JPS61136633U - - Google Patents

Info

Publication number
JPS61136633U
JPS61136633U JP2013285U JP2013285U JPS61136633U JP S61136633 U JPS61136633 U JP S61136633U JP 2013285 U JP2013285 U JP 2013285U JP 2013285 U JP2013285 U JP 2013285U JP S61136633 U JPS61136633 U JP S61136633U
Authority
JP
Japan
Prior art keywords
metal plate
circuit board
printed circuit
circuits
grounding metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013285U
Other languages
Japanese (ja)
Other versions
JPH0451520Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985020132U priority Critical patent/JPH0451520Y2/ja
Priority to DE19863604730 priority patent/DE3604730A1/en
Publication of JPS61136633U publication Critical patent/JPS61136633U/ja
Application granted granted Critical
Publication of JPH0451520Y2 publication Critical patent/JPH0451520Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0037—Housings with compartments containing a PCB, e.g. partitioning walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Receivers (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、本考案のシールド構造を適用した実
装構造の一実施例の断面図、第２図は、ＵＨＦチ
ユーナの段間複同調回路の一般的な回路図、第３
図は、従来の実装構造の一例の切欠き斜視図、第
４図は、他の従来の実装構造の一例の切欠き斜視
図、第５図は、第４図に示された実装構造の断面
図である。 ４：１次側共振用ライン、５：１次側共振用可
変容量ダイオード、７：２次側共振用ライン、８
：２次側共振用可変容量ダイオード、２３：第１
のプリント基板、２４：第２のプリント基板、２
６：接地用金属板、２７：シールド用金属板。 FIG. 1 is a cross-sectional view of one embodiment of a mounting structure to which the shield structure of the present invention is applied, FIG. 2 is a general circuit diagram of an interstage double-tuned circuit of a UHF tuner, and FIG.
The figure is a cutaway perspective view of an example of a conventional mounting structure, FIG. 4 is a cutaway perspective view of another example of a conventional mounting structure, and FIG. 5 is a cross-section of the mounting structure shown in FIG. 4. It is a diagram. 4: Line for primary side resonance, 5: Variable capacitance diode for primary side resonance, 7: Line for secondary side resonance, 8
: Variable capacitance diode for secondary side resonance, 23: 1st
printed circuit board, 24: second printed circuit board, 2
6: Grounding metal plate, 27: Shielding metal plate.

Claims (1)

【実用新案登録請求の範囲】 (1) 容量結合または誘導結合されないようにシ
ールドすべき２個の回路を、プリント基板の一方
の面の上に配置し、このプリント基板の他方の面
に添つて接地用金属板を配置し、この接地用金属
板に、前記プリント基板を貫通して前記２個の回
路の間に配置されるシールド用金属板を突設させ
たことを特徴とするシールド構造。 (2) 前記シールド用金属板を、前記接地用金属
板を切り起して形成させたことを特徴とする実用
新案登録請求の範囲第１項記載のシールド構造。[Claims for Utility Model Registration] (1) Two circuits to be shielded from capacitive or inductive coupling are placed on one side of a printed circuit board, and the circuits are placed along the other side of the printed circuit board. A shield structure characterized in that a grounding metal plate is arranged, and a shielding metal plate is protruded from the grounding metal plate to penetrate the printed circuit board and to be arranged between the two circuits. (2) The shield structure according to claim 1, wherein the shielding metal plate is formed by cutting and raising the grounding metal plate.
JP1985020132U 1985-02-15 1985-02-15 Expired JPH0451520Y2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1985020132U JPH0451520Y2 (en) 1985-02-15 1985-02-15
DE19863604730 DE3604730A1 (en) 1985-02-15 1986-02-14 Circuit carrier for an electronic circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985020132U JPH0451520Y2 (en) 1985-02-15 1985-02-15

Publications (2)

Publication Number Publication Date
JPS61136633U true JPS61136633U (en) 1986-08-25
JPH0451520Y2 JPH0451520Y2 (en) 1992-12-03

Family

ID=12018608

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985020132U Expired JPH0451520Y2 (en) 1985-02-15 1985-02-15

Country Status (2)

Country Link
JP (1) JPH0451520Y2 (en)
DE (1) DE3604730A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5162971A (en) * 1989-03-23 1992-11-10 Matsushita Electric Industrial Co., Ltd. High-density circuit module and process for producing same
AU5365890A (en) * 1989-04-20 1990-10-25 Nec Corporation Miniature mobile radio communication equipment having a shield structure
DE102013217270A1 (en) * 2013-08-29 2015-03-05 Zf Friedrichshafen Ag Printed circuit board device with a plug contact

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5160705U (en) * 1974-11-08 1976-05-13
JPS58162696U (en) * 1982-04-23 1983-10-29 松下電工株式会社 control panel

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2937539C2 (en) * 1979-09-17 1982-09-02 Siemens AG, 1000 Berlin und 8000 München Arrangement for radio interference suppression of switching power supplies

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5160705U (en) * 1974-11-08 1976-05-13
JPS58162696U (en) * 1982-04-23 1983-10-29 松下電工株式会社 control panel

Also Published As

Publication number Publication date
JPH0451520Y2 (en) 1992-12-03
DE3604730A1 (en) 1986-08-21
DE3604730C2 (en) 1989-05-18

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