JPS6119619A - Resin composition - Google Patents
Resin compositionInfo
- Publication number
- JPS6119619A JPS6119619A JP13965784A JP13965784A JPS6119619A JP S6119619 A JPS6119619 A JP S6119619A JP 13965784 A JP13965784 A JP 13965784A JP 13965784 A JP13965784 A JP 13965784A JP S6119619 A JPS6119619 A JP S6119619A
- Authority
- JP
- Japan
- Prior art keywords
- acid
- unsaturated
- smc
- unsaturated polyester
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 18
- 239000002253 acid Substances 0.000 claims abstract description 22
- 229920006305 unsaturated polyester Polymers 0.000 claims abstract description 20
- 239000003822 epoxy resin Substances 0.000 claims abstract description 17
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 17
- 150000002148 esters Chemical class 0.000 claims abstract description 11
- 235000014113 dietary fatty acids Nutrition 0.000 claims abstract description 10
- 239000000194 fatty acid Substances 0.000 claims abstract description 10
- 229930195729 fatty acid Natural products 0.000 claims abstract description 10
- 150000004665 fatty acids Chemical class 0.000 claims abstract description 10
- -1 isocyanate compound Chemical class 0.000 claims description 19
- 239000012948 isocyanate Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 abstract description 14
- 238000000465 moulding Methods 0.000 abstract description 14
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 abstract description 10
- 239000002562 thickening agent Substances 0.000 abstract description 10
- 150000001875 compounds Chemical class 0.000 abstract description 8
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract description 5
- 239000000178 monomer Substances 0.000 abstract description 5
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 abstract description 4
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 235000021355 Stearic acid Nutrition 0.000 abstract description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 abstract description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 abstract description 2
- 239000008117 stearic acid Substances 0.000 abstract description 2
- 229920001228 polyisocyanate Polymers 0.000 abstract 2
- 239000005056 polyisocyanate Substances 0.000 abstract 2
- 239000003677 Sheet moulding compound Substances 0.000 description 30
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 14
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical group C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 229930185605 Bisphenol Natural products 0.000 description 5
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
- 239000000835 fiber Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 4
- 239000003365 glass fiber Substances 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- 239000000395 magnesium oxide Substances 0.000 description 4
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 4
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 4
- 229910044991 metal oxide Inorganic materials 0.000 description 4
- 150000004706 metal oxides Chemical class 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 3
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 3
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 239000003112 inhibitor Substances 0.000 description 3
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 3
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 3
- 230000008719 thickening Effects 0.000 description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 3
- 229920006337 unsaturated polyester resin Polymers 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- ULQISTXYYBZJSJ-UHFFFAOYSA-N 12-hydroxyoctadecanoic acid Chemical compound CCCCCCC(O)CCCCCCCCCCC(O)=O ULQISTXYYBZJSJ-UHFFFAOYSA-N 0.000 description 2
- 239000004412 Bulk moulding compound Substances 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 2
- 239000005058 Isophorone diisocyanate Substances 0.000 description 2
- 239000005639 Lauric acid Substances 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 235000010724 Wisteria floribunda Nutrition 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- GHVNFZFCNZKVNT-UHFFFAOYSA-N decanoic acid Chemical compound CCCCCCCCCC(O)=O GHVNFZFCNZKVNT-UHFFFAOYSA-N 0.000 description 2
- 230000018044 dehydration Effects 0.000 description 2
- 238000006297 dehydration reaction Methods 0.000 description 2
- UKMSUNONTOPOIO-UHFFFAOYSA-N docosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCC(O)=O UKMSUNONTOPOIO-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005886 esterification reaction Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000001530 fumaric acid Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 2
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000006082 mold release agent Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000004843 novolac epoxy resin Substances 0.000 description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 2
- 150000001451 organic peroxides Chemical class 0.000 description 2
- 239000012779 reinforcing material Substances 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000001308 synthesis method Methods 0.000 description 2
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- WBYWAXJHAXSJNI-VOTSOKGWSA-M .beta-Phenylacrylic acid Natural products [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 1
