JPS61111155U

JPS61111155U -

Info

Publication number: JPS61111155U
Application number: JP8057384U
Authority: JP
Priority date: 1984-05-31
Filing date: 1984-05-31
Publication date: 1986-07-14

Description

[Brief explanation of the drawing]

第１図は従来の実装基板の穴にリード端子を挿
入して実装するＳＩＰタイプ混成集積回路基板で
ａが正面図、ｂが側面図を示している。第２図は
本考案によるＳＩＰタイプ混成集積回路基板の側
面である。第３図は本考案によるリード端子の斜
視図、第４図は本考案混成集積回路ユニツトの斜
視図、第５図は第４図の矢印ｂの方向から見た側
面図を示している。図面において４は混成集積回路基板、６はリー
ド端子、８は引き出し導体パターン、９はリード
端子の第１突出片、１０は第２突出片、１１は実
装基板、１２，１３は導体パターンを示している
。 FIG. 1 shows a conventional SIP type hybrid integrated circuit board that is mounted by inserting lead terminals into holes in a mounting board, with a showing a front view and b showing a side view. FIG. 2 is a side view of the SIP type hybrid integrated circuit board according to the present invention. 3 is a perspective view of a lead terminal according to the present invention, FIG. 4 is a perspective view of a hybrid integrated circuit unit according to the present invention, and FIG. 5 is a side view as viewed from the direction of arrow b in FIG. 4. In the drawings, 4 is a hybrid integrated circuit board, 6 is a lead terminal, 8 is a lead-out conductor pattern, 9 is a first protruding piece of the lead terminal, 10 is a second protruding piece, 11 is a mounting board, and 12 and 13 are conductive patterns. ing.

補正昭６１．１．３０図面の簡単な説明を次のように補正する。本願明細書の第７頁第１８行目〜２０行目に記
載の文章「第１図は従来の実装基板の穴にリード
端子を挿入して実装するＳＩＰタイプ混成集積回
路基板でａが正面図、ｂが側面図を示している。
」を下記の通り補正する。「第１図は本考案ＳＩＰタイプ混成集積回路ユ
ニツトの側面図、」Amendment January 30, 1981 The brief description of the drawing is amended as follows. The text stated in lines 18 to 20 of page 7 of the specification of the present application: ``Figure 1 is a SIP type hybrid integrated circuit board that is mounted by inserting lead terminals into the holes of a conventional mounting board, and a is a front view. , b shows a side view.
' shall be corrected as follows. ``Figure 1 is a side view of the SIP type hybrid integrated circuit unit of the present invention.''

Claims

[Scope of Claim for Utility Model Registration] 1. A hybrid integrated circuit board on which a lead-out conductor pattern for providing lead terminals for lead-out to the outside is formed at the end of an insulating board on which circuit elements are mounted;
A mounting board made of an insulating plate and having a conductive pattern formed on its surface, and a lead terminal made of a conductive member having a first protruding piece connected to the lead-out pattern and a second protruding piece connected to the conductive pattern. A SIP type hybrid integrated circuit unit, wherein the lead terminal connects the conductor pattern and the lead-out pattern so that the hybrid integrated circuit board is substantially perpendicular to the surface of the mounting board. 2. The SIP type hybrid integrated circuit unit according to claim 1, wherein the first projecting piece is comprised of two projecting pieces that sandwich the end portion of the hybrid integrated circuit board. 3. The second protrusion protrudes substantially perpendicularly to both sides of the hybrid integrated circuit board, and has a step-like tip, so that when the hybrid integrated circuit board is mounted on the mounting board, the hybrid integrated circuit board is mounted on the mounting board. 2. The SIP type hybrid integrated circuit unit according to claim 1, wherein the circuit board is formed to float above the surface of the mounting board.