JPS6113497B2 - - Google Patents
Info
- Publication number
- JPS6113497B2 JPS6113497B2 JP16089980A JP16089980A JPS6113497B2 JP S6113497 B2 JPS6113497 B2 JP S6113497B2 JP 16089980 A JP16089980 A JP 16089980A JP 16089980 A JP16089980 A JP 16089980A JP S6113497 B2 JPS6113497 B2 JP S6113497B2
- Authority
- JP
- Japan
- Prior art keywords
- sulfide
- plating
- weight
- parts
- sulfur
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 18
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 12
- 239000011593 sulfur Substances 0.000 claims description 12
- 229910052717 sulfur Inorganic materials 0.000 claims description 12
- 229920005992 thermoplastic resin Polymers 0.000 claims description 9
- 239000006229 carbon black Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 229910052976 metal sulfide Inorganic materials 0.000 claims description 6
- 239000011342 resin composition Substances 0.000 claims description 5
- 239000000843 powder Substances 0.000 claims description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 235000019241 carbon black Nutrition 0.000 description 6
- -1 polyethylene Polymers 0.000 description 6
- 239000000203 mixture Substances 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- MBMLMWLHJBBADN-UHFFFAOYSA-N Ferrous sulfide Chemical compound [Fe]=S MBMLMWLHJBBADN-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 2
- 239000005083 Zinc sulfide Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920006380 polyphenylene oxide Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 2
- WWNBZGLDODTKEM-UHFFFAOYSA-N sulfanylidenenickel Chemical compound [Ni]=S WWNBZGLDODTKEM-UHFFFAOYSA-N 0.000 description 2
- 229910052984 zinc sulfide Inorganic materials 0.000 description 2
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 2
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 description 1
- 229910018626 Al(OH) Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229920002943 EPDM rubber Polymers 0.000 description 1
- 229910019440 Mg(OH) Inorganic materials 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- XEIPQVVAVOUIOP-UHFFFAOYSA-N [Au]=S Chemical compound [Au]=S XEIPQVVAVOUIOP-UHFFFAOYSA-N 0.000 description 1
- KSECJOPEZIAKMU-UHFFFAOYSA-N [S--].[S--].[S--].[S--].[S--].[V+5].[V+5] Chemical compound [S--].[S--].[S--].[S--].[S--].[V+5].[V+5] KSECJOPEZIAKMU-UHFFFAOYSA-N 0.000 description 1
- 229910052946 acanthite Inorganic materials 0.000 description 1
- 239000006230 acetylene black Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- COOGPNLGKIHLSK-UHFFFAOYSA-N aluminium sulfide Chemical compound [Al+3].[Al+3].[S-2].[S-2].[S-2] COOGPNLGKIHLSK-UHFFFAOYSA-N 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- CJDPJFRMHVXWPT-UHFFFAOYSA-N barium sulfide Chemical compound [S-2].[Ba+2] CJDPJFRMHVXWPT-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- FACXGONDLDSNOE-UHFFFAOYSA-N buta-1,3-diene;styrene Chemical compound C=CC=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 FACXGONDLDSNOE-UHFFFAOYSA-N 0.000 description 1
- 229910052980 cadmium sulfide Inorganic materials 0.000 description 1
- NNLOHLDVJGPUFR-UHFFFAOYSA-L calcium;3,4,5,6-tetrahydroxy-2-oxohexanoate Chemical compound [Ca+2].OCC(O)C(O)C(O)C(=O)C([O-])=O.OCC(O)C(O)C(O)C(=O)C([O-])=O NNLOHLDVJGPUFR-UHFFFAOYSA-L 0.000 description 1
