JPS61174751U - - Google Patents
Info
- Publication number
- JPS61174751U JPS61174751U JP5844685U JP5844685U JPS61174751U JP S61174751 U JPS61174751 U JP S61174751U JP 5844685 U JP5844685 U JP 5844685U JP 5844685 U JP5844685 U JP 5844685U JP S61174751 U JPS61174751 U JP S61174751U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- resin
- flexible part
- connector
- lead wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5844685U JPS61174751U (2) | 1985-04-19 | 1985-04-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5844685U JPS61174751U (2) | 1985-04-19 | 1985-04-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61174751U true JPS61174751U (2) | 1986-10-30 |
Family
ID=30583949
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5844685U Pending JPS61174751U (2) | 1985-04-19 | 1985-04-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61174751U (2) |
-
1985
- 1985-04-19 JP JP5844685U patent/JPS61174751U/ja active Pending
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