- UICXTANXZJJIBC-UHFFFAOYSA-N 1-(1-hydroperoxycyclohexyl)peroxycyclohexan-1-ol Chemical compound C1CCCCC1(O)OOC1(OO)CCCCC1 UICXTANXZJJIBC-UHFFFAOYSA-N 0.000 description 1
- 229940114072 12-hydroxystearic acid Drugs 0.000 description 1
- QYXHDJJYVDLECA-UHFFFAOYSA-N 2,5-diphenylcyclohexa-2,5-diene-1,4-dione Chemical compound O=C1C=C(C=2C=CC=CC=2)C(=O)C=C1C1=CC=CC=C1 QYXHDJJYVDLECA-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- GRWFFFOEIHGUBG-UHFFFAOYSA-N 3,4-Epoxy-6-methylcyclohexylmethyl-3,4-epoxy-6-methylcyclo-hexanecarboxylate Chemical compound C1C2OC2CC(C)C1C(=O)OCC1CC2OC2CC1C GRWFFFOEIHGUBG-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- BJEMXPVDXFSROA-UHFFFAOYSA-N 3-butylbenzene-1,2-diol Chemical group CCCCC1=CC=CC(O)=C1O BJEMXPVDXFSROA-UHFFFAOYSA-N 0.000 description 1
- OECTYKWYRCHAKR-UHFFFAOYSA-N 4-vinylcyclohexene dioxide Chemical compound C1OC1C1CC2OC2CC1 OECTYKWYRCHAKR-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- 235000021357 Behenic acid Nutrition 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- 239000005632 Capric acid (CAS 334-48-5) Substances 0.000 description 1
- 239000005635 Caprylic acid (CAS 124-07-2) Substances 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- WBYWAXJHAXSJNI-SREVYHEPSA-N Cinnamic acid Chemical compound OC(=O)\C=C/C1=CC=CC=C1 WBYWAXJHAXSJNI-SREVYHEPSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 1
- QORUGOXNWQUALA-UHFFFAOYSA-N N=C=O.N=C=O.N=C=O.C1=CC=C(C(C2=CC=CC=C2)C2=CC=CC=C2)C=C1 Chemical compound N=C=O.N=C=O.N=C=O.C1=CC=C(C(C2=CC=CC=C2)C2=CC=CC=C2)C=C1 QORUGOXNWQUALA-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 235000021314 Palmitic acid Nutrition 0.000 description 1
- 241000287462 Phalacrocorax carbo Species 0.000 description 1
- 229920000538 Poly[(phenyl isocyanate)-co-formaldehyde] Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 229910021627 Tin(IV) chloride Inorganic materials 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 229920002978 Vinylon Polymers 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- QEZIKGQWAWNWIR-UHFFFAOYSA-N antimony(3+) antimony(5+) oxygen(2-) Chemical compound [O--].[O--].[O--].[O--].[Sb+3].[Sb+5] QEZIKGQWAWNWIR-UHFFFAOYSA-N 0.000 description 1
- 229940116226 behenic acid Drugs 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- KXHPPCXNWTUNSB-UHFFFAOYSA-M benzyl(trimethyl)azanium;chloride Chemical compound [Cl-].C[N+](C)(C)CC1=CC=CC=C1 KXHPPCXNWTUNSB-UHFFFAOYSA-M 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
- 239000008116 calcium stearate Substances 0.000 description 1
- 235000013539 calcium stearate Nutrition 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 229930016911 cinnamic acid Natural products 0.000 description 1
- 235000013985 cinnamic acid Nutrition 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- BQQUFAMSJAKLNB-UHFFFAOYSA-N dicyclopentadiene diepoxide Chemical compound C12C(C3OC33)CC3C2CC2C1O2 BQQUFAMSJAKLNB-UHFFFAOYSA-N 0.000 description 1
- 230000032050 esterification Effects 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical group 0.000 description 1
- 238000009787 hand lay-up Methods 0.000 description 1
- CAYGQBVSOZLICD-UHFFFAOYSA-N hexabromobenzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1Br CAYGQBVSOZLICD-UHFFFAOYSA-N 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- WBYWAXJHAXSJNI-UHFFFAOYSA-N methyl p-hydroxycinnamate Natural products OC(=O)C=CC1=CC=CC=C1 WBYWAXJHAXSJNI-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229960002446 octanoic acid Drugs 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 235000021313 oleic acid Nutrition 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 150000007519 polyprotic acids Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- AOJFQRQNPXYVLM-UHFFFAOYSA-N pyridin-1-ium;chloride Chemical compound [Cl-].C1=CC=[NH+]C=C1 AOJFQRQNPXYVLM-UHFFFAOYSA-N 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 102200145384 rs34127778 Human genes 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 235000003441 saturated fatty acids Nutrition 0.000 description 1
- 150000004671 saturated fatty acids Chemical class 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- AUHHYELHRWCWEZ-UHFFFAOYSA-N tetrachlorophthalic anhydride Chemical compound ClC1=C(Cl)C(Cl)=C2C(=O)OC(=O)C2=C1Cl AUHHYELHRWCWEZ-UHFFFAOYSA-N 0.000 description 1
- TUNFSRHWOTWDNC-HKGQFRNVSA-N tetradecanoic acid Chemical compound CCCCCCCCCCCCC[14C](O)=O TUNFSRHWOTWDNC-HKGQFRNVSA-N 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 150000004670 unsaturated fatty acids Chemical class 0.000 description 1
- 235000021122 unsaturated fatty acids Nutrition 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
Landscapes
- Polyurethanes Or Polyureas (AREA)
Abstract
Description
【発明の詳細な説明】
(発明の利用分野)
本発明は樹脂組成物に関し、さらに詳しくは増粘剤とし
て多官能イソシアネート化合物を含有する、取扱い作業
性および成形時の流動性に優れた樹脂組成物に関する。Detailed Description of the Invention (Field of Application of the Invention) The present invention relates to a resin composition, and more particularly, a resin composition containing a polyfunctional isocyanate compound as a thickener and having excellent handling workability and fluidity during molding. relating to things.