- 239000006231 channel black Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- DBULDCSVZCUQIR-UHFFFAOYSA-N chromium(3+);trisulfide Chemical compound [S-2].[S-2].[S-2].[Cr+3].[Cr+3] DBULDCSVZCUQIR-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- OMZSGWSJDCOLKM-UHFFFAOYSA-N copper(II) sulfide Chemical compound [S-2].[Cu+2] OMZSGWSJDCOLKM-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000006232 furnace black Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- CAYGQBVSOZLICD-UHFFFAOYSA-N hexabromobenzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1Br CAYGQBVSOZLICD-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052981 lead sulfide Inorganic materials 0.000 description 1
- 229940056932 lead sulfide Drugs 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- QENHCSSJTJWZAL-UHFFFAOYSA-N magnesium sulfide Chemical compound [Mg+2].[S-2] QENHCSSJTJWZAL-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- XUARKZBEFFVFRG-UHFFFAOYSA-N silver sulfide Chemical compound [S-2].[Ag+].[Ag+] XUARKZBEFFVFRG-UHFFFAOYSA-N 0.000 description 1
- 229940056910 silver sulfide Drugs 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- ZEGFMFQPWDMMEP-UHFFFAOYSA-N strontium;sulfide Chemical compound [S-2].[Sr+2] ZEGFMFQPWDMMEP-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- ZVTQDOIPKNCMAR-UHFFFAOYSA-N sulfanylidene(sulfanylideneboranylsulfanyl)borane Chemical compound S=BSB=S ZVTQDOIPKNCMAR-UHFFFAOYSA-N 0.000 description 1
- YPMOSINXXHVZIL-UHFFFAOYSA-N sulfanylideneantimony Chemical compound [Sb]=S YPMOSINXXHVZIL-UHFFFAOYSA-N 0.000 description 1
- CADICXFYUNYKGD-UHFFFAOYSA-N sulfanylidenemanganese Chemical compound [Mn]=S CADICXFYUNYKGD-UHFFFAOYSA-N 0.000 description 1
- NRUVOKMCGYWODZ-UHFFFAOYSA-N sulfanylidenepalladium Chemical compound [Pd]=S NRUVOKMCGYWODZ-UHFFFAOYSA-N 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- XPDICGYEJXYUDW-UHFFFAOYSA-N tetraarsenic tetrasulfide Chemical compound S1[As]2S[As]3[As]1S[As]2S3 XPDICGYEJXYUDW-UHFFFAOYSA-N 0.000 description 1
- AFNRRBXCCXDRPS-UHFFFAOYSA-N tin(ii) sulfide Chemical compound [Sn]=S AFNRRBXCCXDRPS-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Electroplating Methods And Accessories (AREA)
Description
本発明は成形物に化学メツキを施すことなく直
接電気メツキを施すことのできるメツキ用樹脂組
成物に関するものである。
従来よりゴムを主体としたベースにカーボンブ
ラツク更に硫黄等を添加して導電性を与えて直接
電気メツキを施す方法が行われていたが、どうし
てもゴムが主体のため剛性に乏しく又硫黄を使用
しているためメツキ金属との密着力を増大するた
めには空気中又はある環境条件下での数日間の熟
成が必要であり、熟成中又は貯蔵中に硫黄のブル
ーミングが生じる等種々問題があつた。更にゴム
が主体のため成形物にヒケ又はピンホールが生じ
やすくこの成形物にメツキを施してもその欠点が
そのまゝ表われるという問題もあつた。
本発明はこれらの問題点を解決すると共に更に
メツキの密着力を増大せしめたものである。即ち
本発明は熱可塑性樹脂100重量部に対して、カー
ボンブラツク15〜50重量部、硫黄0.05〜5重量部
及び金属粉末又は金属硫化物1〜15重量部配合す
ることを特徴とする直接電気メツキ可能な樹脂組
成物を提供することにある。
本発明における熱可塑性樹脂とはポリエチレ
ン、ポリプロピレン、エチレンプロピレン共重合
体、エチレンプロピレンジエン三元共重合体、エ
チレン酢酸ビニル共重合体、ポリ塩化ビニル、ポ
リスチレン、ポリアセタール、6,6−6,6−
10,6−12,11,12等のポリアミド、ポリフエニ
レンサルフアイド(PPS)、ポリフエニレンオキ
サイド(PPO)、ポリブチレンテレフタレート
(PBT)、ポリエチレンテレフタレート(PET)、
ABS、AS、ポリメチルペンテン、スチレンブタ
ジエンスチレン共重合体(SBS)、ポリカーボネ
ート等が含まれる。
カーボンブラツクとしてはアセチレンブラツ
ク、フアーネスブラツク、チヤンネルブラツク、
ケツチエンブラツク等が使用される。
金属粉末としてはニツケル、鉄、亜鉛、クロ
ム、銅、アルミニウム等、金属硫化物としては硫
化亜鉛、硫化アンチモン、硫化アルミニウム、硫
化金、硫化銀、硫化クロム、硫化鉛、硫化ストロ
ンチウム、硫化錫、硫化チタン、硫化鉄、硫化
銅、硫化ニツケル、硫化バナジウム、硫化パラジ
ウム、硫化バリウム、硫化カドニウム、硫化ビス
マス、硫化砒素、硫化硼素、硫化ベリウム、硫化
マグネシウム、硫化マンガン、等が使用される。
本発明において配合されるカーボンブラツクは
熱可塑性樹脂に導電性を附与し量は多いほど導電
性は向上するが熱可塑性樹脂100重量部に対して
50重量部を越えると流動性が悪くなり成形が困難
となるばかりでなく耐衝撃性やメツキの外観も悪
くなる。又15重量部未満の配合では導電性が向上
されず電気メツキができなくなる。
次に硫黄の添加はメツキの密着強度を向上させ
るためには不可欠のものであるが成形材料の製造
過程又は成形中に臭気があり、作業中好ましくな
