JPS6119352B2 - - Google Patents
Info
- Publication number
- JPS6119352B2 JPS6119352B2 JP56078065A JP7806581A JPS6119352B2 JP S6119352 B2 JPS6119352 B2 JP S6119352B2 JP 56078065 A JP56078065 A JP 56078065A JP 7806581 A JP7806581 A JP 7806581A JP S6119352 B2 JPS6119352 B2 JP S6119352B2
- Authority
- JP
- Japan
- Prior art keywords
- laser beam
- tube
- signal
- tubular body
- cut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005520 cutting process Methods 0.000 claims description 25
- 238000012545 processing Methods 0.000 claims description 25
- 238000001514 detection method Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 14
- 230000004913 activation Effects 0.000 claims description 4
- 230000001934 delay Effects 0.000 claims description 2
- 238000003754 machining Methods 0.000 description 15
- 230000003111 delayed effect Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 230000010355 oscillation Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0823—Devices involving rotation of the workpiece
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Description
【発明の詳細な説明】
本発明は切断部位に突起物が付着するのを防止
したレーザビームによる管体の切断方法およびこ
れを実施する装置に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of cutting a tube body using a laser beam, which prevents protrusions from adhering to the cutting site, and an apparatus for carrying out the same.
従来金属管体（パイプ）をレーザビームで切断
するには、回転する管体の表面外周にレーザビー
ムを集束照射して切断する方法が行なわれてい
る。この場合レーザビームが１回転の走査で切断
するに足りるレーザパワーで切断するが、切断部
は第１図に示すように、レーザビーム１の照射部
２の両側に溶融金属が再凝固し突起物３を形成す
る。このためレーザビーム１により切断分離され
た管体（以下管状部品と称す）を内部に種々なも
のを挿入して使用する場合、例えば電子管などの
カソードとして用いる場合には、挿入されるヒー
タなどが突起物３に接触して事故を起す恐れがあ
るので、これらの突起物３を除去する後工程を必
要とする不都合があつた。 Conventionally, in order to cut a metal tube (pipe) with a laser beam, a method has been used in which a laser beam is focused and irradiated onto the outer periphery of the surface of the rotating tube. In this case, the laser beam cuts with enough laser power to cut in one rotation, but as shown in Fig. 1, the molten metal re-solidifies on both sides of the irradiated part 2 of the laser beam 1, resulting in protrusions. form 3. For this reason, when the tubular body (hereinafter referred to as tubular parts) cut and separated by the laser beam 1 is used with various things inserted inside it, for example, when used as a cathode for an electron tube, etc., the inserted heater etc. Since there is a risk of an accident due to contact with the protrusions 3, there is an inconvenience that a post process for removing these protrusions 3 is required.
また連続レーザビームで管体を切断することも
考えられているが、切断端面部に熱影響層を形成
し易く、さらに変形、変質を生じ高精度加工方法
としては不適であるという不都合があつた。 It has also been considered to cut the tube with a continuous laser beam, but this method has the disadvantages of easily forming a heat-affected layer on the cut end surface, causing further deformation and deterioration, and making it unsuitable as a high-precision processing method. .
本発明方法は、上述の不都合を除去するために
なされたもので、レーザビームを管体に照射して
上記管体を切断するレーザビームによる管体切断
方法において上記レーザビームは一発では上記管
体の管壁を貫通し得ないエネルギーのパルスの連
続繰返しでありかつ上記管体の外周を少なくとも
２回転以上照射し漸次管厚を薄くして貫通切断す
るようにしたものである。 The method of the present invention has been made in order to eliminate the above-mentioned disadvantages, and in the method of cutting a tube body using a laser beam, in which the tube body is irradiated with a laser beam to cut the tube body, the laser beam is not able to cut the tube body in one shot. This is a continuous repetition of pulses of energy that cannot penetrate the wall of the body tube, and the outer periphery of the tube body is irradiated at least twice or more, and the thickness of the tube is gradually thinned to cut through the tube.
