JPS61106037U - - Google Patents

Info

Publication number
JPS61106037U
JPS61106037U JP1984191136U JP19113684U JPS61106037U JP S61106037 U JPS61106037 U JP S61106037U JP 1984191136 U JP1984191136 U JP 1984191136U JP 19113684 U JP19113684 U JP 19113684U JP S61106037 U JPS61106037 U JP S61106037U
Authority
JP
Japan
Prior art keywords
pellet
semiconductor pellet
semiconductor
bulge
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984191136U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984191136U priority Critical patent/JPS61106037U/ja
Publication of JPS61106037U publication Critical patent/JPS61106037U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案に係る半導体装置の一実施例を
示す斜視図、第２図は第１図のＡ―Ａ線に沿う断
面図、第３図は樹脂モールドタイプの半導体装置
の従来例を示す斜視図、第４図は第３図のＢ―Ｂ
線に沿う断面図、第５図は第４図の半導体装置の
樹脂材が熱硬化した状態を示す断面図、第６図は
第４図の半導体装置の使用時に樹脂材が熱膨張し
た状態を示す断面図である。 １……放熱板、３……リード、４……半導体ペ
レツト、６……金属細線、７……熱硬化性樹脂材
、８……膨出部。 FIG. 1 is a perspective view showing an embodiment of a semiconductor device according to the present invention, FIG. 2 is a cross-sectional view taken along line AA in FIG. 1, and FIG. 3 is a conventional example of a resin mold type semiconductor device. The perspective view shown in Figure 4 is BB in Figure 3.
5 is a cross-sectional view showing the state in which the resin material of the semiconductor device shown in FIG. 4 has been thermally hardened, and FIG. 6 is a sectional view showing the state in which the resin material has thermally expanded when the semiconductor device shown in FIG. FIG. DESCRIPTION OF SYMBOLS 1...Radiation plate, 3...Lead, 4...Semiconductor pellet, 6...Metal thin wire, 7...Thermosetting resin material, 8...Bulging part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 金属製の放熱板上に半導体ペレツトを固着マウ
ントすると共に、該半導体ペレツトとリード先端
部とを金属細線で電気的に接続し、半導体ペレツ
トを含む主要部分を熱硬化性樹脂材でモールド成
型したものであつて、上記放熱板のペレツト搭載
位置に押出成形により膨出部を形成し、該膨出部
に半導体ペレツトを固着マウントしたことを特徴
とする半導体装置。 A semiconductor pellet is firmly mounted on a metal heat sink, the semiconductor pellet and the lead tip are electrically connected with a thin metal wire, and the main part including the semiconductor pellet is molded with a thermosetting resin material. A semiconductor device characterized in that a bulge is formed by extrusion molding at the pellet mounting position of the heat sink, and a semiconductor pellet is fixedly mounted on the bulge.
JP1984191136U 1984-12-17 1984-12-17 Pending JPS61106037U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984191136U JPS61106037U (en) 1984-12-17 1984-12-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984191136U JPS61106037U (en) 1984-12-17 1984-12-17

Publications (1)

Publication Number Publication Date
JPS61106037U true JPS61106037U (en) 1986-07-05

Family

ID=30748576

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984191136U Pending JPS61106037U (en) 1984-12-17 1984-12-17

Country Status (1)

Country Link
JP (1) JPS61106037U (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4829373A (en) * 1971-05-04 1973-04-18
JPS54576A (en) * 1977-06-03 1979-01-05 Hitachi Ltd Electronic parts
JPS5662346A (en) * 1979-10-26 1981-05-28 Hitachi Ltd Lead frame and semicondcutor device having thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4829373A (en) * 1971-05-04 1973-04-18
JPS54576A (en) * 1977-06-03 1979-01-05 Hitachi Ltd Electronic parts
JPS5662346A (en) * 1979-10-26 1981-05-28 Hitachi Ltd Lead frame and semicondcutor device having thereof

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