Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Momentive Performance Materials Japan LLC
Original Assignee
Toshiba Silicone Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Silicone Co LtdfiledCriticalToshiba Silicone Co Ltd
Priority to JP8066478ApriorityCriticalpatent/JPS557578A/ja
Publication of JPS557578ApublicationCriticalpatent/JPS557578A/ja
Publication of JPS6110922B2publicationCriticalpatent/JPS6110922B2/ja
Matériaux à haute conductivité thermique a base de resine organique-inorganique comportant des groupes fonctionnels greffes liant la partie organique a la partie inorganique et matériaux poreux comprenant la résine
A novel silicone polymer and its thermosetting resin composition, resin film, metal foil with insulating material, insulating film with metal foil on each side, metal-clad laminate and multilayered one, and multilayered printed circuit board
Composé silicium organique, composant contenant un substrat traité en surface par ce composé silicium organique, préimprégné, carte de circuit imprimé, et liquide de traitement pour tissu de verre