
類によって適宜設定されるが通常100〜250℃の温
度、1、0 kg/crrr2.Id上の圧力で行なう
。混合物は、温度が高くなるに従って前記のエステル化
反応が進行−するのである。The mixture prepared as described above is further uniformly mixed using a mixer such as a vacuum cleaner, a kneader, or a mixing roll. As mentioned above, the esterified wood chips used in the present invention V have an active carboxyl group and have a good affinity for epoxy compounds. The compounds can be dispersed very effectively. Therefore, any desired mixing ratio can be selected for the mixing ratio of the esterified wood chips and the epoxy compound. After mixing, it is preferable to form the mixture into uniform particles. Thereafter, the mixture is sprinkled on the plate surface with or without pre-drying. The time period during which the mixture is spread varies depending on the material and thickness of the plate-like substrate, the appearance of the laminate to be manufactured, and other factors. When the surface of the laminate is flat and has a textured surface, it is sufficient to spread the mixture at a rate of Q3kg/m2 to 15kg/m2, and when carving an uneven pattern, 1.51: !r/m2 or more -1
It is preferable to spray a mixture of -. In addition, if warpage occurs in the laminate due to the curing and shrinkage stress of the mixture after heating and pressing (in this case, apply impregnated paper made by impregnating paper with a liquid of curing resin No. 11 for balance purposes) on the back side of the plate-shaped base material. ,
By integrating the laminated IJ using heating and pressure, it is possible to prevent the laminated board from sticking. In addition, a laminate can be obtained by applying a mixture of the present invention Q or a small piece of wood spray-coated with a curable resin liquid to the back side of a plate-shaped base material and laminating them together by heating and pressing. It can also prevent warping. Next, a smooth interface plate or an embossed plate having an uneven pattern is placed on top of the mixture sprinkled on the surface of the plate-shaped substrate, and heat and pressure are applied for the required time. Further, at this time, a decorative sheet may be laminated on the above mixture depending on the case. The heating and pressing conditions are appropriately set depending on the type of laminate, but are usually a temperature of 100 to 250°C and a pressure of 1.0 kg/crrr2. Perform with pressure above Id. As the temperature of the mixture increases, the aforementioned esterification reaction proceeds.
前述の如く、本発明の製法により得られた積層&+dエ
ステル化木材小片中のカルボキシル基トエポキシ化合物
中のエポキシ基が付加エステル化反応を起j〜でエステ
ル化木材小片が架橋結合されてAる。また、未反応多塩
基酸無水物が存在し、かつ、板状基材として木質系基材
を使用する場合には、その表層部の木材中の水酸基が未
反応多塩基酸無水物中の無水酸基と開環エステル化反応
を起し、これによって生じた側鎖のカルボキシル基にエ
ポキシ化合物中のエポキシ基が付加エステル化反応を起
して木質系基材の表面は多塩基e無水物とエポキシ化合
物を介してエステル化木材小片と架橋結合されている。As mentioned above, the epoxy groups in the carboxyl-to-epoxy compound in the laminated &+d esterified wood pieces obtained by the production method of the present invention undergo an addition esterification reaction, and the esterified wood pieces are cross-linked to form A. In addition, if unreacted polybasic acid anhydride exists and a wood base material is used as the plate-like base material, the hydroxyl groups in the wood in the surface layer may A ring-opening esterification reaction occurs with the hydroxyl group, and the epoxy group in the epoxy compound causes an addition esterification reaction with the carboxyl group of the side chain, and the surface of the wood base material is formed between the polybasic anhydride and the epoxy group. It is cross-linked with esterified wood chips through a compound.
即ち、エステル化木材小片間、およびエステル化木材小
片と木質系基材間は化学的に非常に強固な結合力で一体
化されている。That is, the esterified wood pieces and the esterified wood pieces and the wood base material are chemically integrated with very strong bonding force.
そのため、本発明の製法により得られた積層板は表面が
強靭で硬く、耐熱性、耐R■耗性等において優れたもの
である。Therefore, the laminate obtained by the manufacturing method of the present invention has a tough and hard surface, and is excellent in heat resistance, R wear resistance, etc.
また、板状基材として木質系基材を使用した場合には、
積ノー板の製造において、木質系基材表面に接着剤を施
す必要はない。In addition, when a wood base material is used as the plate-like base material,
In the production of laminated boards, there is no need to apply adhesive to the surface of the wood base material.
また、本発明の製法により得られた積、”ψa板は、混
合物の組成によっては驚くべきことに、木材小片が可塑
化されており、表面が緻密性を有し、光沢のあるグラス
チック様の外観を呈するものである。これは化粧材とし
て好適な材料となり得るものである。In addition, the product "ψa board" obtained by the manufacturing method of the present invention surprisingly has plasticized wood pieces depending on the composition of the mixture, has a dense surface, and has a glossy glass-like appearance. This material can be used as a decorative material.