また本発明装置は上述の発明方法を実施する装
置であつて、加工状況を検出して一定時間継続す
る加工とぎれによりレーザビームの照射を停止さ
せるようにして、確実に切断するようにしたレー
ザビームによる管体の切断装置である。 The apparatus of the present invention is an apparatus for carrying out the above-mentioned method of the invention, which uses a laser beam to ensure cutting by detecting the machining situation and stopping the laser beam irradiation at a machining break that continues for a certain period of time. This is a tubular body cutting device.
以下本発明の詳細を図示の実施例により説明す
る。最初に本発明装置につき説明し、その作動と
ともに本発明方法につき述べる。 The details of the present invention will be explained below with reference to illustrated embodiments. First, the apparatus of the present invention will be explained, and the method of the present invention will be described together with its operation.
第２図において、本装置は薄肉金属パイプから
なる管体５を保持回転させる保持回転機構１１
と、管体５の切断部位６にレーザビーム１２を照
射するレーザ加工装置１３と、切断部位６の加工
現象としての発光を検出する検出装置１４と、検
出装置１４からの電気信号によりレーザ加工装置
１３を制御する制御装置１５とから構成されてい
る。なお本図は理解を容易にするため、管体５は
他の部分に対し拡大して示されている。 In FIG. 2, this device includes a holding and rotating mechanism 11 that holds and rotates a tube body 5 made of a thin-walled metal pipe.
, a laser processing device 13 that irradiates a laser beam 12 to the cut portion 6 of the tubular body 5; a detection device 14 that detects light emission as a processing phenomenon of the cut portion 6; and an electric signal from the detection device 14 to control the laser processing device. 13, and a control device 15 that controls the controller 13. Note that in this figure, the tubular body 5 is shown enlarged relative to other parts for easy understanding.
各部につき説明すると、保持回転機構１１は、
管体５を回転させる回転部２１と管体５の切断側
端部を支持する支持部２２とからなつている。回
転部２１は、ベツド２５に直立して設けられた軸
受ブラケツト２６で従動プーリをもつた保持体２
７を回転自在に支持し、これをモータ２８、駆動
プーリ２９などからなる駆動体３０で回転して、
保持体２７の保持孔３１に取付けられたゴムから
なるリング状の保持子３２で管体５を弾性的に保
持して回転するように構成されている。一方支持
部２２は、ベツト２５上に設けたローラ軸受体３
４で一対のローラ３５，３５を回転自在に支持
し、一方のローラ３５をモータ、ベルト伝動体な
どからなる駆動体３６で回転させるように構成さ
れている。そして保持体２７で保持回転されてい
る管体５の端部を一対のローラ３５，３５で支持
するとともに管体５の周速度に合わせてローラ３
５を回転させ円滑な支持回転が得られるようにな
つている。 To explain each part, the holding rotation mechanism 11 is as follows:
It consists of a rotating part 21 that rotates the tubular body 5 and a support part 22 that supports the cut end of the tubular body 5. The rotating part 21 is connected to a holder 2 with a driven pulley by a bearing bracket 26 provided upright on the bed 25.
7 is rotatably supported, and rotated by a drive body 30 consisting of a motor 28, a drive pulley 29, etc.
The tubular body 5 is configured to be rotated while being elastically held by a ring-shaped retainer 32 made of rubber attached to a retaining hole 31 of the retainer 27. On the other hand, the support portion 22 includes a roller bearing body 3 provided on the bed 25.
4 rotatably supports a pair of rollers 35, 35, and one roller 35 is rotated by a drive body 36 consisting of a motor, a belt transmission, or the like. Then, the end portion of the tube 5 held and rotated by the holder 27 is supported by a pair of rollers 35, 35, and the roller 3 is
5 to ensure smooth support rotation.
