JPS61115330A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS61115330A
JPS61115330A JP59237220A JP23722084A JPS61115330A JP S61115330 A JPS61115330 A JP S61115330A JP 59237220 A JP59237220 A JP 59237220A JP 23722084 A JP23722084 A JP 23722084A JP S61115330 A JPS61115330 A JP S61115330A
Authority
JP
Japan
Prior art keywords
resin
pot
tablet
mold
molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59237220A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0376779B2 (2
Inventor
Hideto Suzuki
秀人 鈴木
Ryoichi Yamashita
良一 山下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP59237220A priority Critical patent/JPS61115330A/ja
Publication of JPS61115330A publication Critical patent/JPS61115330A/ja
Publication of JPH0376779B2 publication Critical patent/JPH0376779B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP59237220A 1984-11-10 1984-11-10 半導体装置の製造方法 Granted JPS61115330A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59237220A JPS61115330A (ja) 1984-11-10 1984-11-10 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59237220A JPS61115330A (ja) 1984-11-10 1984-11-10 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS61115330A true JPS61115330A (ja) 1986-06-02
JPH0376779B2 JPH0376779B2 (2) 1991-12-06

Family

ID=17012158

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59237220A Granted JPS61115330A (ja) 1984-11-10 1984-11-10 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS61115330A (2)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06104301A (ja) * 1992-09-18 1994-04-15 Nitto Denko Corp 半導体封止用樹脂タブレット及びその製造方法と半導体封止方法
US6173490B1 (en) * 1997-08-20 2001-01-16 National Semiconductor Corporation Method for forming a panel of packaged integrated circuits
JP2014086609A (ja) * 2012-10-25 2014-05-12 Renesas Electronics Corp 半導体装置の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06104301A (ja) * 1992-09-18 1994-04-15 Nitto Denko Corp 半導体封止用樹脂タブレット及びその製造方法と半導体封止方法
US6173490B1 (en) * 1997-08-20 2001-01-16 National Semiconductor Corporation Method for forming a panel of packaged integrated circuits
JP2014086609A (ja) * 2012-10-25 2014-05-12 Renesas Electronics Corp 半導体装置の製造方法

Also Published As

Publication number Publication date
JPH0376779B2 (2) 1991-12-06

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