JPH0316351U - - Google Patents
Info
- Publication number
- JPH0316351U JPH0316351U JP1989077171U JP7717189U JPH0316351U JP H0316351 U JPH0316351 U JP H0316351U JP 1989077171 U JP1989077171 U JP 1989077171U JP 7717189 U JP7717189 U JP 7717189U JP H0316351 U JPH0316351 U JP H0316351U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- connection part
- heat sink
- lead connection
- semiconductor pellet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案に係る半導体装置の一実施例を
示すリードフレームの平面図、第２図及び第３図
は第１図のリードフレームの放熱板の変形状態を
示す各平面図である。第４図は従来の半導体装置
で使用されるリードフレームの平面図、第５図は
第４図のリードフレームを上下金型で型締めした
状態を示す断面図、第６図は第４図のリードフレ
ームを樹脂モールドした半導体装置の部分断面を
含む平面図、第７図は第４図のリードフレームの
放熱板の変形状態を示す平面図である。
２……リード、６……半導体ペレツト、７……
金属細線、１３……外装樹脂材、２１……放熱板
、２２……先端面、２３，２４……側端面、０…
…接続点。
FIG. 1 is a plan view of a lead frame showing an embodiment of a semiconductor device according to the present invention, and FIGS. 2 and 3 are plan views showing deformed states of the heat sink of the lead frame of FIG. 1. Fig. 4 is a plan view of a lead frame used in a conventional semiconductor device, Fig. 5 is a sectional view showing the lead frame of Fig. 4 clamped with upper and lower molds, and Fig. 6 is a plan view of the lead frame of Fig. 4. FIG. 7 is a plan view including a partial cross section of a semiconductor device having a lead frame molded with resin, and FIG. 7 is a plan view showing a deformed state of the heat sink of the lead frame shown in FIG. 2...Lead, 6...Semiconductor pellet, 7...
Fine metal wire, 13... Exterior resin material, 21... Heat sink, 22... Tip surface, 23, 24... Side end surface, 0...
...connection point.
Claims (1)
半導体ペレツトをマウントしてその半導体ペレツ
トと放熱板周辺部に延びるリードとを金属細線で
接続し、上記半導体ペレツトを含む主要部分を外
装樹脂材でモールドしたものにおいて、 上記放熱板は、リード連結部と反対側の端面が
リード連結部を中心とした円弧状をなし、リード
連結部側から反対側端面に向つて幅狭となるよう
なテーパ状をなすことを特徴とする半導体装置。[Scope of Claim for Utility Model Registration] A semiconductor pellet is mounted on a heat sink to which at least one lead is connected, and the semiconductor pellet and the lead extending around the heat sink are connected with a thin metal wire, The heat dissipation plate has a main part molded with an exterior resin material, and the end surface opposite to the lead connection part has an arc shape centered on the lead connection part, and the end face opposite to the lead connection part is shaped like an arc, and A semiconductor device characterized by having a tapered shape that becomes narrower at the end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989077171U JPH0316351U (en) | 1989-06-29 | 1989-06-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989077171U JPH0316351U (en) | 1989-06-29 | 1989-06-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0316351U true JPH0316351U (en) | 1991-02-19 |
Family
ID=31619308
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989077171U Pending JPH0316351U (en) | 1989-06-29 | 1989-06-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0316351U (en) |
-
1989
- 1989-06-29 JP JP1989077171U patent/JPH0316351U/ja active Pending