JPS61102703A - Chip-shaped electronic component - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a chip-shaped electronic component such as a chip capacitor mounted on a printed wiring board, etc., and a method for manufacturing the same. Concerning the composition of the shrine.

(Prior Art) Conventionally, when forming electrodes of chip resistors, for example, a paste made of silver and palladium or a paste of silver and glass was used in a 1UA11I! A method of coating the electrode forming part of the end face of the I chip P1 and baking it to apply soldering and scratching, a method of fitting a metal cap to the end face of a cylindrical chip piece, a method of directly electroplating the ceramic chip IJ Since it is not possible to do so, there have been methods such as electroless plating and then solder plating to form electrodes.

[Problems to be Solved by the Invention] In the above-mentioned method, the method of applying a base plate using silver has the following problems. Since silver tends to form an alloy with FFJP and solder, it causes the so-called "clinging" phenomenon, which reduces the adhesive strength of the terminal (((((Reduced). Palladium is expensive and costs are high. Since abrasion firing of C or higher is required, the material of the resistive film is limited;
Carbon skin 112 resistance, metal skin II! ,! I+ (anti-4
C does not use 3. Next, one thorn of R. ;・
(Well, there is one piece of differential C, so there is one arrow f
i'i Technically speaking, I L < , L /, :
There is a problem of poor retention because it is time consuming and limits the production speed.Next, in the method using electroless metal 1, the contact strength of Biramink and Nut V skin 14+ is the same as the above-mentioned 2. There is a problem that it is low compared to , and its practicality is low.

For the main office, [rl? To decide,) 1 Emperor 1+
Using silver ＼゛) palladium, we also solved the problem of tJ/υ accumulation with silver in the same mouth 1, and added electricity to each one. , 1 piece 1v
Base on A・7. (This is an attempt to avoid the f-number of [+i]/lK property.

(FQ for solving problems) The present invention is based on a lumpy ceramic l, (with electric current at both ends of the body)
Leaving the ship-shaped acid part and resisting skin I19/! - by forming an etched surface by applying hydrofluoric acid treatment to the electrode forming part and a part of the 18J resistive film on this electrode forming part, and electroless nickel plating to this etched surface. , the laminated surface of the substrate with low conductivity and the resistive skin l1 following it.
9 in series with nickel, I7. +, , Fr plated layer to improve the electrical connection between the resistive film and the electrode forming part, and the ceramic surface and the two-sol electroless plated layer, which has a smooth surface due to glass 71 being deposited during firing. By sequentially forming a copper electroplating layer and a nickel electroplating layer, the lack of thickness and strength of the nickel electroless plating layer is compensated for, and the copper electroplating layer improves the bondability with the nickel electroplating layer. This is to measure the uniformity of the electrodeposition of one layer of =1' Tamatsu applied next. More light? The purpose is to process a large amount of substrates at the same time using S-stain plating and electroplating, and to improve productivity by eliminating the trouble of processing each fine chip-shaped substrate one by one.

[Effect]

In the present invention, a chip-shaped ramic substrate on which a resistive film is formed, on which no resistive film is formed, is treated with hydrofluoric acid on the laminate surface and a part of the resistive film to form an etched surface, and this etched surface is coated with nickel, nickel, etc. @4 Electrolytic plating is applied to improve the bond between the ceramic and nickel with the nickel electroless plating layer, and to ensure the connection between the nickel electroless plating layer and the resistive film, and the copper electroplating layer and the nickel electroplating layer. The thickness of the electrode and the strength of IU were changed, and the copper electrometal layer 1 was used to improve the uniformity and quality of the electrodeposition of nickel and hanger.

(Example) Example 1 An example of the structure of a cylindrical chip-shaped electronic component will be explained with reference to manufacturing process diagrams shown in FIGS. 1 to 8.