また、本発明の製法により得られた積層板はその原料と
して多量の木材小片を使用することができるので価格が
安く、軽くて、加工性に優れている。Furthermore, since the laminate obtained by the manufacturing method of the present invention can use a large amount of wood chips as its raw material, it is inexpensive, lightweight, and has excellent workability.
従って、本発明の製法により得られた積層板は床材、壁
材等の建築用材料および家具用化粧材料として好適であ
る。Therefore, the laminate obtained by the production method of the present invention is suitable as architectural materials such as flooring materials and wall materials, and decorative materials for furniture.
次に本発明を実施例および参考例により更に具体的に説
明するが、これらに使用される乾燥木粉というのは乾燥
木粉、乾燥チップおよび乾燥ファイバーというのは木材
小片の含水率を5%以下に乾燥したものをいう。なお、
本発明は実施例に制限されるものではないことは勿論で
ある。Next, the present invention will be explained in more detail with reference to Examples and Reference Examples. The following refers to the dried product. In addition,
It goes without saying that the present invention is not limited to the examples.
僑考例1
厚さ]、5FJII、大きさ6 cm X 66rnの
レッドラワン材の単板2枚を水洗浄、更にアセトン洗浄
した後、熱風乾燥器で乾燥してそれぞれ絶乾重量をめ、
次にこれら単板表面の中央3L:rn四方のところに、
一方の単板には無水マレイン酸を、他方の単板には無水
コハク酸をそれぞれ2.OF散布した後、こ(1句
れら単板の表裏に鏡面板をあてがい、プレス機の熱板間
に挿入して熱圧成形を行なった。熱圧条件は温度170
℃、圧力80 kg/cm”の条件に合わせて40分間
加熱加圧した。熱圧成形後、これら2枚の単板をアセト
ンで充分に洗浄した後、熱風乾燥器で乾燥してそれぞれ
絶乾重量をめた。各単板中の水酸基と無水酸基がエステ
ル1ヒ反応を起して結合された無水マレイン酸および無
水コハク酸の付加率はそれぞれ乾燥単板を基準として無
水マレイン酸が14.2重−陰係、無水コハク酸が18
.8重量%であった。Example 1 Thickness], 5FJII, size 6cm x 66rn, two veneers of red lauan wood were washed with water and further washed with acetone, then dried in a hot air dryer and weighed on their absolute dry weight.
Next, at the center 3L:rn square of these veneer surfaces,
One veneer was treated with 2.0% maleic anhydride, and the other veneer was treated with 2.0% succinic anhydride. After spraying OF, a mirror plate was applied to the front and back of each veneer, and the plate was inserted between the hot plates of a press machine to perform hot press forming.The hot press condition was a temperature of 170℃.
℃ and a pressure of 80 kg/cm" for 40 minutes. After hot-pressing, these two veneers were thoroughly washed with acetone, and then dried in a hot air dryer until completely dry. The weight was calculated.The addition rate of maleic anhydride and succinic anhydride, in which the hydroxyl groups and anhydride groups in each veneer were bonded by causing an ester reaction, was 14.5% for maleic anhydride, based on the dry veneer. Double negative relationship, succinic anhydride is 18
.. It was 8% by weight.
これらエステル化単板は木材中の水酸基がジカルボン酸
無水物と開環エステル化反応を起して。These esterified veneers are produced by a ring-opening esterification reaction between hydroxyl groups in the wood and dicarboxylic acid anhydride.
木材中にジカルボン酸無水物が付加され、1則鎖にカル
ボキシル基が導入されていることが赤外線吸収スペクト
ルの分析結果より明白であった。It was clear from the infrared absorption spectrum analysis results that dicarboxylic acid anhydride was added to the wood and carboxyl groups were introduced into the monocyclic chain.
参考例2
24メツンユ篩を通過した赤松材の乾燥本粉2(30,
OF、無水コハク酸/I5.Oy、触媒として炭酸ナト
リウム090yを4を三つロセバラブル(シ0
フラスコに添加して140℃で6時間攪拌下に反応せし
めた。この反応系において、木粉に対する無水コハク酸
の仕込み量は木粉を基準として173[wt%である。Reference example 2 Dry main powder of red pine wood that passed through a 24-meter sieve 2 (30,
OF, succinic anhydride/I5. Oy, sodium carbonate 090y as a catalyst was added to a flask and allowed to react at 140°C for 6 hours with stirring. It is 173 [wt%] based on the standard.
反応後5反応生成物を取り出し、洗浄処理することなく
該反応生成物を本発明において使用するエステル化木材
小片として用いた。After the reaction, the reaction product was taken out and used as the esterified wood pieces used in the present invention without washing.
このエステル化木粉中の木粉に付加された無水コ・・り
酸の付加率は不朽を基準として14.3重量%であった
。このエステル化本粉は木材中の水酸基が無水コハク酸
と開環エステル化反応を起して、木粉に無水コ・・り酸
が付加され、側鎖にカルボキシル基が導入されているこ
とが赤外線吸収スペクトルの分析結果より明白であった
。The addition rate of co-phosphoric anhydride added to the wood flour in this esterified wood flour was 14.3% by weight based on immortality. In this esterified wood flour, the hydroxyl groups in the wood undergo a ring-opening esterification reaction with succinic anhydride, resulting in the addition of co-phosphoric anhydride to the wood flour and the introduction of carboxyl groups into the side chains. It was more obvious from the analysis results of infrared absorption spectrum.