(発明の背景)
従来、シートモールディング・コンパウンド(以下、S
MCと略す)法により浴槽等のFRP成形品を製造する
ことが行なわれている。この際増粘剤として、酸化マグ
ネシウム等の金属酸化物が常用されているが、この場合
には、成形品の耐水性および強度が低下するという欠点
があった。(Background of the invention) Conventionally, sheet molding compounds (hereinafter referred to as S
FRP molded products such as bathtubs are manufactured by the MC method. In this case, metal oxides such as magnesium oxide are commonly used as thickeners, but this has the disadvantage that the water resistance and strength of the molded product are reduced.
一方、増粘剤として多官能イソシアネート化合物を使用
する方法も行なわれているが、この場合には成形品の耐
水性および強度は向上するが、SMCの表面粘着性が著
しく増加し、取扱い作業に劣り、また成形時の流動性も
著しく低く、その結果成形品にショートショット、プリ
ゲル等が発生しやすいという欠点があった。On the other hand, a method of using a polyfunctional isocyanate compound as a thickener has also been carried out, but in this case, the water resistance and strength of the molded product are improved, but the surface tackiness of the SMC increases significantly, making it difficult to handle. In addition, the fluidity during molding was extremely low, and as a result, short shots, pregels, etc. were likely to occur in molded products.
そのためイソシアネート化合物と金属酸化物とを併用す
る方法(特開昭49−39691号)や、不飽和ポリエ
ステルの組成を限定する方法(特開昭57−12102
3号)が行なわれているが、充分満足なものとはいえな
い現状である。Therefore, there are methods of using an isocyanate compound and metal oxide in combination (Japanese Patent Laid-Open No. 49-39691), and methods of limiting the composition of unsaturated polyester (Japanese Patent Laid-Open No. 57-12102).
No. 3) has been carried out, but the current situation is that it cannot be said to be fully satisfactory.
(発明の目的)
本発明の目的は、前記従来技術の欠点を除去し、増粘剤
として多官能イソシアネート化合物を配合含有していて
も、取扱い作業性および成形時の流動性に優れた樹脂組
成物を提供することにある。(Objective of the Invention) The object of the present invention is to eliminate the drawbacks of the prior art, and to create a resin composition that has excellent handling workability and fluidity during molding even if it contains a polyfunctional isocyanate compound as a thickener. It's about providing things.
(発明の概要)
本発明者らは前記目的達成のため、多官能イソシアネー
ト化合物を増粘剤として使用した場合の成形品の優れた
耐水性および強度に着目して、SMCの表面粘着性およ
び成形時の流動性を改良すべく、鋭意研究の結果、本発
明に到達した。(Summary of the Invention) In order to achieve the above object, the present inventors focused on the excellent water resistance and strength of molded products when using a polyfunctional isocyanate compound as a thickener, and investigated the surface tackiness and moldability of SMC. As a result of extensive research, we have arrived at the present invention in order to improve the fluidity of this product.
本発明は、(A)エポキシ樹脂に不飽和一塩基酸を反応
させて得られる不飽和エステルおよび/または不飽和ポ
リエステル、(B)多官能イソシアネート化合物ならび
に(e)脂肪酸を含有してなる樹脂組成物に関する。The present invention provides a resin composition containing (A) an unsaturated ester and/or an unsaturated polyester obtained by reacting an epoxy resin with an unsaturated monobasic acid, (B) a polyfunctional isocyanate compound, and (e) a fatty acid. relating to things.