く、更にメツキ工程前に成形され成形品として保
管しておくと成形品表面に硫黄がブルーミングし
てきてその後メツキするとメツキ外観が著しく悪
くなるという欠点があつた。しかし本発明者らの
研究により金属粉末又は金属硫化物を混合併用す
ることにより作業中の臭気性はなくなり硫黄のブ
ルーミングの発生日数も長くなることを見出し
た。即ち熱可塑性樹脂100重量部に対して硫黄
0.05〜5重量部及び金属又は金属硫化物1〜15重
量部を併用混合することにより目的のメツキの密
着強度が得られると共に作業中臭気もなくブルー
ミングの発生日数も長くなることが判明した。
本発明の目的は無電解メツキ(化学メツキ)工
程を完全に省略し、直接電気メツキ可能な熱可塑
性樹脂組成物であり、該組成物にて成形された成
形品にストライクニツケルメツキを施した場合メ
ツキつき回り時間が5分/dm2以内で2.0Kg/cm
以上のメツキ密着強度を有し、メツキの外観にお
いてピンホール等がなく良好であることである。
その他の目的としては本発明の組成物は射出成
形、押出成形等が可能な流動性を有し、作業中臭
気がなく、成形品等の貯蔵において硫黄がブルー
ミングしにくく、発生日数が1ケ月以上はあるこ
と、更に機械強度において実用に耐えることであ
る。
本発明は前記目的を全て満足するメツキ用樹脂
組成物を提供することにある。本発明は必要によ
り該組成物の他に安定剤、滑剤、老化防止剤、
ZnO,MgO,Mg(OH)2,Al(OH)3,タルク,
ガラスセンイ等の他の充填剤、Sb2O3,ZnBO3,
塩化パラフイン,ヘキサブロムベンゼン,デカブ
ロモフエニルオキシド等の難燃剤等の他の添加物
を配合してもよい。
以下実施例にて詳細に説明する。
実施例 1
熱可塑性樹脂としてポリプロピレン(住友化学
工業(株)製、住友ノーブレン、W531)、カーボ
ンブラツクとして米国カボツト社製 VulcanXC
−72、金属硫化物として硫化ニツケル(NiS)、
更に硫黄を第1表に示すような配合とした。
これらの組成物はブレンダーにて5分間撹拌混
合し、2軸連続押出機(65m/m)で混練押出し
コンパウンドペレツトを得た。このペレツトを
110℃、3時間乾燥し、5oz射出成形機で各組成
物に対して最適成形条件で3mm厚、100mmφ、表
面積約1.6dm2の円板を成形し、各種試験及び以下
のメツキ条件で直接電気メツキを施し特性を評価
した。
メツキ条件(ストライクニツケル;ワツト浴)
・液組成 塩化ニツケル 250g/
硫酸ニツケル 50 〃
ホウ酸 40 〃
ピツト防止剤 2cc/
・液温度 50℃
・運転条件 1V −1分
2V −2分
3A/dm2−4分
以後硫酸銅浴又は各種メツキ浴槽へ入れる。
特性としては流動性としてメルトインデツクス
(MI)、作業性として臭気性、貯蔵性としてブル
ーミングの発生日数、耐衝撃性としてアイゾツト
衝撃強さ、曲げ強度、メツキの密着強度としてピ
ーリングテスト、メツキの外観としてピツト数、
ストライクニツケルメツキのつき回り時間を各々
測定し、第1表の如く結果が得られた。総合評価
として〇印は本発明を満足するもの、×印は本発
明を満足しないものであり、本発明品は皆目的を
達成した。
The present invention relates to a plating resin composition that can be electroplated directly onto molded articles without chemically plating them. Conventionally, the method of directly electroplating was to add carbon black and sulfur etc. to a base mainly made of rubber to give it conductivity, but since it is mainly made of rubber, it lacks rigidity and also requires the use of sulfur. Therefore, in order to increase the adhesion with the plating metal, it is necessary to ripen it in the air or under certain environmental conditions for several days, which caused various problems such as sulfur blooming during aging or storage. . Furthermore, since the molded product is mainly made of rubber, sink marks or pinholes are likely to occur in the molded product, and even if the molded product is plated, the defects will continue to appear. The present invention solves these problems and further increases the adhesion of plating. That is, the present invention provides a direct electroplating method characterized in that 15 to 50 parts by weight of carbon black, 0.05 to 5 parts by weight of sulfur, and 1 to 15 parts by weight of metal powder or metal sulfide are blended with 100 parts by weight of thermoplastic resin. The object of the present invention is to provide a resin composition that is possible. Thermoplastic resins in the present invention include polyethylene, polypropylene, ethylene propylene copolymer, ethylene propylene diene terpolymer, ethylene vinyl acetate copolymer, polyvinyl chloride, polystyrene, polyacetal, 6,6-6,6-
Polyamides such as 10, 6-12, 11, 12, polyphenylene sulfide (PPS), polyphenylene oxide (PPO), polybutylene terephthalate (PBT), polyethylene terephthalate (PET),
Includes ABS, AS, polymethylpentene, styrene-butadiene-styrene copolymer (SBS), polycarbonate, etc. Carbon blacks include acetylene black, furnace black, channel black,