レーサ加工装置１３は、レーザ発振器４１、シ
ヤツタ４２、ダイクロイツクミラー４３、集束レ
ンズ４４などから構成されている。そしてレーザ
発振器４１から発振されたレーザビーム１２は、
ダイクロイツクミラー４３で直角に偏向し、集束
レンズ４４を経て切断部位６に集光して加工す
る。 The laser processing device 13 includes a laser oscillator 41, a shutter 42, a dichroic mirror 43, a focusing lens 44, and the like. The laser beam 12 oscillated from the laser oscillator 41 is
The light is deflected at right angles by a dichroic mirror 43, and condensed through a condenser lens 44 onto the cutting site 6 for processing.
検出装置１４は、検出レンズ５１とこれの結像
面に置かれた光電変換体５２とから構成されてい
て、切断部位６における加工現象として発光して
いる加工光５３を検出レンズ５１より光電変換体
５２上に集束して、加工光５３の強さに応じた電
気信号を送出する。 The detection device 14 is composed of a detection lens 51 and a photoelectric conversion body 52 placed on the imaging surface of the detection lens 51, and the detection lens 51 converts processing light 53 emitted as a processing phenomenon at the cutting site 6 into photoelectric conversion. It focuses on the body 52 and sends out an electrical signal according to the intensity of the processing light 53.
制御装置１５は、増幅器５５と、比較器５６
と、設定器５７と、遅延回路を含む作動装置５８
などから構成されている。そして、検出装置１４
からの加工信号は、増幅器５５で増幅され、比較
器５６に入る。比較器５６において、予め設定器
５７に設定された基準レベル信号と加工信号とが
比較され、基準レベル信号よりレベルが低下した
時点で、作動装置５８に作動信号が出力される。
作動信号が出力されると作動装置５８の出力は遅
延回路により一定時間経過した後、制御対象とし
てのシヤツタ４２またはレーザ発振器４１などに
入力され、シヤツタ４２（本実施例においては電
磁シヤツタを使用し、外部指令により閉じる）の
閉鎖またはレーザビーム１２の発振停止などが行
なわれる。 The control device 15 includes an amplifier 55 and a comparator 56.
, a setting device 57, and an actuating device 58 including a delay circuit.
It is composed of etc. And the detection device 14
The processed signal from is amplified by an amplifier 55 and input to a comparator 56. In the comparator 56, the reference level signal preset in the setting device 57 and the processed signal are compared, and when the level becomes lower than the reference level signal, an actuation signal is output to the actuating device 58.
When the actuation signal is output, the output of the actuator 58 is inputted to the shutter 42 or the laser oscillator 41 as a control target after a certain period of time has elapsed through a delay circuit, and is then input to the shutter 42 (in this embodiment, an electromagnetic shutter is used). , closed by an external command) or the oscillation of the laser beam 12 is stopped.
次に上述ように構成された装置の作動とともに
本発明方法の実施態様を説明する。最初にレーザ
加工装置１３につき説明する。本発明方法におい
ては、切断部位６における集光スポツトのレーザ
パワー密度は管体５の表面を蒸発するに足りるも
のであればよく、パルス１発では、管体５の管壁
７を貫通するには不十分な、パルス幅の短いレー
ザパルスを利用する。これらのパルスレーザとし
ては、管壁７の肉厚10〜100ミクロンメータの管
体５に対しては、連続励起YAGレーザにＱスイ
ツチを設け、パルス幅が100〜300ns（ナノセカ
ンド）程度の周知のYAGレーザが適当である。 Next, an embodiment of the method of the present invention will be described along with the operation of the apparatus configured as described above. First, the laser processing device 13 will be explained. In the method of the present invention, the laser power density of the focused spot at the cutting site 6 only needs to be sufficient to evaporate the surface of the tube body 5, and one pulse is sufficient to penetrate the tube wall 7 of the tube body 5. utilizes insufficient, short laser pulses. For these pulsed lasers, for the tube body 5 whose wall thickness is 10 to 100 microns, a continuous pump YAG laser is equipped with a Q switch and has a pulse width of about 100 to 300 ns (nanoseconds). A YAG laser is suitable.
