JPS61168465A - Rolling cutter - Google Patents

Rolling cutter

Info

Publication number
JPS61168465A
JPS61168465A JP593285A JP593285A JPS61168465A JP S61168465 A JPS61168465 A JP S61168465A JP 593285 A JP593285 A JP 593285A JP 593285 A JP593285 A JP 593285A JP S61168465 A JPS61168465 A JP S61168465A
Authority
JP
Japan
Prior art keywords
blade
cutting
work
cutter
central axis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP593285A
Other languages
Japanese (ja)
Other versions
JPH0661696B2 (en
Inventor
Hikoyoshi Baba
彦良 馬場
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokin Corp
Original Assignee
Tohoku Metal Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tohoku Metal Industries Ltd filed Critical Tohoku Metal Industries Ltd
Priority to JP60005932A priority Critical patent/JPH0661696B2/en
Publication of JPS61168465A publication Critical patent/JPS61168465A/en
Publication of JPH0661696B2 publication Critical patent/JPH0661696B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/042Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with blades or wires mounted in a reciprocating frame

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

PURPOSE:To enable cutting of long material by extending a blade in tangential direction in a plane crossing perpendicularly with the central axis of rolling while arranging an arched cutter rotatably on the endface near to the central axis thereby eliminating abrasion and stepped terminal due to abrasive grains of blade. CONSTITUTION:When machining, a work 6 is pushed up by a work holder 7 to contact with the cutter 15 of the blade 13. Upon rolling of rolling device 11 around the rotary shaft 10 by means of a drive unit as shown by the arrows 16, 17, the work 6 is cut by the cutter 15. Consequently, snaking of blade 13 and partial abrasion of the cutter 15 will never occur to enable cutting of work 6 over the entire length by moving back and fro after cutting without restriction of length. While since the work 6 is separated from the blade 13, the abrasive grains will permeate well to improve the cutting performance.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は1例えば硬脆材料に遊離砥粒によるラッピング
切断を施すのに適した切断装置に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a cutting device suitable for performing lapping cutting using free abrasive grains on, for example, hard and brittle materials.

〔従来の技術〕[Conventional technology]

代表的なこの種の切断装置としてブレードソーと呼ばれ
るものがある。従来のブレードノーにおいては、切断刃
を有するブレードを左右に水平状態で往復運動させ、そ
の際上方より砥粒を流し。
A typical cutting device of this type is called a blade saw. In conventional blade nos, a blade with a cutting edge is moved back and forth horizontally from side to side, and abrasive grains are flowed from above.

これにより物品を切断している。This cuts the article.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

しかしながら従来のブレードソーには次の様な欠点があ
る。(、)ブレードの往復運動を案内するだめのガイド
部分が必要となり、そのガイド面とブレードとの間の隙
間だけブレードが蛇行することがあるため、切断精度が
劣る。(b)摺動部があるため、その個所へ砥粒が入り
、摩耗を起すことがある。(c)長尺の加工物を切断す
る時、摺動部のガイド部が邪魔となり長尺物の切断が出
来ない。(d)ブレードの切断刃に摩耗によりストロー
クの終点で段差がつき、それが被加工物の端にカケを生
じる原因となる。
However, conventional blade saws have the following drawbacks. (,) A guide portion is required to guide the reciprocating motion of the blade, and the blade may meander by the gap between the guide surface and the blade, resulting in poor cutting accuracy. (b) Since there are sliding parts, abrasive grains may enter the sliding parts and cause wear. (c) When cutting a long workpiece, the guide part of the sliding part gets in the way, making it impossible to cut the long workpiece. (d) The cutting edge of the blade has a step at the end of the stroke due to wear, which causes chips at the end of the workpiece.

これらについて第4図及び第5図を用いて説明する。ブ
レード1は水平往復運動をするため、摺動部4とガイド
5を必要とし、したがって被加工物6の長さtは第5図
からも明らかなようにそれらによって制限される。被加
工物6は油圧又は機構的に加工物ホルダー7を介して上
方へ押し上げられ、ブレード1に接触させられているの
で、ブレード1が被加工物6に常に接触することとなり
These will be explained using FIGS. 4 and 5. Since the blade 1 makes a horizontal reciprocating motion, it requires a sliding part 4 and a guide 5, and therefore the length t of the workpiece 6 is limited by them, as is clear from FIG. Since the workpiece 6 is hydraulically or mechanically pushed upward via the workpiece holder 7 and brought into contact with the blade 1, the blade 1 is always in contact with the workpiece 6.

これらの間には隙間が少ないため、砥液の入りが悪い。Since there are few gaps between these, it is difficult for the abrasive liquid to enter.

又ブレード1に左右動を与えるロッド3はカム機構(図
示省略)により動作されるだめ、一定長の往復動とな9
.したがってブレード1は第6図の如く段差のついた摩
耗を生じ、これが被加工物6の両端にカケやチッピング
を発生させる原因になる。
In addition, the rod 3 that causes the blade 1 to move horizontally is operated by a cam mechanism (not shown), so it reciprocates over a fixed length.
.. Therefore, the blade 1 wears in a stepped manner as shown in FIG. 6, which causes chipping and chipping at both ends of the workpiece 6.

