JPS61106782A - 回路板上の銅皮膜のエツチング方法 - Google Patents

回路板上の銅皮膜のエツチング方法

Info

Publication number: JPS61106782A
Authority: JP; Japan
Prior art keywords: etching; copper; etching solution; circuit board; bromine
Prior art date: 1984-08-14
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP60174390A

Other languages

English (en)

Japanese (ja)

Inventor

ビリー　ベイヤー

ハースライナー

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Hans Herumiyuraa Mas & Co GmbH

Original Assignee

Hans Herumiyuraa Mas & Co GmbH

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1984-08-14

Filing date

1985-08-09

Publication date

1986-05-24

1985-08-09 Application filed by Hans Herumiyuraa Mas & Co GmbH filed Critical Hans Herumiyuraa Mas & Co GmbH

1986-05-24 Publication of JPS61106782A publication Critical patent/JPS61106782A/ja

Status Pending legal-status Critical Current

Links

238000005530 etching Methods 0.000 title claims description 77
239000010949 copper Substances 0.000 title claims description 49
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 39
229910052802 copper Inorganic materials 0.000 title claims description 39
239000000243 solution Substances 0.000 claims description 45
QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 27
239000003054 catalyst Substances 0.000 claims description 25
238000000034 method Methods 0.000 claims description 23
WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims description 18
GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims description 18
229910052794 bromium Inorganic materials 0.000 claims description 18
239000000126 substance Substances 0.000 claims description 8
229910021529 ammonia Inorganic materials 0.000 claims description 4
CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 claims description 3
239000012266 salt solution Substances 0.000 claims description 3
239000000463 material Substances 0.000 description 15
229910000069 nitrogen hydride Inorganic materials 0.000 description 8
239000007921 spray Substances 0.000 description 6
239000007788 liquid Substances 0.000 description 5
239000011248 coating agent Substances 0.000 description 4
238000000576 coating method Methods 0.000 description 4
230000000694 effects Effects 0.000 description 3
229910052720 vanadium Inorganic materials 0.000 description 3
LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 3
HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
SWLVFNYSXGMGBS-UHFFFAOYSA-N ammonium bromide Chemical compound [NH4+].[Br-] SWLVFNYSXGMGBS-UHFFFAOYSA-N 0.000 description 2
QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
230000003197 catalytic effect Effects 0.000 description 2
150000001768 cations Chemical class 0.000 description 2
238000006243 chemical reaction Methods 0.000 description 2
229910000365 copper sulfate Inorganic materials 0.000 description 2
ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
230000007423 decrease Effects 0.000 description 2
239000000203 mixture Substances 0.000 description 2
229910052760 oxygen Inorganic materials 0.000 description 2
239000001301 oxygen Substances 0.000 description 2
238000000926 separation method Methods 0.000 description 2
LSTRKXWIZZZYAS-UHFFFAOYSA-N 2-bromoacetyl bromide Chemical compound BrCC(Br)=O LSTRKXWIZZZYAS-UHFFFAOYSA-N 0.000 description 1
241001349592 Benincasa fistulosa Species 0.000 description 1
235000015866 Citrullus vulgaris var fistulosus Nutrition 0.000 description 1
241000257465 Echinoidea Species 0.000 description 1
206010034972 Photosensitivity reaction Diseases 0.000 description 1
YRRFBANPGRXQNJ-UHFFFAOYSA-M acetyl(trimethyl)azanium;bromide Chemical compound [Br-].CC(=O)[N+](C)(C)C YRRFBANPGRXQNJ-UHFFFAOYSA-M 0.000 description 1
239000002253 acid Substances 0.000 description 1
239000007864 aqueous solution Substances 0.000 description 1
230000015572 biosynthetic process Effects 0.000 description 1
239000003795 chemical substances by application Substances 0.000 description 1
238000010276 construction Methods 0.000 description 1
238000007796 conventional method Methods 0.000 description 1
ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
230000001419 dependent effect Effects 0.000 description 1
238000011161 development Methods 0.000 description 1
238000010586 diagram Methods 0.000 description 1
238000005868 electrolysis reaction Methods 0.000 description 1
238000005187 foaming Methods 0.000 description 1
231100001261 hazardous Toxicity 0.000 description 1
239000003350 kerosene Substances 0.000 description 1
238000000622 liquid--liquid extraction Methods 0.000 description 1
230000007774 longterm Effects 0.000 description 1
238000004519 manufacturing process Methods 0.000 description 1
239000011253 protective coating Substances 0.000 description 1
230000001172 regenerating effect Effects 0.000 description 1
238000012958 reprocessing Methods 0.000 description 1
238000010079 rubber tapping Methods 0.000 description 1
238000000638 solvent extraction Methods 0.000 description 1
238000012360 testing method Methods 0.000 description 1
238000013519 translation Methods 0.000 description 1
150000003682 vanadium compounds Chemical class 0.000 description 1
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/46—Regeneration of etching compositions
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/32—Alkaline compositions
- C23F1/34—Alkaline compositions for etching copper or alloys thereof