さて保持回転機構１１の保持子３２を通して管
体５を挿通し、その先端部をローラ３５，３５の
間に載置して支持する。なお素材としての管体５
が長い場合は、保持体２７から離間した位置に別
個に支持部材（図示しない）を設けることが望ま
しい。次に管体５の軸方向の位置ぎめ、すなわち
切断部位６とレーザビーム１２のスポツト位置と
を一致させた後、保持体２７およびローラ３５，
３５を回転させ、管体５が所定の位置において、
所定の回転速度に達したらレーザビーム１２を照
射する。レーザビーム１２の照射により管体５は
加工されるが、その際加工現象として発光する。
この加工光５３はレンズ４４、ダイクロイツクミ
ラー４３を通り、検出レンズ５１に入り、光電変
換体５２上に結像する。この入射光により、これ
の強さに応じた電気信号が加工信号として送出さ
れ、制御装置１５に入力する。その加工信号は、
増幅器５５により増幅され、比較器５６に入力す
る。ここにおいて、予め設定器５７に設定されて
いる基準レベル信号と比較される。この信号より
加工信号が大なる場合は比較器５６からは出力が
ない。切断加工が進行している間は、この状態が
継続する。この間は第３図に示すように、管体５
の管壁７に対し、レーザビーム１２のパルスは外
周から少しずつ管壁７の一部を蒸発除去して行
き、複数パルス後に、すなわち、管体５がレーザ
ビーム１２の照射の下に複数回転した後に第４図
に示すように切断が完了する。従つて切断完了直
前には大部分の切断部管壁７は蒸発除去されてい
て、極めてわずかな部分が溶融するので突起物は
小さい。さて、切断が完了すると、加工信号の出
力が著しく低下し、基準レベル信号の方が大にな
り、比較器５６から加工とぎれの検出信号として
作動信号が出され、作動装置５８に入る。作動装
置５８は、この入力により加工とぎれと判断し、
シヤツタ４２の閉塞とかレーザ発振器４１の発振
停止など要するにレーザビーム１２の照射を停止
するのであるが、これらの作動を遅延回路により
一定時間遅らせる。すなわち、本実施例において
は、管体５が１回転する時間遅らせてから作動す
る。しかしこの間に、もし加工残しの部分などが
あつて、加工光５３より加工信号のレベルが再び
上昇し基準レベル信号より大になると、加工とぎ
れの中断と判断し遅延開始以前の状態に戻る。加
工信号レベルが再び下つて作動信号が出される
と、このときから新規に遅延回路により一定時間
（１回転相当）作動は遅らされ、その遅回時間の
間加工とぎれが継続すると、作動装置５８の作動
によりシヤツタ４２の閉塞とか、レーザ発振停止
などの処置がとられ加工完了となる。 Now, the tubular body 5 is inserted through the retainer 32 of the holding and rotating mechanism 11, and its tip is placed between the rollers 35 and 35 for support. In addition, the pipe body 5 as a material
If the length is long, it is desirable to provide a separate support member (not shown) at a position spaced apart from the holder 27. Next, after aligning the tubular body 5 in the axial direction, that is, the cutting site 6 and the spot position of the laser beam 12, the holder 27 and the roller 35,
35, and when the tube body 5 is in a predetermined position,
When a predetermined rotational speed is reached, the laser beam 12 is irradiated. The tubular body 5 is processed by irradiation with the laser beam 12, and at this time, light is emitted as a processing phenomenon.
This processing light 53 passes through a lens 44 and a dichroic mirror 43, enters a detection lens 51, and forms an image on a photoelectric converter 52. An electric signal corresponding to the intensity of the incident light is sent out as a processing signal and input to the control device 15. The processed signal is
The signal is amplified by an amplifier 55 and input to a comparator 56. Here, it is compared with a reference level signal set in advance in the setting device 57. When the processed signal is greater than this signal, there is no output from the comparator 56. This state continues while the cutting process is in progress. During this time, as shown in FIG.