本発明に使用する不飽和ポリエステルの酸成分としては
、無水マレイン酸、フマル酸等の不飽和二塩基酸に、必
要に応じてイソフタル酸、テレフタル酸、オルソフタル
酸、無水フタル酸、テトラクロル無水フタル酸等の飽和
二塩基酸等が用いられる。The acid component of the unsaturated polyester used in the present invention includes unsaturated dibasic acids such as maleic anhydride and fumaric acid, and if necessary, isophthalic acid, terephthalic acid, orthophthalic acid, phthalic anhydride, and tetrachlorophthalic anhydride. Saturated dibasic acids such as
前記不飽和ポリエステルのアルコール成分としては、例
えばエチレングリコール、プロピレングリコール、ネオ
ペンチルグリコール、ジブロモネオペチルグリコール、
ジプロピレングリコール、2.2ビス〔パラ(ヒドロキ
シ−n−プロポキシ)フェニル〕プロパン、トリシクロ
デカンジオール、トリメチロールプロパン等の多価アル
コール等が用いられる。Examples of the alcohol component of the unsaturated polyester include ethylene glycol, propylene glycol, neopentyl glycol, dibromoneopetyl glycol,
Polyhydric alcohols such as dipropylene glycol, 2.2bis[para(hydroxy-n-propoxy)phenyl]propane, tricyclodecanediol, and trimethylolpropane are used.
本発明に用いる不飽和ポリエステルは、上記酸成分とア
ルコニル成分を縮合反応させたものでよいが、ジシクロ
ペンタジェンで変性した不飽和ポリエステルを使用する
こともでき、この変性不飽和ポリエステルの使用は、S
MCの表面粘着性を改善するうえで特に有効である。不
飽和ポリエステルをジシクロペンタジェンで変性する方
法としては、(1)酸成分およびアルコール成分と、ジ
シクロペンタジェンとを同時に仕込み、縮合と同時に変
性させる1段合成法、(2)酸成分およびアルコール成
分を縮合させ、途中でジシクロペンタジェンを加えて変
性させる2段合成法などかある0反応温度は150〜2
30℃の範囲が好ましい、ジシクロペンタジェンの添加
量は特に制限され°ないが、SMCの表面粘着性の改善
硬化や、強度の点から、酸成分1.0モルに対して、ジ
シクロ ”ペンタジェンが0.01〜0.
04モルの範囲が好ましい。The unsaturated polyester used in the present invention may be one obtained by condensing the acid component and the alconyl component, but it is also possible to use an unsaturated polyester modified with dicyclopentadiene. , S
It is particularly effective in improving the surface tackiness of MC. Methods for modifying unsaturated polyester with dicyclopentadiene include (1) a one-stage synthesis method in which an acid component, an alcohol component, and dicyclopentadiene are simultaneously charged and modified at the same time as condensation; (2) an acid component and There is a two-step synthesis method in which alcohol components are condensed and dicyclopentadiene is added during the process to denature the reaction temperature.
The amount of dicyclopentadiene added is preferably in the range of 30°C, but there is no particular restriction on the amount of dicyclopentadiene added. is 0.01~0.
A range of 0.04 mol is preferred.
本発明で使用する不飽和ポリエステルのヒドロキシル価
は、100〜5の範囲が好ましく、50〜15の範囲が
特に好ましい。また不飽和ポリエステルの酸価はイソシ
アネート化合物とカルボキシル基との反応による説炭酸
反応を防止する点で50〜5の範囲が好ましく、20〜
5の範囲が特に好ましい。The hydroxyl value of the unsaturated polyester used in the present invention is preferably in the range of 100 to 5, particularly preferably in the range of 50 to 15. In addition, the acid value of the unsaturated polyester is preferably in the range of 50 to 5, from the viewpoint of preventing carbonation reaction caused by the reaction between the isocyanate compound and the carboxyl group;
A range of 5 is particularly preferred.
本発明に使用するエポキシ樹脂としでは、例えばビスフ
ェノールエポキシ樹脂、ノボラックエポキシ樹脂、脂環
式エポキシ樹脂等が挙げられる。Examples of the epoxy resin used in the present invention include bisphenol epoxy resin, novolac epoxy resin, and alicyclic epoxy resin.
