JPS6116698Y2 - - Google Patents

Info

Publication number
JPS6116698Y2
JPS6116698Y2 JP1980135967U JP13596780U JPS6116698Y2 JP S6116698 Y2 JPS6116698 Y2 JP S6116698Y2 JP 1980135967 U JP1980135967 U JP 1980135967U JP 13596780 U JP13596780 U JP 13596780U JP S6116698 Y2 JPS6116698 Y2 JP S6116698Y2
Authority
JP
Japan
Prior art keywords
circuit module
integrated circuit
ultra
lid
refrigerant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1980135967U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5759459U (2
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980135967U priority Critical patent/JPS6116698Y2/ja
Publication of JPS5759459U publication Critical patent/JPS5759459U/ja
Application granted granted Critical
Publication of JPS6116698Y2 publication Critical patent/JPS6116698Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1980135967U 1980-09-26 1980-09-26 Expired JPS6116698Y2 (2)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980135967U JPS6116698Y2 (2) 1980-09-26 1980-09-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980135967U JPS6116698Y2 (2) 1980-09-26 1980-09-26

Publications (2)

Publication Number Publication Date
JPS5759459U JPS5759459U (2) 1982-04-08
JPS6116698Y2 true JPS6116698Y2 (2) 1986-05-22

Family

ID=29496109

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980135967U Expired JPS6116698Y2 (2) 1980-09-26 1980-09-26

Country Status (1)

Country Link
JP (1) JPS6116698Y2 (2)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2662991B2 (ja) * 1988-07-29 1997-10-15 イビデン株式会社 混成集積回路パッケージ

Also Published As

Publication number Publication date
JPS5759459U (2) 1982-04-08

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