JPS61183576U - - Google Patents
Info
- Publication number
- JPS61183576U JPS61183576U JP6746785U JP6746785U JPS61183576U JP S61183576 U JPS61183576 U JP S61183576U JP 6746785 U JP6746785 U JP 6746785U JP 6746785 U JP6746785 U JP 6746785U JP S61183576 U JPS61183576 U JP S61183576U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- electronic component
- component device
- view
- powder molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000843 powder Substances 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6746785U JPS61183576U (sr) | 1985-05-09 | 1985-05-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6746785U JPS61183576U (sr) | 1985-05-09 | 1985-05-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61183576U true JPS61183576U (sr) | 1986-11-15 |
Family
ID=30601318
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6746785U Pending JPS61183576U (sr) | 1985-05-09 | 1985-05-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61183576U (sr) |
-
1985
- 1985-05-09 JP JP6746785U patent/JPS61183576U/ja active Pending
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