JPS61111570A - 冷却素子の製造方法 - Google Patents

冷却素子の製造方法

Info

Publication number
JPS61111570A
JPS61111570A JP59214609A JP21460984A JPS61111570A JP S61111570 A JPS61111570 A JP S61111570A JP 59214609 A JP59214609 A JP 59214609A JP 21460984 A JP21460984 A JP 21460984A JP S61111570 A JPS61111570 A JP S61111570A
Authority
JP
Japan
Prior art keywords
cooling
bellows
outer periphery
cooling plate
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59214609A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0320072B2 (2
Inventor
Katsuhide Natori
名取　勝英
Yukihisa Katsuyama
勝山　幸寿
Tsutomu Iikawa
勤 飯川
Isao Kawamura
勲 川村
Takeaki Sakai
酒井　武明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP59214609A priority Critical patent/JPS61111570A/ja
Publication of JPS61111570A publication Critical patent/JPS61111570A/ja
Publication of JPH0320072B2 publication Critical patent/JPH0320072B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/772—Bellows

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP59214609A 1984-10-13 1984-10-13 冷却素子の製造方法 Granted JPS61111570A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59214609A JPS61111570A (ja) 1984-10-13 1984-10-13 冷却素子の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59214609A JPS61111570A (ja) 1984-10-13 1984-10-13 冷却素子の製造方法

Publications (2)

Publication Number Publication Date
JPS61111570A true JPS61111570A (ja) 1986-05-29
JPH0320072B2 JPH0320072B2 (2) 1991-03-18

Family

ID=16658548

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59214609A Granted JPS61111570A (ja) 1984-10-13 1984-10-13 冷却素子の製造方法

Country Status (1)

Country Link
JP (1) JPS61111570A (2)

Also Published As

Publication number Publication date
JPH0320072B2 (2) 1991-03-18

Similar Documents

Publication Publication Date Title
US6381845B2 (en) Method of manufacturing plate type heat pipe
US4254431A (en) Restorable backbond for LSI chips using liquid metal coated dendrites
US7886809B2 (en) Apparatus and method for passive phase change thermal management
JP4979768B2 (ja) 熱伝導性複合インタフェース、それを用いた冷却型電子アセンブリ、及び、冷却アセンブリと熱発生電子デバイスとの結合方法
US6263959B1 (en) Plate type heat pipe and cooling structure using it
JPH07112031B2 (ja) 蝕刻された繊維の核形成部位を有する蒸発器およびその製造方法
US7842553B2 (en) Cooling micro-channels
JPS6238861B2 (2)
CN221176208U (zh) 芯片封装结构
JPH0342512B2 (2)
JPH0320072B2 (2)
JP3011579B2 (ja) 半導体パッケージ用放熱板
JPS6020538A (ja) 半導体装置
JPS58199546A (ja) 半導体冷却装置
JPS5875860A (ja) 冷媒封入型半導体装置
JPS62293745A (ja) 伝熱素子
JPS5685842A (en) Semiconductor device having heat dissipating fin
JPS6252949A (ja) 積層型セラミツクパツケ−ジ
JPS6129161A (ja) 熱伝導冷却モジユ−ル装置
JPS61114563A (ja) 集積回路容器
JPH0648869Y2 (ja) 冷却構造
JPS6225442A (ja) 放熱用蛇腹の製造方法
JPH04254359A (ja) 樹脂封止型半導体装置および半導体装置の実装構造
JPS60234351A (ja) 半導体装置
JPH04146657A (ja) 半導体集積回路の放熱装置