JPS61121869A - インゴツト部材の供給装置 - Google Patents
インゴツト部材の供給装置Info
- Publication number
- JPS61121869A JPS61121869A JP24305784A JP24305784A JPS61121869A JP S61121869 A JPS61121869 A JP S61121869A JP 24305784 A JP24305784 A JP 24305784A JP 24305784 A JP24305784 A JP 24305784A JP S61121869 A JPS61121869 A JP S61121869A
- Authority
- JP
- Japan
- Prior art keywords
- ingot
- base
- ingot member
- cutting
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24305784A JPS61121869A (ja) | 1984-11-16 | 1984-11-16 | インゴツト部材の供給装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24305784A JPS61121869A (ja) | 1984-11-16 | 1984-11-16 | インゴツト部材の供給装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61121869A true JPS61121869A (ja) | 1986-06-09 |
| JPH0536209B2 JPH0536209B2 (de) | 1993-05-28 |
Family
ID=17098159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24305784A Granted JPS61121869A (ja) | 1984-11-16 | 1984-11-16 | インゴツト部材の供給装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61121869A (de) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5099820A (en) * | 1988-11-03 | 1992-03-31 | Photec Industrie S.A. | Abrasion-type splitting unit |
| CN105946128A (zh) * | 2016-06-29 | 2016-09-21 | 上海日进机床有限公司 | 工件翻转装置及工件线切割设备 |
| CN109773993A (zh) * | 2019-03-27 | 2019-05-21 | 天通日进精密技术有限公司 | 一种利用多段式半导体晶棒截断机的晶棒截断方法 |
-
1984
- 1984-11-16 JP JP24305784A patent/JPS61121869A/ja active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5099820A (en) * | 1988-11-03 | 1992-03-31 | Photec Industrie S.A. | Abrasion-type splitting unit |
| CN105946128A (zh) * | 2016-06-29 | 2016-09-21 | 上海日进机床有限公司 | 工件翻转装置及工件线切割设备 |
| CN109773993A (zh) * | 2019-03-27 | 2019-05-21 | 天通日进精密技术有限公司 | 一种利用多段式半导体晶棒截断机的晶棒截断方法 |
| CN109773993B (zh) * | 2019-03-27 | 2020-09-22 | 天通日进精密技术有限公司 | 一种利用多段式半导体晶棒截断机的晶棒截断方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0536209B2 (de) | 1993-05-28 |
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