ビスフェノールエポキシ樹脂の市販品としては、例えば
シェル化学社製エピコート828、エピヨード1001
、エピコー)1004、旭化成工業社製AER−664
8,AER−331、AER−337、ダウケミカル社
製り、E、R330゜D、E、R66G、D、’E、R
664(いずれも商品名)等が挙げられる。また水素原
子の一部をハロゲン(例えば臭素)で置換したタイプの
樹脂、例えば東部化成社製エポー)YDB−340,Y
DB−400(いずれも商品名)等を使用するこノボラ
ックエポキシ樹脂の市販品としそは、例えばダウケミカ
ル社製り、E、N431、D、E、 −N43
8、シェル化i社製エピコート152、エピコート15
’4.fバ社製EPN1138等が挙゛げられる。
′
脂環式エポキシ樹脂としては、例えばビニルシクロヘキ
センジオキシド(チッソ社製、商品名チッソノックス2
06)1.ジシクロペンタジェンジオキシド(チッソノ
ックス207X) 、3.4−エポキシ−6−メチルシ
クロヘキシルメチル、3゜4−エポキシ−6−メチルシ
クロ↑キサンヵ、ルポネート(チッソノックス201)
等が挙げられる。Commercially available bisphenol epoxy resins include Epikote 828 and Epiiod 1001 manufactured by Shell Chemical Co., Ltd.
, Epicor) 1004, Asahi Kasei Corporation AER-664
8, AER-331, AER-337, manufactured by Dow Chemical Company, E, R330°D, E, R66G, D, 'E, R
664 (both are product names), etc. Also, a type of resin in which some of the hydrogen atoms are replaced with halogen (e.g. bromine), such as Epo (manufactured by Tobu Kasei Co., Ltd.) YDB-340, Y
Commercial products of this novolac epoxy resin using DB-400 (all trade names) are, for example, E, N431, D, E, -N43 manufactured by Dow Chemical Company.
8. Epikote 152, Epicoat 15 manufactured by Shell-i Co., Ltd.
'4. Examples include EPN1138 manufactured by fba.
' As the alicyclic epoxy resin, for example, vinyl cyclohexene dioxide (manufactured by Chisso Corporation, trade name Chissonox 2)
06)1. Dicyclopentadiene dioxide (Chissonox 207X), 3,4-epoxy-6-methylcyclohexylmethyl, 3゜4-epoxy-6-methylcyclo↑xanka, luponate (Chissonox 201)
etc.
これらのエポキシ樹脂は単独でまたは2種以上混合して
使用することができる。These epoxy resins can be used alone or in combination of two or more.
エポキシ樹脂に反応させる不飽和−場へ酸とし□
ては、例えばアクリル酸、メタクリル酸、クロトン酸、
珪皮酸、トリシクロ(5,2,1,O”)−4−デセン
−8または9残基と不飽和二塩基酸残基とを構成要素と
して含む部分エステル化カルボン酸等を使用することが
できる。また不飽和一塩基酸の一部をマレイン酸、フマ
ル酸、フタル酸、イソフタル酸等の多塩基酸で置きかえ
ることもできる。Examples of unsaturated acids to be reacted with epoxy resin include acrylic acid, methacrylic acid, crotonic acid,
Partially esterified carboxylic acids containing cinnamic acid, tricyclo(5,2,1,O'')-4-decene-8 or 9 residues and unsaturated dibasic acid residues as constituent elements, etc. can be used. It is also possible to partially replace the unsaturated monobasic acid with a polybasic acid such as maleic acid, fumaric acid, phthalic acid, or isophthalic acid.
エポキシ樹脂と不飽和一塩基酸とを、60〜150℃、
好ましくは70〜130℃に加熱反応させると不飽和エ
ステルエステルが得られる。エポキシ樹脂1当量に対し
て、不飽和一塩基酸は、はぼ1当量が使用される。Epoxy resin and unsaturated monobasic acid at 60 to 150°C,
Preferably, an unsaturated ester is obtained by heating the reaction at 70 to 130°C. Approximately 1 equivalent of the unsaturated monobasic acid is used per 1 equivalent of the epoxy resin.
生成する不飽和エステルの酸価は好ましくは50以下、
特に好ましくは20以下である。反応に際して重合によ
るゲル化を防止するために、例えばヒドロキノン、ジ第
3級ブチルカテコール、ヒドロキノンモノメチルエーテ
ル等の重合禁止剤を用いることが好ましい。The acid value of the unsaturated ester produced is preferably 50 or less,
Particularly preferably, it is 20 or less. In order to prevent gelation due to polymerization during the reaction, it is preferable to use a polymerization inhibitor such as hydroquinone, ditertiary butylcatechol, or hydroquinone monomethyl ether.