Ketuchen black etc. are used. Metal powders include nickel, iron, zinc, chromium, copper, aluminum, etc. Metal sulfides include zinc sulfide, antimony sulfide, aluminum sulfide, gold sulfide, silver sulfide, chromium sulfide, lead sulfide, strontium sulfide, tin sulfide, and sulfide. Titanium, iron sulfide, copper sulfide, nickel sulfide, vanadium sulfide, palladium sulfide, barium sulfide, cadmium sulfide, bismuth sulfide, arsenic sulfide, boron sulfide, beryum sulfide, magnesium sulfide, manganese sulfide, etc. are used. The carbon black blended in the present invention imparts conductivity to the thermoplastic resin, and the conductivity improves as the amount increases, but based on 100 parts by weight of the thermoplastic resin.
If it exceeds 50 parts by weight, not only will the fluidity deteriorate and molding become difficult, but also the impact resistance and appearance of plating will deteriorate. If the amount is less than 15 parts by weight, the conductivity will not be improved and electroplating will not be possible. Next, the addition of sulfur is essential for improving the adhesion strength of plating, but it produces an odor during the manufacturing process of the molding material or during molding, making it undesirable during work. When stored, sulfur blooms on the surface of the molded product, and when it is subsequently plated, the appearance of the plated product deteriorates significantly. However, the inventors of the present invention have found through research that the combined use of metal powder or metal sulfide eliminates the odor during work and lengthens the number of days in which sulfur blooming occurs. That is, sulfur per 100 parts by weight of thermoplastic resin.
It has been found that by mixing together 0.05 to 5 parts by weight and 1 to 15 parts by weight of metal or metal sulfide, the desired plating adhesion strength can be obtained, and there is no odor during operation, and the number of days during which blooming occurs can be lengthened. The object of the present invention is to completely omit the electroless plating (chemical plating) process and to provide a thermoplastic resin composition that can be directly electroplated. 2.0Kg/cm within 5 minutes/ dm2
It has the above plating adhesion strength and the plating appearance is good with no pinholes or the like.
Other purposes include that the composition of the present invention has fluidity that allows injection molding, extrusion molding, etc., has no odor during work, is resistant to sulfur blooming during storage of molded products, etc., and does not bloom for more than 1 month. In addition, it has mechanical strength that can withstand practical use. The object of the present invention is to provide a resin composition for plating that satisfies all of the above objects. In addition to the composition, the present invention also includes stabilizers, lubricants, anti-aging agents,
ZnO, MgO, Mg(OH) 2 , Al(OH) 3 , talc,
Other fillers such as glass fiber, Sb 2 O 3 , ZnBO 3 ,
Other additives such as flame retardants such as chlorinated paraffin, hexabromobenzene, and decabromophenyl oxide may also be included. This will be explained in detail in Examples below. Example 1 Polypropylene (manufactured by Sumitomo Chemical Co., Ltd., Sumitomo Noblen, W531) was used as the thermoplastic resin, VulcanXC manufactured by Kabot Corporation in the United States was used as the carbon black.