参考例、によって得られた−へチル化木粉149Yりに
、三井石油化学エポキシ(株)製EPOMIKR139
゜エホキシ当i1.80〜190のビスフェノールAの
ジグリシジルエーテルC以下、ビスフェノールAのジグ
リシジルエーテルと称す。)407Fを添加し、ミキシ
ングロールで均一に混合した。その後、該混合物を80
℃の熱風乾燥器で約1時間乾燥した後、所定の成形用金
型の中に均等にフォーミングしだ。次にこの金型をプレ
ス機の熱板間に挿入して熱圧成形を行なった。熱圧成形
条件は金型挿入直後温度1.50℃、圧力51JE/m
”で10分間加熱加圧した後、更に温度190℃、圧
力15OJrV論2の条件で40分間加熱加圧した。な
お脱気は熱圧初期の段階で行なった。熱圧成形後金型か
ら成形板を取シ出し、厚さa 6 rmの木質系成形板
を得た。この木質系成形&は、木粉混入率が670重量
重量比重が1.34であり、A、S、TM試1倹方法に
準じて物性試験した結果、曲げ強さ706 kg/cm
2.引張り強さ306 kg/cm”、圧縮強す、 1
558 kg、/cm2と強靭で、ロックウェル硬度(
Mスケール)が110と硬く、熱変形温度(荷重18、
6 kf/lJ ) 109℃と耐熱性に優れ、吸水率
L06%厚さ膨張率0.91%と耐水性VC1fれたも
のであった。-Hethylated wood flour 149Y obtained by reference example, EPOMIKR139 manufactured by Mitsui Petrochemical Epoxy Co., Ltd.
Diglycidyl ether of bisphenol A with an i of 1.80 to 190 per ethoxy C. Hereinafter, it will be referred to as diglycidyl ether of bisphenol A. ) 407F was added and mixed uniformly with a mixing roll. Thereafter, the mixture was mixed at 80%
After drying in a hot air dryer at ℃ for about 1 hour, it was evenly formed into a specified mold. Next, this mold was inserted between hot plates of a press machine and hot-press molding was performed. Hot press molding conditions are temperature 1.50℃ and pressure 51JE/m immediately after inserting the mold.
After heating and pressurizing for 10 minutes at a temperature of 190°C and a pressure of 15OJrV for 40 minutes under the conditions of theory 2.Deaeration was performed at the initial stage of hot pressing.After hot-pressing, molding was performed from the mold. The board was taken out to obtain a wood-based molded board with a thickness of 6 rm.This wood-based molded board had a wood powder content of 670, a weight-to-weight specific gravity of 1.34, and A, S, TM test 1. The bending strength was 706 kg/cm as a result of a physical property test according to the thrift method.
2. Tensile strength 306 kg/cm”, compressive strength, 1
It is strong at 558 kg/cm2 and has a Rockwell hardness (
M scale) is hard with 110, heat distortion temperature (load 18,
6 kf/lJ) It had excellent heat resistance at 109°C, water absorption rate L06%, thickness expansion rate 0.91%, and water resistance VC1f.
実施例1
・参考例2によって得られたエステル化木粉1193y
にビスフェノールAのジグリシジルエーテル・107F
を添加し、ミキシングロールで均一に混合した。その後
、該混合物を80℃の熱風乾燥器で約1時間乾燥した後
、該混合物を厚さ367法のラワン材中芯単板の表面に
、散布量13 kg7m2で、均等にフォーミングした
。なお、中芯単板の裏面には接着剤として厚さ20ミク
ロンのポリプロピレンフィルムを介して厚さQ、 9
ZIJのラワン材裏単板をあらかじめあてがった。Example 1 Esterified wood flour 1193y obtained by Reference Example 2
Bisphenol A diglycidyl ether/107F
was added and mixed uniformly with a mixing roll. Thereafter, the mixture was dried in a hot air dryer at 80° C. for about 1 hour, and then the mixture was evenly formed onto the surface of a 367-thick lauan core veneer at a spraying amount of 13 kg 7 m 2 . In addition, a polypropylene film with a thickness of 20 microns is attached to the back side of the core veneer to a thickness of Q, 9 as an adhesive.
I applied ZIJ's lauan wood backing veneer in advance.
次に上記積層物の表裏に鏡面板をあてがい、プレス機の
熱板間(で挿入して熱圧成形を行なった。Next, mirror plates were applied to the front and back sides of the laminate, and the plates were inserted between the hot plates of a press to perform hot-press molding.
熱圧条件は、挿入時、温度150℃、圧力5 kg/c
m2で10分間加熱加圧した後、更に温度170℃、圧
力801【g−/crn2の条件に合わせて70分間加
熱刀日圧した。なお、脱気は熱圧初期の段階で行なった
。The heat and pressure conditions were: temperature 150℃ and pressure 5kg/c during insertion.