またこのエポキシ樹脂と不飽和一塩基酸とのエステル化
反応に際しては、例えばトリメチルベンジルアンモニウ
ムクロリド、ピリジニウムクロリド等のアンモニウム塩
、トリエチルアミン、ジメチルアニリン等の第3級アミ
ン、塩化第二鉄、水酸化リチウム、塩化リチウム、塩化
第二スズ等のエステル化触媒などを用いて反応時間を短
縮することもできる。In addition, in the esterification reaction between this epoxy resin and an unsaturated monobasic acid, for example, ammonium salts such as trimethylbenzylammonium chloride and pyridinium chloride, tertiary amines such as triethylamine and dimethylaniline, ferric chloride, lithium hydroxide, etc. The reaction time can also be shortened by using an esterification catalyst such as , lithium chloride, or stannic chloride.
本発明においては上記の不飽和エステル、不飽和ポリエ
ステルまたはこの両者が用いられる。In the present invention, the above-mentioned unsaturated ester, unsaturated polyester, or both are used.
本発明の樹脂組成物において増粘剤として使用される(
B)多官能イソシアネート化合物としては、例えばトリ
レンジイソシアネート、ジフェニルメタンジイソシアネ
ート、ヘキサメチレンジイソシアネート、ポリメチレン
ポリフェニルイソシアネート、トリフェニルメタントリ
イソシアネート、イソホロンジイソシアネート、これら
のイソシアネート類から導かれるイソシアネート末端プ
レポリマーなどの2価以上のイソシアネート化合物が用
いられる。これらの化合物のうちジフェニルメタンジイ
ソシアネート、ヘキサメチレンジイソシアネートおよび
イソホロンジイソシアネート□1
が取扱い作業性および増粘性の点で特に好ましい。Used as a thickener in the resin composition of the present invention (
B) Examples of polyfunctional isocyanate compounds include tolylene diisocyanate, diphenylmethane diisocyanate, hexamethylene diisocyanate, polymethylene polyphenylisocyanate, triphenylmethane triisocyanate, isophorone diisocyanate, and isocyanate-terminated prepolymers derived from these isocyanates. An isocyanate compound having a higher value than the above value is used. Among these compounds, diphenylmethane diisocyanate, hexamethylene diisocyanate and isophorone diisocyanate □1 are particularly preferred in terms of handling and workability and thickening properties.
本発明で使用される(C)脂肪酸としては、例えばカプ
ロン酸、カプリル酸、カプリン酸、ラウリン酸、ミリス
チン酸、パルミチン酸、ステアリン酸、ベヘニン酸、オ
レイン酸、12−ヒドロキシステアリン酸、リルイン酸
等の飽和または不飽和の脂肪酸が挙げられる。またこれ
らの脂肪酸はヒドロキシル基等の官能基を含んでいても
よい。Examples of fatty acids (C) used in the present invention include caproic acid, caprylic acid, capric acid, lauric acid, myristic acid, palmitic acid, stearic acid, behenic acid, oleic acid, 12-hydroxystearic acid, liluic acid, etc. saturated or unsaturated fatty acids. These fatty acids may also contain functional groups such as hydroxyl groups.
これらの化合物は単独でまたは2種以上混合して使用さ
れる。These compounds may be used alone or in combination of two or more.
さらに本発明の樹脂組成物は所望により重合性単量体を
含有してもよい。重合性単量体としては、例えばスチレ
ン、ジビニルベンゼン、ビニルトルエン、酢酸ビニル、
メタクリル酸メチル、アクリル酸エチル等があげられる
。Furthermore, the resin composition of the present invention may contain a polymerizable monomer if desired. Examples of polymerizable monomers include styrene, divinylbenzene, vinyltoluene, vinyl acetate,
Examples include methyl methacrylate and ethyl acrylate.
本発明の樹脂組成物において不飽和ポリエステルおよび
/または不飽和エステル、多官能イソシアネート化合物
、脂肪酸および重合性単量体の配合割合には、特に制限
はないが、不飽和ポリエステルおよび/または不飽和エ
ステルの使用量は20〜100重量部の範囲が好ましい
。In the resin composition of the present invention, there are no particular restrictions on the proportions of unsaturated polyester and/or unsaturated ester, polyfunctional isocyanate compound, fatty acid, and polymerizable monomer, but unsaturated polyester and/or unsaturated ester The amount used is preferably in the range of 20 to 100 parts by weight.
多官能イソシアネート化合物の使用量は、増粘効果およ
び含有水分9とイソシアネートの反応による発泡の防止
等から0.1〜10重量部が好ましい。The amount of the polyfunctional isocyanate compound to be used is preferably 0.1 to 10 parts by weight from the viewpoint of thickening effect and prevention of foaming due to reaction between water content 9 and isocyanate.