それ故に本発明の目的は、上述した欠点を解消した揺動
式切断装置を提供することにある。
SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide an oscillating cutting device which eliminates the above-mentioned drawbacks.

〔問題点を解決するだめの手段及び作用〕本発明によれ
ば、一端を中心として揺動可能に支持された揺動装置と
、該揺動装置の他端に設けられたブレード保持装置と、
該ブレード保持装置に保持されたブレードとを含み、該
ブレードは上記揺動装置の揺動中心軸に対し直交する平
面内で接線方向に延在しかつ該揺動中心軸に近い側の端
面に切断刃を有しており、該切断刃は該揺動中心軸を中
心とした円弧に沿って形成されていることを特徴とする
揺動式切断装置が得られる。
[Means and operations for solving the problem] According to the present invention, a swinging device supported swingably around one end, a blade holding device provided at the other end of the swinging device,
a blade held by the blade holding device, the blade extending in a tangential direction within a plane orthogonal to the central axis of rocking of the rocking device, and having an end face near the central axis of rocking. There is obtained a swing-type cutting device characterized in that it has a cutting blade, and the cutting blade is formed along an arc centered on the swing center axis.

〔実施例〕〔Example〕

第1図及び第2図は本発明による揺動式切断装置の一実
施例を示す。図示の切断装置は、コの字形の揺動装置1
1を含んでいる。揺動装置11は下端を水平な回転軸1
0によって揺動可能に支持されている。揺動装置11の
上端(三箇所)には対のブレード保持装置12が設けら
れている。これらのブレード保持装置12間に複数枚の
ブレード13が互いに間隔をおいて平行に保持される。
1 and 2 show an embodiment of a swing-type cutting device according to the present invention. The illustrated cutting device is a U-shaped swinging device 1.
Contains 1. The rocking device 11 has its lower end connected to a horizontal rotating shaft 1.
It is swingably supported by 0. A pair of blade holding devices 12 are provided at the upper end (three locations) of the swinging device 11. A plurality of blades 13 are held in parallel between these blade holding devices 12 and spaced apart from each other.

ブレード保持装置12は、ブレード13の張力を調整で
きるように、張力調整ボルト14を備えている。
The blade holding device 12 includes a tension adjustment bolt 14 so that the tension of the blade 13 can be adjusted.

グレード13は従来と同様な材料の帯板にて作られたも
のでちり、下端面に切断刃15を有している。この切断
刃15は、第3図からもわかるように1回転軸10を中
心とした円弧に沿って形成されたものである。
Grade 13 is made of a strip of the same material as the conventional one, and has a cutting blade 15 on the lower end surface. As can be seen from FIG. 3, this cutting blade 15 is formed along an arc centered on the single rotation axis 10.

加工作業に際し、従来同様に加工物ホルダー7によって
被加工物6を上方へ押し上げ、ブレード13の切断刃1
5に接触させる。
During machining work, the workpiece 6 is pushed upward by the workpiece holder 7 as in the conventional case, and the cutting edge 1 of the blade 13
5.

そして、揺動装置11を図示しない、駆動装置等によっ
て回転軸10を中心として、矢印16゜17で示すよう
に揺動させる。すると、切断刃15によって被加工物6
が切断される。
Then, the swing device 11 is caused to swing by a drive device (not shown) or the like about the rotating shaft 10 as indicated by arrows 16° and 17. Then, the workpiece 6 is cut by the cutting blade 15.
is disconnected.

なお揺動装置11の揺動角は1回転軸10を中心とし尼
円弧に沿って形成された切断刃15の両端のなす角度よ
シも十分に大きいことが好ましい。
Note that it is preferable that the swinging angle of the swinging device 11 is sufficiently large as well as the angle formed by both ends of the cutting blade 15 formed along a circular arc with the rotation axis 10 as the center.

上述の構造によると、ブレード13の蛇行及び切断刃1
5の部分的な摩耗がない。また被加工物6は長さを制限
されることなく、切断後、被加工物を前後に移動するこ
とによシ全長に亘り切断が可能となる。さらに第1図の
如く被加工物6とブレード13との間が空いているだめ
、砥液がよく浸透し、したがって切削性がよくなること
が容易に理解される。又ブレード13の摩耗は第3図に
破線で示すように均一になるため、それによるチッピン
グも小さいであろう。
According to the above structure, the meandering of the blade 13 and the cutting edge 1
5. No local wear. Further, the length of the workpiece 6 is not limited, and the entire length of the workpiece can be cut by moving the workpiece back and forth after cutting. Furthermore, it is easily understood that, as shown in FIG. 1, there is a gap between the workpiece 6 and the blade 13, so that the abrasive liquid can penetrate well and, therefore, the cutting performance is improved. Further, since the wear of the blade 13 becomes uniform as shown by the broken line in FIG. 3, the chipping caused by the wear will also be small.

次に具体的数値を用い説明する。外径100 tan 
Next, explanation will be given using specific numerical values. Outer diameter 100 tan
.