After heating and pressurizing for 10 minutes at a temperature of 170° C. and a pressure of 801 g/crn2, the sample was heated and pressurized for 70 minutes. Note that deaeration was performed at the initial stage of hot pressure.
熱圧成形後、得られた本発明の積層板は表面が強靭で硬
く、緻密性を有し、光沢のあるプラスチック様の外観を
里するものであった。After thermoforming, the obtained laminate of the present invention had a tough, hard, and dense surface, and had a shiny, plastic-like appearance.
参考例4
24メツシユ篩を通過した赤ラワン材の乾燥木粉]、1
5.0y、無水マレイン酸15.1y、触媒として炭酸
ナトリウム03yを2を三つロセパラプルフラスコに添
加して、1/lO℃で6時間攪拌下に反応せしめた。こ
の反応系において、木粉に対する無水マレイン酸の仕込
み量は木粉を基準として1i1重It%である。反応後
、反応生成物を取り出し、洗浄処理することなく該反応
生成物を本発明において使用するエステル化木材小片と
して用いた。このエステル化木粉中の木粉に付加された
無水マレイン酸の付加率は木粉を基準として78−車量
係であった。Reference Example 4 Dry wood flour of red lauan wood passed through 24 mesh sieves], 1
5.0 y, maleic anhydride 15.1 y, and 2 y of sodium carbonate as a catalyst were added to a separate parapet flask and allowed to react at 1/lO<0>C for 6 hours with stirring. In this reaction system, the amount of maleic anhydride added to the wood flour is 11% by weight based on the wood flour. After the reaction, the reaction product was taken out and used as the esterified wood pieces used in the present invention without washing. The addition rate of maleic anhydride added to the wood flour in this esterified wood flour was 78-car weight based on the wood flour.
実施例2
参考1fli 4によって得られたエステル化木粉13
04yにグリセリンジグリシジルエーテル(日本油脂(
株)#エピオールa −1,00) 23.2 yを添
加した後εキシングロールで均一に混合した。その後備
混合物を80℃の熱風乾燥器で約30分間乾燥した後、
該混合物を厚さ4鵡のラワン合板の表面に、散布量L
4 cg/m2で均等にフォーミングした。Example 2 Esterified wood flour 13 obtained by Reference 1fli 4
Glycerin diglycidyl ether (NOF (
Co., Ltd.) #Epiol a -1,00) 23.2 After adding y, it was mixed uniformly with an ε kissing roll. After drying the preliminary mixture in a hot air dryer at 80°C for about 30 minutes,
Spray the mixture on the surface of lauan plywood with a thickness of 4 mm at an amount L.
Foaming was performed evenly at 4 cg/m2.
なお、合板7)裏面には紙i量5577m のクラフト
紙にメラミン樹脂を含浸させた含浸紙をあらかじめあて
がった。次に上記積層物の表裏に鏡面板をあてがい、プ
レス機の熱板間に挿入して熱圧成形を行なった。熱圧条
件は挿入時、温度150℃、圧力5 kν箱 で10分
間加熱加圧した後、更に温度170℃、圧力80 kg
/cm2の条件に合わせて50分間υn熱加圧した。な
お、脱気は熱圧初期の段階で行なった。熱圧成形後、得
られた本発明の積層板は表面が強靭で硬く緻密性を有し
、光沢のあるプラスチック様の外観を呈するものであっ
た。Note that impregnated paper, which is made by impregnating melamine resin with kraft paper having a paper weight of 5577 m 2 , was applied to the back side of the plywood 7) in advance. Next, mirror plates were placed on the front and back sides of the laminate, and the laminate was inserted between the hot plates of a press to perform hot-press molding. The heat and pressure conditions were as follows: during insertion, after heating and pressurizing for 10 minutes at a temperature of 150°C and a pressure of 5 kν box, the temperature was further increased to 170°C and a pressure of 80 kg.
/cm2 for 50 minutes under heat and pressure. Note that deaeration was performed at the initial stage of hot pressure. After hot-press molding, the obtained laminate of the present invention had a tough, hard and dense surface, and had a shiny plastic-like appearance.
参考例5
24メツシユ篩を通過したラジアタパイン材の乾燥木粉
115.0y、無水マレイン酸2L2j!。Reference Example 5 115.0y of dry radiata pine wood powder passed through a 24-mesh sieve, 2L of maleic anhydride and 2j! .
触媒として炭酸ナトリウム042yを2を三つロセパラ
ブルフラスコに添加して140℃で6時間攪拌下に反応
せしめた。この反応系において、木粉に対する無水マレ
イン酸の仕込み量は木粉を基準として184m−1i−
%である。反応後、反応生成物を取り出し、洗浄処理す
ることなく該反応生成物を本発明において使用するエス
テル化木材小片として用いた。このエステル化木粉中の
木粉に付加された無水マレイン酸の付加率)は木粉を基
準と17で144重量係であった。Three portions of sodium carbonate 042y as a catalyst were added to a separable flask and reacted at 140° C. for 6 hours with stirring. In this reaction system, the amount of maleic anhydride charged to wood flour was 184 m-1i- based on wood flour.
