JPS61154196A - アウタ−リ−ドボンデイング装置 - Google Patents

アウタ−リ−ドボンデイング装置

Info

Publication number
JPS61154196A
JPS61154196A JP59273748A JP27374884A JPS61154196A JP S61154196 A JPS61154196 A JP S61154196A JP 59273748 A JP59273748 A JP 59273748A JP 27374884 A JP27374884 A JP 27374884A JP S61154196 A JPS61154196 A JP S61154196A
Authority
JP
Japan
Prior art keywords
semiconductor device
outer lead
printed circuit
lead
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59273748A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0466118B2 (mo
Inventor
岡村　實
龍男 佐藤
秀明 三好
神田　祐司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Marine Instr Co Ltd
Original Assignee
NEC Corp
Marine Instr Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Marine Instr Co Ltd filed Critical NEC Corp
Priority to JP59273748A priority Critical patent/JPS61154196A/ja
Publication of JPS61154196A publication Critical patent/JPS61154196A/ja
Publication of JPH0466118B2 publication Critical patent/JPH0466118B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP59273748A 1984-12-27 1984-12-27 アウタ−リ−ドボンデイング装置 Granted JPS61154196A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59273748A JPS61154196A (ja) 1984-12-27 1984-12-27 アウタ−リ−ドボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59273748A JPS61154196A (ja) 1984-12-27 1984-12-27 アウタ−リ−ドボンデイング装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP61139291A Division JPS6284529A (ja) 1986-06-17 1986-06-17 キヤリヤテ−プ打抜装置

Publications (2)

Publication Number Publication Date
JPS61154196A true JPS61154196A (ja) 1986-07-12
JPH0466118B2 JPH0466118B2 (mo) 1992-10-22

Family

ID=17532022

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59273748A Granted JPS61154196A (ja) 1984-12-27 1984-12-27 アウタ−リ−ドボンデイング装置

Country Status (1)

Country Link
JP (1) JPS61154196A (mo)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01135738U (mo) * 1988-03-08 1989-09-18

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5986287A (ja) * 1982-11-08 1984-05-18 株式会社新川 アウタ−リ−ドボンデイング装置
JPS59175132A (ja) * 1983-03-23 1984-10-03 Nec Corp テ−プキヤリア方式による半導体装置の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5986287A (ja) * 1982-11-08 1984-05-18 株式会社新川 アウタ−リ−ドボンデイング装置
JPS59175132A (ja) * 1983-03-23 1984-10-03 Nec Corp テ−プキヤリア方式による半導体装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01135738U (mo) * 1988-03-08 1989-09-18

Also Published As

Publication number Publication date
JPH0466118B2 (mo) 1992-10-22

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