長さ800 wm 、のフェライト単結晶を厚さ1mm
のウェハーに50枚切断した。加工条件は、刃厚0、2
 m 、往復動平均スピード毎秒150 wan 、荷
重200gr/刃、砥液GOす3000,20%のラッ
ピング溶液を用いた。その結果、従来の切断装置では、
ウェハの厚さ公差±0.2 tan 、周辺のチッピン
グは50枚中35枚に最大20μ発生したのに対し。
A ferrite single crystal with a length of 800 wm and a thickness of 1 mm.
50 wafers were cut. Machining conditions are blade thickness 0, 2
m, a reciprocating average speed of 150 wan per second, a load of 200 gr/blade, an abrasive liquid GO of 3000, and a 20% lapping solution. As a result, traditional cutting equipment
The wafer thickness tolerance was ±0.2 tan, and chipping at the periphery of up to 20μ occurred in 35 out of 50 wafers.

本発明による切断装置では、同一条件で切断した場合、
ウェハの厚さのバラツキは±0.1問以下。
With the cutting device according to the present invention, when cutting under the same conditions,
The variation in wafer thickness is ±0.1 or less.

周辺のチッピングは50枚すべて5μ以下を得た。Peripheral chipping was less than 5μ for all 50 sheets.

〔発明の効果〕〔Effect of the invention〕

以上実施例を用いて説明したように1本発明の切断装置
によると、ブレードの動きを回転運動に変えたため、摺
動部がなく、ブレードの蛇行及び砥粒による摩耗の恐れ
もなく、且つ摺動部のガイドがないため長尺物の切断も
可能である。さらにプV−ドの切断刃が回転軸を半径と
した円弧に沿って形成されているため、往復動の終点に
よる摩耗の段差がなく、均一に摩耗する。
As explained above using the embodiments, according to the cutting device of the present invention, the movement of the blade is changed to rotational movement, so there is no sliding part, there is no risk of meandering of the blade and wear due to abrasive grains, and Since there is no guide for moving parts, it is also possible to cut long objects. Furthermore, since the cutting blade of the blade is formed along an arc with the axis of rotation as its radius, there is no difference in wear due to the end point of the reciprocating motion, and the blade wears out uniformly.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例の正面図、第2図は同じく上
面図、第3図は同実施例で使用されたブレードの形状を
示す正面図、第4図は従来の切断装置の一例の正面図、
第5図は同じく上面図、第6図は第4図で使用されたブ
レードノーの正面図である。 10・・・回転軸、11・・・揺動装置、12・・・ブ
レード保持装置、13・・・ブレード、15・・・切断
刃。
FIG. 1 is a front view of an embodiment of the present invention, FIG. 2 is a top view, FIG. 3 is a front view showing the shape of the blade used in the embodiment, and FIG. 4 is a front view of a conventional cutting device. An example front view,
FIG. 5 is also a top view, and FIG. 6 is a front view of the blade no used in FIG. 4. DESCRIPTION OF SYMBOLS 10... Rotating shaft, 11... Rocking device, 12... Blade holding device, 13... Blade, 15... Cutting blade.

Claims (1)

【特許請求の範囲】[Claims] 1、一端を中心として揺動可能に支持された揺動装置と
、該揺動装置の他端に設けられたブレード保持装置と、
該ブレード保持装置に保持されたブレードとを含み、該
ブレードは上記揺動装置の揺動中心軸に対し直交する平
面内で接線方向に延在しかつ該揺動中心軸に近い側の端
面に切断刃を有しており、該切断刃は該揺動中心軸を中
心とした円弧に沿って形成されていることを特徴とする
揺動式切断装置。
1. A rocking device supported so as to be rockable around one end; a blade holding device provided at the other end of the rocking device;
a blade held by the blade holding device, the blade extending in a tangential direction within a plane orthogonal to the central axis of rocking of the rocking device, and having an end face near the central axis of rocking. A swing-type cutting device comprising a cutting blade, the cutting blade being formed along an arc centered on the swing center axis.
JP60005932A 1985-01-18 1985-01-18 Oscillating cutting device Expired - Lifetime JPH0661696B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60005932A JPH0661696B2 (en) 1985-01-18 1985-01-18 Oscillating cutting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60005932A JPH0661696B2 (en) 1985-01-18 1985-01-18 Oscillating cutting device

Publications (2)

Publication Number Publication Date
JPS61168465A true JPS61168465A (en) 1986-07-30
JPH0661696B2 JPH0661696B2 (en) 1994-08-17

Family

ID=11624666

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60005932A Expired - Lifetime JPH0661696B2 (en) 1985-01-18 1985-01-18 Oscillating cutting device

Country Status (1)

Country Link
JP (1) JPH0661696B2 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5834752A (en) * 1981-04-06 1983-03-01 Hitachi Ltd Grinding or polishing method using a blade and its device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5834752A (en) * 1981-04-06 1983-03-01 Hitachi Ltd Grinding or polishing method using a blade and its device

Also Published As

Publication number Publication date
JPH0661696B2 (en) 1994-08-17

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