%. After the reaction, the reaction product was taken out and used as the esterified wood pieces used in the present invention without washing. The addition rate of maleic anhydride added to the wood flour in this esterified wood flour was 17 and 144 by weight based on the wood flour.
実施例3
参考例5によって得られたエステル化本粉1457PK
ビスフエノールAのジグリシジルエーテル42、7 F
を添加し、ミキシングロールで均一に混合した。その後
、該混合物を80℃の熱風乾燥器で約30分間乾燥した
後、該混合物をJ享さ75fIJlのパーティクルボー
ドの表面に、散布!t 2.8 kfm2で、均等にフ
ォーミングした。次にその表面から凹凸模様を有するエ
ンボス板をあてがい、プレス機の熱板間に挿入゛して熱
圧成形を行なった。熱圧条件は、挿入時、温度150℃
、圧力5 kg/ryn2で10分間加熱加圧した後、
次に温度]70℃、圧力100 kg/cm2の条件に
合わせて70分間加熱加圧した。なお、脱気は熱圧初期
の段階で行なった。Example 3 Esterified main powder 1457PK obtained according to Reference Example 5
Diglycidyl ether of bisphenol A 42,7 F
was added and mixed uniformly with a mixing roll. After that, the mixture was dried in a hot air dryer at 80°C for about 30 minutes, and then the mixture was sprinkled on the surface of a 75cm particle board. It was evenly formed at t 2.8 kfm2. Next, an embossed plate having an uneven pattern was applied to the surface of the plate, and the plate was inserted between the hot plates of a press to perform hot-press molding. The heat and pressure conditions are 150℃ during insertion.
, after heating and pressurizing at a pressure of 5 kg/ryn2 for 10 minutes,
Next, the mixture was heated and pressurized for 70 minutes at a temperature of 70° C. and a pressure of 100 kg/cm 2 . Note that deaeration was performed at the initial stage of hot pressure.
熱圧成形後、得られた本発明の積層板は表面が強靭で硬
く、緻密性を有し、立体感のある化粧性の浸れたもので
あった。After hot-press molding, the obtained laminate of the present invention had a tough, hard surface, denseness, and a three-dimensional decorative appearance.
参考例6
24メノンユ篩を通過した赤松材の乾燥木粉190、O
y1無水コハク酸95. Of @媒として炭酸ナトリ
ウム4.00yを4を三つロセパラブルフラスコに添加
して、120℃で25分間撹拌下(て反応せしめた。反
応後、反応生成物を取り出し、ソックスレー抽出器を用
−でアセトンで洗浄処理した後、次に水で洗浄処理した
。その後、熱風乾媚器で乾燥したものを本発明において
使用するエステル化木材小片として用いた。このエステ
ル化木粉中の木粉に付加された無水ニー・り酸の付加率
は木粉を基準として183重縫係であった。Reference Example 6 Dry wood powder of red pine wood passed through 24 Menonyu sieve 190,0
y1 Succinic anhydride95. 4.00y of sodium carbonate as a medium was added to a separable flask and reacted at 120°C for 25 minutes with stirring.After the reaction, the reaction product was taken out and extracted using a Soxhlet extractor. - After washing with acetone and then washing with water, the pieces were dried in a hot air dryer and used as the esterified wood pieces used in the present invention. The addition rate of anhydrous phosphoric acid was 183 times the weight of wood flour.
実施例4
参考例6によって得られたエステル化木粉152.97
にビスフェノールAのジグリンジルエーテル’l :3
7 Fと触媒としてジメチルベンジルアεン022yを
硝加した後、ミキシングロール−c均一に混合した。一
方、厚さ6.0 WJの石綿セメント板の表面に溶剤型
ポリウレタン系接着剤を塗布量25 y/m 塗布した
後、熱風乾燥器で溶剤を揮散させた。次に接着剤が塗布
された石綿セメント板の表面に、上記の混合物を散布量
321ζv/m で均等にフォーミングした。Example 4 Esterified wood flour obtained according to Reference Example 6 152.97
Digrindyl ether of bisphenol A: 3
After adding 7 F and dimethylbenzylane 022y as a catalyst, they were uniformly mixed using a mixing roll-c. On the other hand, a solvent-based polyurethane adhesive was applied to the surface of an asbestos cement board having a thickness of 6.0 WJ at a coating amount of 25 y/m, and then the solvent was evaporated using a hot air dryer. Next, the above mixture was evenly formed on the surface of the asbestos cement board coated with the adhesive at a spray rate of 321ζv/m 2 .
