JPS61107753A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS61107753A
JPS61107753A JP59227800A JP22780084A JPS61107753A JP S61107753 A JPS61107753 A JP S61107753A JP 59227800 A JP59227800 A JP 59227800A JP 22780084 A JP22780084 A JP 22780084A JP S61107753 A JPS61107753 A JP S61107753A
Authority
JP
Japan
Prior art keywords
electrode
region
silicon substrate
electrode plate
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59227800A
Other languages
English (en)
Japanese (ja)
Other versions
JPH027182B2 (de
Inventor
Seiichi Miyagawa
宮川　誠一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Rectifier Corp Japan Ltd
Original Assignee
International Rectifier Corp Japan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Rectifier Corp Japan Ltd filed Critical International Rectifier Corp Japan Ltd
Priority to JP59227800A priority Critical patent/JPS61107753A/ja
Publication of JPS61107753A publication Critical patent/JPS61107753A/ja
Publication of JPH027182B2 publication Critical patent/JPH027182B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H10W70/24—Conductive package substrates serving as an interconnection, e.g. metal plates characterised by materials
    • H10W70/26—Semiconductor materials

Landscapes

  • Wire Bonding (AREA)
JP59227800A 1984-10-31 1984-10-31 半導体装置 Granted JPS61107753A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59227800A JPS61107753A (ja) 1984-10-31 1984-10-31 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59227800A JPS61107753A (ja) 1984-10-31 1984-10-31 半導体装置

Publications (2)

Publication Number Publication Date
JPS61107753A true JPS61107753A (ja) 1986-05-26
JPH027182B2 JPH027182B2 (de) 1990-02-15

Family

ID=16866582

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59227800A Granted JPS61107753A (ja) 1984-10-31 1984-10-31 半導体装置

Country Status (1)

Country Link
JP (1) JPS61107753A (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0418074U (de) * 1990-06-05 1992-02-14

Also Published As

Publication number Publication date
JPH027182B2 (de) 1990-02-15

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