The pulse of the laser beam 12 gradually evaporates and removes a part of the tube wall 7 from the outer periphery. After that, the cutting is completed as shown in FIG. Therefore, immediately before the cutting is completed, most of the pipe wall 7 of the cut portion is evaporated and removed, and a very small portion is melted, so that the protrusions are small. Now, when the cutting is completed, the output of the machining signal drops significantly, the reference level signal becomes higher, and an actuation signal is output from the comparator 56 as a detection signal of a break in the machining, which is input to the actuator 58. The actuating device 58 determines that there is a break in processing based on this input,
In short, the irradiation of the laser beam 12 is stopped by closing the shutter 42 or stopping the oscillation of the laser oscillator 41, but these operations are delayed for a certain period of time by a delay circuit. That is, in this embodiment, the operation is performed after a delay of one rotation of the tubular body 5. However, during this time, if there is an unprocessed portion and the level of the processing signal from the processing light 53 rises again and becomes higher than the reference level signal, it is determined that the processing has been interrupted and the state returns to the state before the start of the delay. When the machining signal level falls again and an activation signal is issued, the operation is newly delayed by a delay circuit for a certain period of time (equivalent to one rotation), and if the machining interruption continues during this delay time, the activation device 58 By this operation, measures such as closing the shutter 42 and stopping laser oscillation are taken, and processing is completed.
上述の作動を要約すると第５図のようになる。
本図は縦軸に各信号のレベルを、横軸に時間をと
つたもので、各時間t1，t2……t5，t7の間は、それ
ぞれ管体５の１回転の時間を示す。図中ａのよう
に時間t1において、シヤツタ４２が開き、加工が
開始されたとする。時間t4まで加工が続けられ
て、加工信号ｐが得られ、時間t4を過ぎてから、
加工とぎれにより加工信号ｐのレベルが下り、時
間t5において作動信号Ｓが出されるが、作動装置
５８の作動は図中ｂのように時間t5から時間t7の
間遅らされる。しかし、例えば一部に末切断部な
どがあり、時間t5′においてパルス状に高レベル
の加工信号p′が出ると、遅延時間は時間t5′から新
規に一定時間後の時間t7′まで設定され、一定時
間加工とぎれの継続が検出されると図中ｃのよう
に時間t7′においてシヤツタ４２が閉じて切断加
工が完了する。なお本実施例においては、YAG
レーザのくり返し10KHzの連続パルスによるレー
ザビームで、Ｑスイツチパルスで平均出力6Wで
ある。また管体５は外径２mm、肉厚20μｍのニツ
ケルパイプで、管体５の回転速度は200r.p.m、
約0.2秒で切断した。 The above operation can be summarized as shown in FIG.
In this figure, the vertical axis shows the level of each signal, and the horizontal axis shows time. During each time t 1 , t 2 ... t 5 , t 7 , the time for one rotation of the tube 5 is shown. show. Assume that the shutter 42 is opened and machining is started at time t1 as shown in a in the figure. Processing continues until time t 4 , processing signal p is obtained, and after time t 4 ,
The level of the machining signal p decreases due to the interruption in machining, and the actuation signal S is issued at time t5 , but the actuation of the actuating device 58 is delayed from time t5 to time t7 as shown in b in the figure. However, for example, if there is an end cut in a part and a high-level processing signal p' is outputted in a pulse form at time t 5 ', the delay time is changed to a new time t 7 ' after a certain period of time from time t 5 '. When it is detected that the cutting has continued for a certain period of time, the shutter 42 closes at time t7 ' as shown in c in the figure, and the cutting process is completed. In this example, YAG
It is a laser beam with continuous pulses of 10KHz and has an average output of 6W with Q-switch pulses. The tube body 5 is a nickel pipe with an outer diameter of 2 mm and a wall thickness of 20 μm, and the rotation speed of the tube body 5 is 200 rpm.
It was cut in about 0.2 seconds.
