JPS61163649A - アウタ−リ−ドボンデイング装置 - Google Patents

アウタ−リ−ドボンデイング装置

Info

Publication number
JPS61163649A
JPS61163649A JP60004122A JP412285A JPS61163649A JP S61163649 A JPS61163649 A JP S61163649A JP 60004122 A JP60004122 A JP 60004122A JP 412285 A JP412285 A JP 412285A JP S61163649 A JPS61163649 A JP S61163649A
Authority
JP
Japan
Prior art keywords
base
semiconductor
theta
outer lead
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60004122A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0226379B2 (2
Inventor
Minoru Okamura
岡村　實
Fumimaro Ikeda
池田　史麻呂
Hideaki Miyoshi
秀明 三好
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Marine Instr Co Ltd
Original Assignee
NEC Corp
Marine Instr Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Marine Instr Co Ltd filed Critical NEC Corp
Priority to JP60004122A priority Critical patent/JPS61163649A/ja
Publication of JPS61163649A publication Critical patent/JPS61163649A/ja
Publication of JPH0226379B2 publication Critical patent/JPH0226379B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP60004122A 1985-01-16 1985-01-16 アウタ−リ−ドボンデイング装置 Granted JPS61163649A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60004122A JPS61163649A (ja) 1985-01-16 1985-01-16 アウタ−リ−ドボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60004122A JPS61163649A (ja) 1985-01-16 1985-01-16 アウタ−リ−ドボンデイング装置

Publications (2)

Publication Number Publication Date
JPS61163649A true JPS61163649A (ja) 1986-07-24
JPH0226379B2 JPH0226379B2 (2) 1990-06-08

Family

ID=11575980

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60004122A Granted JPS61163649A (ja) 1985-01-16 1985-01-16 アウタ−リ−ドボンデイング装置

Country Status (1)

Country Link
JP (1) JPS61163649A (2)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0222835A (ja) * 1988-07-12 1990-01-25 Toshiba Corp 電子部品の実装装置
US4913335A (en) * 1988-09-01 1990-04-03 Mitsubishi Denki Kabushiki Kaisha Method and apparatus for die bonding
US5609292A (en) * 1992-12-04 1997-03-11 International Business Machines Corporation Manufacturing circuit boards using a pick and place machine

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0222835A (ja) * 1988-07-12 1990-01-25 Toshiba Corp 電子部品の実装装置
US4913335A (en) * 1988-09-01 1990-04-03 Mitsubishi Denki Kabushiki Kaisha Method and apparatus for die bonding
US5609292A (en) * 1992-12-04 1997-03-11 International Business Machines Corporation Manufacturing circuit boards using a pick and place machine

Also Published As

Publication number Publication date
JPH0226379B2 (2) 1990-06-08

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