JPS61102049U - - Google Patents
Info
- Publication number
- JPS61102049U JPS61102049U JP1984187855U JP18785584U JPS61102049U JP S61102049 U JPS61102049 U JP S61102049U JP 1984187855 U JP1984187855 U JP 1984187855U JP 18785584 U JP18785584 U JP 18785584U JP S61102049 U JPS61102049 U JP S61102049U
- Authority
- JP
- Japan
- Prior art keywords
- mounting board
- semiconductor
- shape
- semiconductor devices
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984187855U JPH0311891Y2 (cs) | 1984-12-11 | 1984-12-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984187855U JPH0311891Y2 (cs) | 1984-12-11 | 1984-12-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61102049U true JPS61102049U (cs) | 1986-06-28 |
| JPH0311891Y2 JPH0311891Y2 (cs) | 1991-03-20 |
Family
ID=30745325
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984187855U Expired JPH0311891Y2 (cs) | 1984-12-11 | 1984-12-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0311891Y2 (cs) |
-
1984
- 1984-12-11 JP JP1984187855U patent/JPH0311891Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0311891Y2 (cs) | 1991-03-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS60118252U (ja) | 樹脂封止半導体装置用リ−ドフレ−ム | |
| JPS61102049U (cs) | ||
| JPS61102050U (cs) | ||
| JPS6413144U (cs) | ||
| JPS62134254U (cs) | ||
| JPH0353853U (cs) | ||
| JPS6192064U (cs) | ||
| JPH0268452U (cs) | ||
| JPS61182036U (cs) | ||
| JPS6166955U (cs) | ||
| JPS61111160U (cs) | ||
| JPS6170938U (cs) | ||
| JPS6247171U (cs) | ||
| JPS6127337U (ja) | 半導体装置用ヘツダ | |
| JPS6382948U (cs) | ||
| JPS5889946U (ja) | 半導体装置 | |
| JPS6274336U (cs) | ||
| JPS6073235U (ja) | 半導体装置 | |
| JPS60137435U (ja) | 半導体装置 | |
| JPS6289157U (cs) | ||
| JPH0330437U (cs) | ||
| JPS61114842U (cs) | ||
| JPS6413145U (cs) | ||
| JPH01104720U (cs) | ||
| JPH044767U (cs) |