(1) A resistance film 2 made of a carbon film or the like is formed on the surface of a cylindrical chip-shaped ceramic substrate 1 except for both ends. (The longitudinal side view is shown in Fig. 1. Below, the distance between LD > (2) Resistance skin +1!,! The upper surface is covered with a synthetic resin masking film 3, leaving a slight portion on both ends of 2. 4, (Second
Figure) (:I) Substrate 1 not covered with masking film 3
Hydrofluoric acid treatment is applied to the electrode forming portion 4 consisting of both sides and the peripheral surface of the end, and a part of the resistive film 2. Through this hydrofluoric acid treatment,
The glass 71 deposited on the etched surface of the substrate 1 during firing I1.1 is removed and becomes the etched surface 5. In addition, a portion of the resistor film 1lt22 that is not covered with the masking film 3 becomes an etched surface 5, which makes it easy for the plated metal to bond. (Fig. 3) 4) Part of the resistive film 2, including the seven electrode formation areas 4, is treated with palladium chloride on the etched surface 5.
A +1 surface 6 is formed to make it easier for electroless plated metal to attach. (Figure 4) (5) Dissolve the masking film 3 on the resistive film 2 with a solvent and remove it. (Fig. 5) (6) A layer of nickel with a thickness of 1 to 3 layers is applied to the electrode forming part 4 activated by immersing the substrate 1 in nickel electroless METS V solution and a part of the resistive film 2 in contact with the electrode forming part 4. A continuous iH plating layer 7 is formed. (FIG. 6) Since the electroless nickel plated straddle 7 of the electrode forming portion 4 partially overlaps the resistive film 2, the electrical connection is ensured.

(7) Resistance film 2 soil and nickel electroless metal layer 1 layer 7
The ends of the resistive film 2 on which the resistive film 2 has been formed are coated with a heat-resistant epoxy paint J: 1st generation anti-protection 8-8. (Figure 7) This resistance maintenance 11'! The two layers Ia, 4 and V layer 7 of the resistive film 2L are pressed down by the crotch 8.
Tsu'／'L,'j',! 'I+U connection between the plating layer 7 and the end of the resistive film 2.

(II) I; i body 1 75 qimetu of copper 1:? 7yH ship forming part 1 is electroplated with copper, and 17 o2 to o4 copper electroplating layers (layer 94 are formed) on the nickel electrolyte 1 layer 7.

(Ll) Next, immerse it in a nickel electric bath and C
A nickel electroplated plate having a width of 1'7 x 2 to 5 lines is formed on the copper electroplated layer 9 by applying a nickel core plate V/l. Nipple heart 1 layer 10 is now 1
If fFj is the same, it can prevent the current situation of so-called solder swelling.

(Incorporated) Next, apply hang electroplating in a hang plating bath to a thickness of 5 to 10 nickel electroplated R5101-.
Solder electroplating li'J11 of m is formed. (8th
Figure) If the thickness of the solder electrolytic q-plating layer 11 is about this level (
, long-term reliability is required in terms of hang performance.

In the following manner, a cylindrical, boop-shaped electronic component Δ having electrodes 48 on both ends is formed 11].

Electroless nickel plating layer 71 km Nickel electric metal ↓h310 is formed into type IIk through 1 layer 9 of steel. Then, a nickel electroplating layer 10 is formed on the copper electroplating layer 10 to impart thickness and strength to the copper.

Furthermore, nickel electroless metal: +iN Ig in one layer 70
When the nickel electroplating layer 10 is formed, nickel electroplating F! 410 becomes uneven, and if the 01 electroplating layer 9 is omitted, the solder electroplating layer 11 becomes uneven, so a thin copper electroplating layer 9 is interposed in the middle. .

Example 2 An example of the configuration of a square chip-shaped electronic component is shown in FIGS. 9 to 2.
This will be explained with reference to the manufacturing process diagram shown in FIG.

(1) A large number of square chip-shaped ceramic substrates 1-9;
On the surface of the combined ceramic substrate 1a, a resistive film 2 such as a carbon film is formed on both lengthwise ends of each base 1, leaving a small electrically conductive layer 4 (a plan view is shown in FIG. 9). J) (2) Form a synthetic resin masking film 3 on the surface of each resistor film 2, leaving a slight portion 8 on both ends of the lengthwise direction, and furthermore, form a synthetic resin masking film 3 on the back side, leaving a slight amount on both ends of the lengthwise direction of the substrate 1. A synthetic resin massing film 3a is formed by leaving the rest behind.

(The plan view is shown in Figure 10, and the inside view is shown in Figure 11.)
() The substrate 1, a is divided into long and thin strips so that the length direction of the frame body 1 becomes the width direction to form strips 1b. (The plan view is shown in FIG. 12) (4) The strip 1b was treated with hydrofluoric acid in the same manner as in Example 1. By this hydrofluoric acid treatment, the surface of the surface layer J covered with the masking film 3.38 (not the strip 11) is damaged. ,! Add part of 2 to 5.