Landscapes

Chemical & Material Sciences (AREA)
Metallurgy (AREA)
General Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Chemical Kinetics & Catalysis (AREA)
Organic Chemistry (AREA)
ing And Chemical Polishing (AREA)
Manufacturing Of Printed Circuit Boards (AREA)
Catalysts (AREA)
Manufacturing Of Printed Wiring (AREA)
Chemically Coating (AREA)
Electrolytic Production Of Metals (AREA)

JP60174390A 1984-08-14 1985-08-09 回路板上の銅皮膜のエツチング方法 Pending JPS61106782A (ja)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
DE3429902.5		1984-08-14
DE19843429902 DE3429902A1 (de)	1984-08-14	1984-08-14	Verfahren zum aetzen von kupferfilmen auf leiterplatten unter elektrolytischer rueckgewinnung von kupfer aus der aetzloesung

Publications (1)

Publication Number	Publication Date
JPS61106782A true JPS61106782A (ja)	1986-05-24

Family

ID=6243027

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP60174390A Pending JPS61106782A (ja)	1984-08-14	1985-08-09	回路板上の銅皮膜のエツチング方法

Country Status (10)

Country	Link
JP (1)	JPS61106782A (it)
AT (1)	AT387590B (it)
BE (1)	BE903054A (it)
BR (1)	BR8503833A (it)
DE (1)	DE3429902A1 (it)
FR (1)	FR2569205A1 (it)
GB (1)	GB2163101A (it)
IT (1)	IT1185341B (it)
NL (1)	NL8502245A (it)
SE (1)	SE8503594L (it)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
AT395177B (de) *	1990-07-05	1992-10-12	Provera Gmbh	Aetzloesung
US5431776A (en) *	1993-09-08	1995-07-11	Phibro-Tech, Inc.	Copper etchant solution additives
CH689018A5 (it) *	1994-09-08	1998-07-31	Ecochem Ag	Procedimento di elettroestrazione di metalli pesanti.
DE102006036888A1 (de) *	2005-11-10	2007-05-16	Eve Recycling Sarl	Regenerierbare Ätzlösung
CN103562441B (zh) *	2011-06-17	2016-10-19	英派尔科技开发有限公司	由物品再生金属

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE3324450A1 (de) *	1983-07-07	1985-01-17	ELO-CHEM Ätztechnik GmbH, 7758 Meersburg	Ammoniumsulfathaltige aetzloesung sowie verfahren zur regeneration der aetzloesung
DE3340342A1 (de) *	1983-11-08	1985-05-15	ELO-CHEM Ätztechnik GmbH, 7758 Meersburg	Verfahren und anlage zum regenerieren einer ammoniakalischen aetzloesung