以上詳述したように、本発明のレーザビームに
よる管体の切断方法は、一発では管壁を貫通し得
ないエネルギーのパルスの繰返しからなるレーザ
ビームで管体の外周を複数回転照射するので、外
側から少しずつ管壁は蒸発除去され、切断完了時
には極めてわずかな量が溶融除去されるので、内
面に突出する突起物は非常に小さく、断面も均一
になるので、管体内部に部品を挿入するに適した
高精度なスリーブが容易に得られ、また後処理も
不要なので安価に製造することができるなど種々
なすぐれた効果を奏するものである。 As detailed above, the method of cutting a tube using a laser beam of the present invention involves irradiating the outer periphery of the tube multiple times with a laser beam consisting of repeated pulses of energy that cannot penetrate the tube wall in one shot. The tube wall is gradually removed by evaporation from the outside, and when cutting is complete, a very small amount is melted and removed, so the protrusions protruding from the inner surface are very small and the cross section is uniform, making it easy to place parts inside the tube. A highly accurate sleeve suitable for insertion can be easily obtained, and since no post-processing is required, it can be manufactured at low cost, and has various excellent effects.
また本発明のレーザビームによる管体の切断装
置は、加工状態を検出し加工信号を送出する検出
装置と、この加工信号により加工とぎれを検出
し、遅延回路により管体１回転以上の所定時間遅
れてレーザ照射を制御する制御装置とを設けて構
成したので、レーザビームの照射を切断完了後も
１回転以上続けるため、付着した少量の突起物は
蒸発除去されるから断面均一で、しかも内面への
突起物が極めて少ない良品を得ることができる。
また加工とぎれ検出後、所定回転数を径るまでに
再び加工が発生した場合は、その再加工信号がと
ぎれてから新規に所定数回転する間レーザビーム
を照射するので確実に切断仕上げをすることがで
きる。 In addition, the tube cutting device using a laser beam of the present invention includes a detection device that detects the machining state and sends a machining signal, and a delay circuit that detects a break in the machining and delays the tube by a predetermined time of one revolution or more. Since the laser beam irradiation is continued for more than one revolution even after cutting is completed, a small amount of attached protrusions are evaporated and removed, resulting in a uniform cross-section and even inner surface. It is possible to obtain a good product with extremely few protrusions.
In addition, if machining occurs again before a predetermined number of revolutions has been reached after a break in machining is detected, the laser beam is irradiated for a new predetermined number of revolutions after the re-machining signal is interrupted, ensuring that the cutting is finished. I can do it.
第１図は従来のレーザビームによる管体の切断
方法の説明図、第２図は本発明の一実施例を示す
要部断面正面図、第３図および第４図は本発明方
法の一実施例の説明図、第５図は本発明の一実施
例の作動を説明する線図である。
５……管体、６……切断予定部位、７……管
壁、１１……保持回転機構、１２……レーザビー
ム、１４……検出装置、１５……制御装置、５６
……比較器、５８……作動装置。
Fig. 1 is an explanatory diagram of a conventional method for cutting a tube body using a laser beam, Fig. 2 is a cross-sectional front view of a main part showing an embodiment of the present invention, and Figs. 3 and 4 are illustrations of an embodiment of the method of the present invention. FIG. 5 is a diagram illustrating the operation of an embodiment of the present invention. 5... Tube body, 6... Cutting planned site, 7... Tube wall, 11... Holding rotation mechanism, 12... Laser beam, 14... Detection device, 15... Control device, 56
... Comparator, 58 ... Actuation device.