なお、増粘剤として、さらに酸化マグネシウム等の金属
酸化物や水酸化マグネシウム等の金属水酸化物を併用す
ることもできる。脂肪酸の使用量は、SMCの表面粘着
性および流動性向上、強度の面から0.1〜10重量部
あ範囲が好ましい。また重合性単量体の使用量は0〜8
0重量部の範囲が好ましい。In addition, as a thickener, a metal oxide such as magnesium oxide or a metal hydroxide such as magnesium hydroxide can also be used in combination. The amount of fatty acid used is preferably in the range of 0.1 to 10 parts by weight from the viewpoint of improving the surface tackiness and fluidity of SMC and improving the strength. In addition, the amount of polymerizable monomer used is 0 to 8
A range of 0 parts by weight is preferred.
本発明の樹脂組成物を用いて成形品を製造するに際して
は、必要に応じて例えば硬化用有機過酸化物、重合禁止
剤、充填剤、補強材、離型剤、着色剤等を添加混合する
ことができる。When manufacturing a molded article using the resin composition of the present invention, for example, a curing organic peroxide, a polymerization inhibitor, a filler, a reinforcing material, a mold release agent, a coloring agent, etc. are added and mixed as necessary. be able to.
硬化用有機過酸化物としては、例えばt−ブチルパーオ
キシベンゾエート、ベンゾイルパーオキサイド、ジクミ
ルパーオキサイド、クメンハイドロパーオキ号イド、シ
クロヘキサノンパーオキ号イド、メチルエチルケトンパ
ーオキサイド等が使用される。Examples of the organic peroxide used for curing include t-butyl peroxybenzoate, benzoyl peroxide, dicumyl peroxide, cumene hydroperoxide, cyclohexanone peroxide, and methyl ethyl ketone peroxide.
重合禁止剤としては、例えばハイドロキノン、バラベン
ゾキノン、カテコール、2,5−ジフェニルバラベンゾ
キノン等が使用される。As the polymerization inhibitor, for example, hydroquinone, parabenzoquinone, catechol, 2,5-diphenylparabenzoquinone, etc. are used.
充填剤としては、例えば炭酸カルシウム、クレー、硫酸
バリウム、水酸化アルミニウム等が使用される。As the filler, for example, calcium carbonate, clay, barium sulfate, aluminum hydroxide, etc. are used.
補強材としては、例えばガラス繊維、ビニロン繊維、炭
素繊維6、ポリアミド繊維等の繊維を集束したロービン
グ状のもの、短繊維、織物、編物、糸、組物等に加工し
たものなどが使用゛される。Examples of reinforcing materials used include roving-like fibers made of fibers such as glass fiber, vinylon fiber, carbon fiber 6, and polyamide fiber, and materials processed into short fibers, woven fabrics, knitted fabrics, threads, braided fabrics, etc. Ru.
離型剤としては、例えばステアリン酸亜鉛、ステアリン
酸カルシウム等が使用される。As the mold release agent, for example, zinc stearate, calcium stearate, etc. are used.
着色剤としては、不飽和ポリエステル樹脂の着色に常用
される無機系または有機系の着色剤が使用される。As the colorant, inorganic or organic colorants commonly used for coloring unsaturated polyester resins are used.
また本発明の樹脂組成物には、必要に応じて、例えばポ
リスチレン、ポリ酢酸ビニル、ポリメタクリル酸メチル
等の熱可塑性重合体や、フェノール樹脂、エポキシ樹脂
、メラミン樹脂等の熱硬化性重合体等を含有させてもよ
く、二酸化アンチモン、ヘキサブロムベンゼン、塩素化
パラフィン等の難燃剤を含有させてもよい。The resin composition of the present invention may also contain thermoplastic polymers such as polystyrene, polyvinyl acetate, and polymethyl methacrylate, and thermosetting polymers such as phenol resins, epoxy resins, and melamine resins. It may also contain flame retardants such as antimony dioxide, hexabromobenzene, and chlorinated paraffin.
本発明の樹脂組成物は、特にSMC法において有用であ
る。従来の酸化マグネシウム等の金属塩を用いる増粘方
法と異なり、本発明の樹脂組成物は、室温(20〜25
℃)においても速やかに増粘し、SMC作製後約4時間
で成形することも可能であり、また保温するための熟成
室なども不要である。また本発明の樹脂組成物は、バル
ク・モールディング・コンパウンド(BMC)法に適用
することもでき、プリフォームマツチドメタルダイ成形
法、ハンドレイアップ成形法、スプレーアップ成形法、
ルジンインジェクション成形法等に広(適用することも
できる。The resin composition of the present invention is particularly useful in the SMC method. Unlike conventional thickening methods using metal salts such as magnesium oxide, the resin composition of the present invention can be heated at room temperature (20 to 25
℃), it can be molded in about 4 hours after SMC production, and there is no need for a maturing chamber or the like to keep it warm. The resin composition of the present invention can also be applied to bulk molding compound (BMC) methods, such as preform matted metal die molding method, hand lay-up molding method, spray-up molding method,
It can also be widely applied to injection molding methods, etc.