次にその表面から凹凸模様を有するエンボス板を、ちて
が論、プVス機の熱板間に挿入して熱圧成彩を行なった
。熱圧条件は、挿入時、@度150℃、圧力51【v鴨
で10分間加熱加圧した後、次に温度170℃、圧力
100にν扇の条件に合わせて70分間加熱加圧した。Next, an embossed plate having an uneven pattern on its surface was inserted between the hot plates of a press machine to perform hot pressure coloring. The heat and pressure conditions were as follows: upon insertion, the tube was heated and pressurized for 10 minutes at a temperature of 150° C. and a pressure of 51 [v], and then heated and pressurized for 70 minutes at a temperature of 170° C. and a pressure of 100 for 70 minutes.
なお、脱気は熱圧初期の段階で行なった。熱圧成形後、
得られた本発明の積層板は表面が強靭で硬く緻密性を有
し、立体感のある化糀性の優れたものであった。Note that deaeration was performed at the initial stage of hot pressure. After hot press molding,
The obtained laminate of the present invention had a tough, hard and dense surface, and had a three-dimensional effect and excellent hardening properties.
参考fl17
2・1メツシユ篩を通過した赤松材の乾燥木粉190、
OF、無水フタル酸285.0 P 1触媒として炭酸
ナトリウム4.00 yを4を三つロセパラブルフラス
コに添加して、140℃で2時間攪拌下に反応せしめた
。反応後、反応生成物を取シ出し、ソックスレー抽出器
を用いてアセトンで洗浄処理した債、次に水で洗浄処理
した。その後、熱風乾燥器で乾燥し泥ものを本発明にお
いて使用するエステル化木材小片として用いた。このエ
ステル化木粉中の木粉に付加された無水フタル酸の付加
率は木粉を基準として269重量−であった。Reference fl17 2.1 Dry wood powder of red pine wood passed through mesh sieve 190,
OF, phthalic anhydride 285.0 P 1 4.00 y of sodium carbonate as a catalyst were added to a separable flask and reacted at 140° C. for 2 hours with stirring. After the reaction, the reaction product was taken out, washed with acetone using a Soxhlet extractor, and then washed with water. Thereafter, the slurry was dried in a hot air dryer and used as the esterified wood pieces used in the present invention. The addition rate of phthalic anhydride added to the wood flour in this esterified wood flour was 269% by weight based on the wood flour.
実施例5
参考例7によって得られたエステル化木粉15061に
ビスフェノールAのジグリシジルエーテル399yを添
加した後、ミキシングロールで均一に混合した。一方、
厚さ6..2 +173のファイバーボードの表面に溶
剤型ポリウレタン系シーラーを塗布量20y/m2塗布
して、ファイバーボードの表層部に含浸させた後、熱風
乾燥器で溶剤を揮散させた。次にシーラーが塗布された
ファイバーボードの表面に、上記の混合物を散布量12
kg/m で均った。熱圧条件は、挿入時、温度15
0℃、圧力5 kvcrn2で10分間加熱加圧した後
、次に温度170℃、圧力801:g/1yn2の条件
に合わせて80分間加熱加圧した。なお、脱気は熱圧初
期の段階で行なった。熱圧成形後、得られた本発明の積
層板は表面が強靭で硬く、緻密性を有し、光沢のあるプ
ラスチック様の外観を呈するものであった。Example 5 Diglycidyl ether of bisphenol A 399y was added to the esterified wood flour 15061 obtained in Reference Example 7, and then mixed uniformly with a mixing roll. on the other hand,
Thickness 6. .. A solvent-based polyurethane sealer was applied to the surface of the 2+173 fiberboard at a coating amount of 20 y/m2 to impregnate the surface layer of the fiberboard, and then the solvent was evaporated using a hot air dryer. Next, sprinkle the above mixture on the fiberboard surface coated with the sealer in an amount of 12
It was leveled at kg/m2. The heat and pressure conditions are temperature 15 during insertion.
After heating and pressurizing for 10 minutes at 0° C. and a pressure of 5 kvcrn2, heating and pressurizing was performed for 80 minutes under the conditions of a temperature of 170° C. and a pressure of 801 g/1yn2. Note that deaeration was performed at the initial stage of hot pressure. After hot-press molding, the obtained laminate of the present invention had a tough, hard surface, denseness, and a shiny plastic-like appearance.
参考例8
パーティクルボードの原料として使用される赤ラワン材
の乾燥チップ130.OF、無水フタル酸35、 ]、
7 、触媒として炭酸ナトリウム0.691を2を三
つロセパラプルフラスコ((添加して、160℃で6時
間撹拌下に反応せしめた。この反応系におりで、チップ
に対する無水フタル酸の仕込み量はチップを基準として
270重量係である。反応後、反応生成物を取り出し、
洗浄処理することなく該反応生成物を本発明において使
用するエステル化木材小片として用いた。このエステル
化チップ中のチップに付加された無水フタル酸の付加率
はチップを基準として1fi6重量係であった。Reference Example 8 Dried chips of red lauan wood used as a raw material for particle board 130. OF, phthalic anhydride 35, ],
7. 0.691 ml of sodium carbonate as a catalyst was added to a separate parapet flask ((() and reacted at 160°C for 6 hours with stirring. Into this reaction system, phthalic anhydride was charged to the chips. The amount is 270% by weight based on the chip.After the reaction, the reaction product is taken out,
The reaction product was used as the esterified wood chips used in the present invention without any washing treatment. The addition rate of phthalic anhydride added to the chips in this esterified chip was 1fi6 weight ratio based on the chips.