(The front view 4 is shown in Fig. 13, and the 8th line is shown in Fig. 14.)
j) (5) The etched surface 5 of the strip 11) is etched with real hP IG+11 and the etched palladium etchant. A cross-sectional view in the direction "1" is shown in FIG. 15. (I); (The plan view is shown in FIG. 16) (7) Electroless nickel plating is applied to the strip 1b in the same manner as in Example 1, and the activated portion 6 is formed on the electrode forming portion 4 and a part of the resistance film 2. A nickel electroless plating layer 7 is integrally formed thereon. (The plan view is shown in FIG. 17) (8) Electrical insulating resin J is applied on the nickel electroless plating layer 7 formed partially on the resistive film 2 of the strip 1b and on both ends of this resistive film 2. , form a resistor 48. (Fig. 18 is a plan view, and Fig. 19 is a longitudinal cross-sectional side view in the width direction of the elongated piece.) (9) At the center corner of the elongated piece 1b of the base body 1, each 5, 11
Divided into book 1. (The plan view is shown in Figure 20J)00)
Square chip shape J divided into 8 parts! Copper electroplating layer 1-, nickel electroplating, and solder electroplating are applied to the electrode forming portion 4 on which the nickel electroless plating layer 7 of iA1 is formed in the same manner as in Example 1, and then copper electroplating layer 1 layer 9 and nickel electroplating are applied. A layer 10 and a solder electroplated layer 11 are formed. (9
(Fig. 121) As described above, a rectangular f-shaped part Δ'/J'l'7 with electric wires 144a on both ends is formed.

(JI Song Dynasty of the Invention) According to the present invention, electric current is attached to both ends of the chip-shaped lamic body.
~A resistive film is formed leaving the electrode forming part, and a portion of the resistive film in contact with the electrode forming part is treated with hydrofluoric acid to form an etched surface, and nickel 71! is applied to this etched surface. !
Electrolytic plating is applied to form a series of nickel electroless metal layers on a part of the resistor skin I19, such as the electrode forming part, and a series of nickel electroless metal layers are formed on the resistor skin as well as on a part of this. A resistance protective film is formed on a part of the layer, and one layer of copper electroplating and one layer of nickel electroplating are sequentially formed on the electrode forming part of the nickel electroplating layer. By the hydrofluoric acid treatment, an etched surface is formed, and this etched surface ensures the bonding of the metal nickel during the next electroless plating, and the non-conductive or ramic surface is made conductive by electroless nickel plating. (preventing sex)
Then, the following copper electroplating becomes possible.

Since the etched surface was formed in series on the electrode forming part of the ceramic substrate and a part of the resistive film in contact with the desk, a part of the electrode was formed as a resistive film II-! I-1 (1-1) ensures a secure connection that prevents gaps from being formed due to bending. Moreover, since the part 1j of the nickel electroless plated layer twisted together on the resistive film is pressed against the resistive film by the resistor 19 formed above, the connection between the two is even more secure. Become. In addition, one layer of electroless nickel metal (l r', i) cannot be formed, but the bonding strength with the lamic substrate is low, and the surface strength is low. By forming a layer, the bonding force with the substrate becomes stronger, and the surface strength becomes stronger, making it possible to make the single layer thicker.

Furthermore, the interposition of the copper electroplating layer makes it possible to make the electrolyte of the next nickel electroplating layer and the solder core plating layer formed on the nickel electroplating layer 1 more uniform.

In addition, the Ti electrode material is a low-cost material that does not use expensive ferrules or palladium 18, and since it does not use silver, there is no risk of solder creases occurring, and electrodeposition is formed by plating. The electrode forming part is not scratched by the torigata, and a resistance film with low heat resistance can be used.

[Brief explanation of drawings]

Figures 1/j to 8 are explanatory diagrams of the manufacturing process of an electronic component showing an embodiment of the present invention, and Figures 9/i to 2'1
The figure shows another example of the same. Manufacturing of chip-shaped electronic components.
It is a rod explanatory diagram. 1...IJ1 rest, 2...11 (anti-film, 4...electrode forming part, 5)...1-Ting surface, 7...nickel! W, electrolytic hair layer, 8... (^, l'! Il'i!, 9...
1 layer of copper electroplating, 10... - 1 full, ', i-type plating layer.

Claims (1)

[Claims] (1) A resistive film is formed on both ends of a chip-shaped ceramic substrate, leaving electrode forming parts, and the electrode forming parts and a part of the resistive film in contact with the electrode forming parts are treated with hydrofluoric acid to form an etched surface. Then, nickel electroless plating is applied to this etched surface to form a series of nickel electroless plating layers on the electrode forming part and a part of the resistive film, and the nickel formed on the resistive film and a part of this resistive film is A chip-shaped electronic component characterized in that a resistance protection film is formed on a part of the electroless plating layer, and a copper electroplating layer and a nickel electroplating layer are sequentially formed on the electrode forming part of the nickel electroless plating layer. .