1984
- 1984-08-14 DE DE19843429902 patent/DE3429902A1/de not_active Withdrawn
1985
- 1985-07-18 GB GB08518145A patent/GB2163101A/en not_active Withdrawn
- 1985-07-25 SE SE8503594A patent/SE8503594L/ not_active Application Discontinuation
- 1985-07-31 IT IT21796/85A patent/IT1185341B/it active
- 1985-08-09 JP JP60174390A patent/JPS61106782A/ja active Pending
- 1985-08-12 BE BE6/48129A patent/BE903054A/fr not_active IP Right Cessation
- 1985-08-13 NL NL8502245A patent/NL8502245A/nl not_active Application Discontinuation
- 1985-08-13 BR BR8503833A patent/BR8503833A/pt unknown
- 1985-08-13 FR FR8512442A patent/FR2569205A1/fr not_active Withdrawn
- 1985-08-13 AT AT0235785A patent/AT387590B/de not_active IP Right Cessation

Also Published As

Publication number	Publication date
IT1185341B (it)	1987-11-12
IT8521796A0 (it)	1985-07-31
DE3429902A1 (de)	1986-02-27
SE8503594L (sv)	1986-02-15
GB2163101A (en)	1986-02-19
GB8518145D0 (en)	1985-08-21
BR8503833A (pt)	1986-05-27
BE903054A (fr)	1985-12-02
ATA235785A (de)	1988-07-15
AT387590B (de)	1989-02-10
FR2569205A1 (fr)	1986-02-21
NL8502245A (nl)	1986-03-03
SE8503594D0 (sv)	1985-07-25

Publication	Publication Date	Title
US3761369A (en)	1973-09-25	Process for the electrolytic reclamation of spent etching fluids
US4632727A (en)	1986-12-30	Copper etching process and solution
US3788915A (en)	1974-01-29	Regeneration of spent etchant
JPS6327427B2 (it)	1988-06-02
US3700450A (en)	1972-10-24	Regeneration of bleach-fix solutions used in photographic processing
US3634088A (en)	1972-01-11	Regeneration of blix solutions used in photographic processing
US3783113A (en)	1974-01-01	Electrolytic regeneration of spent etchant
JPS61106782A (ja)	1986-05-24	回路板上の銅皮膜のエツチング方法
ATE652T1 (de)	1982-02-15	Verfahren zum aetzen von oberflaechen aus kupfer oder kupferlegierungen.
US4424097A (en)	1984-01-03	Metal stripping process and composition
JPH09195083A (ja)	1997-07-29	ハロゲン錫組成物及び電解メッキ方法
US4604175A (en)	1986-08-05	Process for regeneration of iron-copper chloride etching solution
CA2069933C (en)	2000-06-20	Etching solution containing a vanadium catalyst
CN114606497B (zh)	2024-03-19	一种三氯化铁蚀刻液处理及再生循环的工艺方法
DE3305319C2 (it)	1993-01-21
JP2008511746A (ja)	2008-04-17	電気分解による再生可能なエッチング溶液
Sharpe et al.	1959	Regenerable Etchant for Copper
US20250290205A1 (en)	2025-09-18	Process for etching circuit board with alkaline tetraamminecopper (ii) sulfate and apparatus therefor
EP0054074B1 (en)	1987-05-13	Process for reducing and reclaiming electrolyte containing tin salt
SU1275060A1 (ru)	1986-12-07	Раствор дл травлени пермалло
RU2108410C1 (ru)	1998-04-10	Способ регенерации железомедно-хлоридного травильного раствора
SU908974A1 (ru)	1982-02-28	Способ электрохимического сн ти изотопнообогащенной меди
US1378145A (en)	1921-05-17	Electrolytic deposition of copper from acid solutions
Greene	1939	The rate of decomposition of hydrogen peroxide in nickel sulfate plating baths
SU831885A1 (ru)	1981-05-23	Раствор дл электрохимическогопОлиРОВАНи СплАВОВ