実施例6
参考例8によって得られたエステル化チップ71、7
yに、ビスフェノールAのジグリシジルエーテル232
yをtli加し、ニーグーで均一に混合した。その後、
該混合物を90℃の熱風乾燥器で約1時間転・操した後
、該混合物を厚さ55止の合板の表面に、散布量L 3
kp/m2で均等にフォーミングした。次にその表面
から境面板をあてがい、プレス機の熱板間に挿入し7て
熱圧成形を行なった。Example 6 Esterified chips 71, 7 obtained according to Reference Example 8
y, diglycidyl ether of bisphenol A 232
y was added to the mixture and mixed uniformly using a niegu. after that,
After rolling and operating the mixture in a hot air dryer at 90°C for about 1 hour, the mixture was applied to the surface of a 55 mm thick plywood board in an amount of L 3.
Forming was performed evenly at kp/m2. Next, a boundary plate was applied from the surface, and the material was inserted between the hot plates of a press 7 to perform hot-press molding.
熱圧条件は、挿入時、温度1.50℃、圧力5 kg、
/Jで10分間加熱加圧した後、更に温度170℃、圧
力80 kg/cm の条件に合わせて80分間加熱加
圧した。なお、脱気は熱圧初期の段階で行なった。The heat and pressure conditions were: temperature 1.50°C, pressure 5 kg during insertion,
/J for 10 minutes, and then further heated and pressurized for 80 minutes under the conditions of a temperature of 170°C and a pressure of 80 kg/cm 2 . Note that deaeration was performed at the initial stage of hot pressure.
熱圧成形後、得られた本発明の積層板は表面が強靭で硬
く緻密性を有し平滑であった。After thermoforming, the obtained laminate of the present invention had a tough, hard, dense, and smooth surface.
参考例9
通常の乾式ファイバーボードの製造方法に準じて、杉、
噌混材チップをダイジェスタ−に挿入して蒸気圧81(
g、/crn2、蒸煮時間1分間の条件下で蒸煮した後
、リファイナーで解繊させることにより湿温状態のファ
イバーを得た。このファイバーヲ温度90℃の熱風乾燥
器で含水率5%以下に乾燥した。次に、13メツシユ篩
を通過した杉、檜混材の乾燥ファイバー11.5.0
fl 、無水フタル酸194y1触媒として炭酸す)
l)ラム0391!を2を三つロセパラプルフラスコに
添加して、160℃で6時間攪拌下に反応せしめた。こ
の反応系におシ。Reference Example 9 According to the normal manufacturing method of dry fiberboard, cedar,
Insert the mixed material chip into the digester and increase the vapor pressure to 81 (
After steaming under the conditions of g, /crn2 and a steaming time of 1 minute, fibers in a humid temperature state were obtained by defibrating with a refiner. This fiber was dried in a hot air dryer at a temperature of 90° C. to a moisture content of 5% or less. Next, dry fibers of cedar and cypress mixed materials passed through a 13-mesh sieve 11.5.0
fl, carbonic acid as phthalic anhydride 194y1 catalyst)
l) Ram 0391! 2 were added to a rosette paraple flask and reacted at 160° C. for 6 hours with stirring. In this reaction system.
て、ファイバーに対する無水フタル酸の仕込み量はファ
イバーを基準として169重量%である。The amount of phthalic anhydride added to the fiber was 169% by weight based on the fiber.
反応後、反応生成物を取り出し、洗浄処理することなく
該反応生成物を本発明において使用するエステル化木材
小片として用いた。このエステル化ファイバー中のファ
イバーに付加された無水フタル酸の付加率1/、tファ
イバーを基準として11.7重陣係であった。 、
実施例7
参考例9によって得られたエステル化ファイバー120
.0yに、ビスフェノールAのジグリシジルエーテル2
6.5 F 全添加し、ミキシングロールで均一に混合
した。その陵、該混合物を90℃の熱風乾・檗器で約1
時間転葉した復、該混合物を厚さ55・」の合板の表面
に、散布量2.81ζg/m2で、均等にフォーミング
した。次にその表面から凹凸模様を有するエンボス板を
あてがい、プレス機の熱板間に挿入して熱圧成形を行な
った。熱圧条件は挿入時、温度150℃、圧力5 ky
論2で10分間加熱加圧した後、次に温度170℃、圧
力100に5c/cm2の条件に合わせて80分間加熱
加圧した。After the reaction, the reaction product was taken out and used as the esterified wood pieces used in the present invention without washing. The addition ratio of phthalic anhydride added to the fiber in this esterified fiber was 1/1, which was 11.7 layers based on the t-fiber. , Example 7 Esterified fiber 120 obtained according to Reference Example 9
.. 0y, diglycidyl ether of bisphenol A 2
6.5 F was completely added and mixed uniformly with a mixing roll. Then, dry the mixture with hot air at 90°C and dry it in a mortar for about 1 hour.