−72, nickel sulfide (NiS) as a metal sulfide,
Furthermore, sulfur was mixed as shown in Table 1. These compositions were stirred and mixed in a blender for 5 minutes, and kneaded and extruded in a twin-screw continuous extruder (65 m/m) to obtain compound pellets. This pellet
After drying at 110℃ for 3 hours, a disk with a thickness of 3 mm, 100 mmφ, and a surface area of approximately 1.6 dm 2 was molded using a 5oz injection molding machine under the optimum molding conditions for each composition, and was subjected to various tests and directly electrolyzed under the following plating conditions. The properties were evaluated by plating. Plating conditions (strike nickel; Watt bath) ・Liquid composition Nickel chloride 250g / Nickel sulfate 50 〃 Boric acid 40 〃 Pitting prevention agent 2cc / ・Liquid temperature 50℃ ・Operating conditions 1V -1 minute 2V -2 minutes 3A/dm 2 - After 4 minutes, put it in a copper sulfate bath or various plating baths. Characteristics include melt index (MI) for fluidity, odor for workability, number of days of blooming for storage stability, Izot impact strength and bending strength for impact resistance, peeling test for adhesion strength of plating, and appearance of plating. as pitt number,
The running time of each strike nickel was measured, and the results shown in Table 1 were obtained. As for the overall evaluation, 〇 marks are those that satisfy the present invention, and × marks are those that do not satisfy the present invention, and all the products of the present invention achieved their objectives.
【表】
実施例 2
熱可塑性樹脂として宇部興産(株)製ナイロン6−
1013B、ポリプラスチツクス社製ポリアセタール
−ジユラコンM90、住友化学工業(株)製ポリプロピ
レン−住友ノーブレンW−531、カーボンブラツ
クとして米国カボツト社製VulcanXC−72、金属
系としては硫化亜鉛、硫化鉄、銅粉末、アルミニ
ウム粉末、及び硫黄を用して第2表の如く配合
し、実施例1と同様に検討を行い第2表の結果が
得られた。
本発明品は全て目的を満足している。[Table] Example 2 Nylon 6- manufactured by Ube Industries, Ltd. as a thermoplastic resin
1013B, polyacetal-Dyuracon M90 manufactured by Polyplastics, polypropylene-Sumitomo Noblen W-531 manufactured by Sumitomo Chemical Co., Ltd., VulcanXC-72 manufactured by Kabot Corporation of the United States as carbon black, zinc sulfide, iron sulfide, copper powder as metals. , aluminum powder, and sulfur were mixed as shown in Table 2 and examined in the same manner as in Example 1, and the results shown in Table 2 were obtained. All of the products of the present invention satisfy the objectives.
Claims (1)
ラツク15〜50重量部、硫黄0.05〜5重量部及び金
属粉末又は金属硫化物1〜15重量部配合してなる
ことを特徴とするメツキ用樹脂組成物。1. A resin composition for plating, characterized in that it contains 15 to 50 parts by weight of carbon black, 0.05 to 5 parts by weight of sulfur, and 1 to 15 parts by weight of metal powder or metal sulfide to 100 parts by weight of thermoplastic resin. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16089980A JPS5785991A (en) | 1980-11-17 | 1980-11-17 | Resin composition for plating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16089980A JPS5785991A (en) | 1980-11-17 | 1980-11-17 | Resin composition for plating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5785991A JPS5785991A (en) | 1982-05-28 |
| JPS6113497B2 true JPS6113497B2 (en) | 1986-04-14 |
Family
ID=15724753
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16089980A Granted JPS5785991A (en) | 1980-11-17 | 1980-11-17 | Resin composition for plating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5785991A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4466912A (en) * | 1982-09-30 | 1984-08-21 | Mobay Chemical Corporation | Conductive thermoplastic compositions |
-
1980
- 1980-11-17 JP JP16089980A patent/JPS5785991A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5785991A (en) | 1982-05-28 |
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