Claims (1)
断するレーザビームによる管体切断方法におい
て、上記レーザビームは一発では上記管体の管壁
を貫通し得らにエネルギーのパルスの連続繰返し
でありかつ上記管体の外周を少なくとも２回転以
上照射し漸次管厚を薄くして貫通切断することを
特徴とするレーザビームによる管体の切断方法。 ２ 切断加工される管体を保持して回転させる保
持回転機構と、保持回転された上記管体の切断予
定部位にレーザビームを照射しかつ上記レーザビ
ームは連続パルスからなるとともにこの連続パル
スは上記管体の管壁を一発では貫通しな得ないエ
ネルギーのパルスの連続であるレーザ加工装置
と、上記照射よる上記切断予定部位の加工状況を
検出しこれを検出信号として送出する検出装置
と、上記検出信号を受けこれのレベルと予め設定
された基準レベル信号とを比較し上記基準レベル
信号より上記検出信号のレベルが低下したとき加
工とぎれとして作動信号を出力する比較器および
上記作動信号により作動して上記レーザビームの
照射を制御する作動装置およびこの作動装置によ
る上記制御を少なくとも上記管体の１回転する時
間以上の所定時間を間遅延させかつ上記作動信号
の入力毎に新規に遅延を開始する遅延回路をもち
上記加工とぎれが上記所定時間継続したとき上記
制御する制御装置とを具備したことを特徴とする
レーザビームによる管体の切断装置。[Claims] 1. In a tube cutting method using a laser beam, in which the tube is irradiated with a laser beam to cut the tube, the laser beam cannot penetrate the wall of the tube in one shot. A method for cutting a tubular body using a laser beam, characterized in that pulses of energy are continuously repeated, the outer periphery of the tubular body is irradiated at least twice, and the thickness of the tube is gradually thinned to cut through the tube. 2. A holding and rotating mechanism that holds and rotates the tubular body to be cut, and a laser beam that irradiates a portion of the tubular body that is held and rotated to be cut, and that the laser beam is composed of continuous pulses, and the continuous pulses are as described above. a laser processing device that generates a series of pulses of energy that cannot penetrate the tube wall of the tubular body in one shot; a detection device that detects the processing status of the portion to be cut by the irradiation and sends it out as a detection signal; A comparator that receives the detection signal and compares its level with a preset reference level signal, and outputs an activation signal as a processing break when the level of the detection signal is lower than the reference level signal, and is activated by the activation signal. an actuating device that controls the irradiation of the laser beam; and a device that delays the control by the actuating device for a predetermined time equal to or longer than the time required for at least one rotation of the tube, and starts a new delay each time the actuating signal is input. 1. A tubular body cutting device using a laser beam, comprising: a delay circuit for controlling the processing when the processing interruption continues for the predetermined period of time;
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56078065A JPS57193289A (en) | 1981-05-25 | 1981-05-25 | Method and device for cutting of tubular body by laser beam |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56078065A JPS57193289A (en) | 1981-05-25 | 1981-05-25 | Method and device for cutting of tubular body by laser beam |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57193289A JPS57193289A (en) | 1982-11-27 |
| JPS6119352B2 true JPS6119352B2 (en) | 1986-05-16 |
Family
ID=13651439
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56078065A Granted JPS57193289A (en) | 1981-05-25 | 1981-05-25 | Method and device for cutting of tubular body by laser beam |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57193289A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62177339U (en) * | 1986-04-30 | 1987-11-11 |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4590652A (en) * | 1983-10-14 | 1986-05-27 | Apx Group Inc. | Method for fabricating an air gap pipe |
| JPS60223687A (en) * | 1984-04-20 | 1985-11-08 | Inoue Japax Res Inc | Cutting method by high energy beam |
| US4609807A (en) * | 1984-12-28 | 1986-09-02 | Midwest Laser Systems, Inc. | Apparatus and methods for laser severing metal tubular stock |
| US4656713A (en) * | 1985-10-24 | 1987-04-14 | Ap Industries, Inc. | Method for forming an air gap pipe |
| JPH0440037Y2 (en) * | 1988-09-14 | 1992-09-18 | ||
| DE102014005562A1 (en) * | 2014-04-15 | 2015-10-15 | H & T Marsberg Gmbh & Co. Kg | Cutting cylindrical hollow body |
| US11559856B2 (en) * | 2019-10-28 | 2023-01-24 | Robert Bosch Gmbh | Laser cutter adapted to cut rotating workpieces |
-
1981
- 1981-05-25 JP JP56078065A patent/JPS57193289A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62177339U (en) * | 1986-04-30 | 1987-11-11 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57193289A (en) | 1982-11-27 |
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