After the leaves had turned over for a while, the mixture was evenly formed on the surface of a 55" thick plywood board at a spraying rate of 2.81ζg/m2. Next, an embossed plate having a concavo-convex pattern was placed on the surface of the plate, and the plate was inserted between the hot plates of a press to perform hot-press molding. The heat and pressure conditions during insertion were a temperature of 150°C and a pressure of 5 ky.
After heating and pressurizing for 10 minutes in Theory 2, heating and pressurizing was then performed for 80 minutes at a temperature of 170° C. and a pressure of 100 and 5 c/cm 2 .
なお、脱気は熱圧初期の段階で行なった。熱圧成形後、
得られた本発明の積層板は表面が強靭で硬く、緻密性を
有し、立体感のある化粧性の優れたものであった。Note that deaeration was performed at the initial stage of hot pressure. After hot press molding,
The obtained laminate of the present invention had a tough, hard surface, denseness, and excellent cosmetic properties with a three-dimensional effect.
特許出願人 大倉工業株式会社 代理人 小川−美Patent applicant: Okura Industries Co., Ltd. Agent: Mi Ogawa
Claims (2)
られるカルボキシル基含有エステル化木材小片、または
未反応多塩基酸無水物を含有しているカルボキシル基含
有エステル化木材小片に、分子中に2ヶ以上のエポキシ
基を含む化合物を添加して、これらを充分に混合して得
られた混合物を板状基材表面に散布し1次いでこれを加
熱加圧して一体に成形せしめることを特徴とする積ノー
板の製法。(1) A carboxyl group-containing esterified wood piece obtained by reacting a polybasic acid anhydride with a hydroxyl group in wood, or a carboxyl group-containing esterified wood piece containing an unreacted polybasic acid anhydride, has molecules. A compound containing two or more epoxy groups is added thereto, and the resulting mixture is thoroughly mixed, and the resulting mixture is sprayed onto the surface of a plate-shaped base material, and then heated and pressurized to form an integral piece. The manufacturing method of the special board.
の範囲第1項記載の積層板の製法。(2) A method for manufacturing a laminate according to claim 1, wherein a wood base material is used as the plate-like base material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11712883A JPS609737A (en) | 1983-06-30 | 1983-06-30 | Manufacture of laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11712883A JPS609737A (en) | 1983-06-30 | 1983-06-30 | Manufacture of laminated board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS609737A true JPS609737A (en) | 1985-01-18 |
| JPS6249860B2 JPS6249860B2 (en) | 1987-10-21 |
Family
ID=14704130
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11712883A Granted JPS609737A (en) | 1983-06-30 | 1983-06-30 | Manufacture of laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS609737A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60192626A (en) * | 1984-03-14 | 1985-10-01 | 大建工業株式会社 | Manufacture of woody artificial board material |
| US5064592A (en) * | 1988-11-29 | 1991-11-12 | Okura Kogyo Kabushiki Kaisha | Process of producing surface hardened woody decorative sheets |
| JP2002284791A (en) * | 2001-03-23 | 2002-10-03 | National Institute Of Advanced Industrial & Technology | Polycarboxylic acid and epoxy resin composition |
| JP2006028528A (en) * | 2005-09-09 | 2006-02-02 | National Institute Of Advanced Industrial & Technology | Epoxy resin composition |
| WO2019097780A1 (en) * | 2017-11-14 | 2019-05-23 | パナソニックIpマネジメント株式会社 | Method for manufacturing wood composite board |
-
1983
- 1983-06-30 JP JP11712883A patent/JPS609737A/en active Granted
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60192626A (en) * | 1984-03-14 | 1985-10-01 | 大建工業株式会社 | Manufacture of woody artificial board material |
| US5064592A (en) * | 1988-11-29 | 1991-11-12 | Okura Kogyo Kabushiki Kaisha | Process of producing surface hardened woody decorative sheets |
| JP2002284791A (en) * | 2001-03-23 | 2002-10-03 | National Institute Of Advanced Industrial & Technology | Polycarboxylic acid and epoxy resin composition |
| JP2006028528A (en) * | 2005-09-09 | 2006-02-02 | National Institute Of Advanced Industrial & Technology | Epoxy resin composition |
| WO2019097780A1 (en) * | 2017-11-14 | 2019-05-23 | パナソニックIpマネジメント株式会社 | Method for manufacturing wood composite board |
| JP2019089249A (en) * | 2017-11-14 | 2019-06-13 | パナソニックIpマネジメント株式会社 | Manufacturing method of wood composite board |
| CN110914030A (en) * | 2017-11-14 | 2020-03-24 | 松下知识产权经营株式会社 | Method for making wood composite panels |
| EP3711914A4 (en) * | 2017-11-14 | 2021-01-13 | Panasonic Intellectual Property Management Co., Ltd. | PROCESS FOR MANUFACTURING A WOODEN COMPOSITE BOARD |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6249860B2 (en) | 1987-10-21 |
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