(発明の効果)
本発明によれば、金属酸化物を増粘剤として使用する従
来方法のように、成形品の機械的強度および耐水性を低
下させることなく、増粘剤として多官能イソシアネート
化合物を含有していても、真
取扱い作業性および成形時の流動性に極めて優れた樹脂
組成物を得ることができる。(Effects of the Invention) According to the present invention, a polyfunctional isocyanate compound can be used as a thickener without reducing the mechanical strength and water resistance of a molded product, unlike the conventional method of using a metal oxide as a thickener. Even if the resin composition contains , it is possible to obtain a resin composition with extremely excellent handling workability and fluidity during molding.
(発明の実施例)
以下、実施例により本発明を説明する。下記例中の部は
重量部を意味する。(Examples of the Invention) The present invention will be explained below with reference to Examples. Parts in the examples below mean parts by weight.
実施例1
無水マレイン酸7.0モル、無水フタル酸、3.0モル
、プロピレングリコール7.0モ、ル、ジプロピレング
リコール4.5モルおよびハイドロキノン0.2gを室
温窒素気流下で混合し、150℃に昇温後、5時間を要
して150℃から210℃に昇温し、さらに5時間脱水
縮合し、酸価1511.ヒドロキシル価25の不飽和ポ
リエステルを得た。この不飽和ポリエステル65gをハ
イドロキノン0.01gを含むスチレン35gに溶解さ
せ、不飽和ポリエステル樹脂UP−1を得た。、この樹
脂、UP−,1を使用し、第1表に示す配合割合のイソ
ネー) t 43L(化成アップジョン社製ジフェニル
メタンジイソシアネート)、ステアリン酸NAA−18
0(日本油脂社製)およびその他?化合物を使用して、
ガラス繊維(富士ファイバーグラス社製ガラスロービン
グ、F、ER−0730の1インチチョツプドストラン
ド)含有量24(重量)%のSMCを作製した。このS
M C鵜室温(20〜25℃)で速やかに増粘し、2
4時間後のフィルム剥離性は良好であり、またSMC表
面のべダツキもみられず、良好な取扱い作業性を示した
。Example 1 7.0 mol of maleic anhydride, 3.0 mol of phthalic anhydride, 7.0 mol of propylene glycol, 4.5 mol of dipropylene glycol, and 0.2 g of hydroquinone were mixed at room temperature under a nitrogen stream, After raising the temperature to 150°C, it took 5 hours to raise the temperature from 150°C to 210°C, followed by dehydration condensation for another 5 hours, resulting in an acid value of 1511. An unsaturated polyester with a hydroxyl number of 25 was obtained. 65 g of this unsaturated polyester was dissolved in 35 g of styrene containing 0.01 g of hydroquinone to obtain unsaturated polyester resin UP-1. , this resin, UP-1, was used, and the blending ratio shown in Table 1 was used.
0 (manufactured by NOF Corporation) and others? using a compound,
An SMC containing 24% (by weight) of glass fiber (1-inch chopped strand of glass roving, F, ER-0730 manufactured by Fuji Fiberglass Co., Ltd.) was produced. This S
MC cormorant rapidly thickens at room temperature (20-25℃),
The film peelability after 4 hours was good, and no stickiness was observed on the SMC surface, indicating good handling workability.
このSMCを圧縮成形機で箱型を用いて成形(成形温度
140℃、圧力100kg/cd、時間3分、厚さ3m
)を行なったところ、優れた外観を示す成形品が得られ
た。また成形時にSMCが流動を始める圧力を測定した
ところ、3Qkg/cwと酸化マグネシウムで増粘させ
たSMCと同程度の圧力で流動し流動性に優れていた。This SMC was molded using a box shape using a compression molding machine (molding temperature 140℃, pressure 100kg/cd, time 3 minutes, thickness 3m)
), a molded product with an excellent appearance was obtained. Furthermore, when the pressure at which SMC starts to flow during molding was measured, it flowed at a pressure of 3 Q kg/cw, which was about the same as SMC thickened with magnesium oxide, and had excellent fluidity.
さらに成形品の機械的強度を測定たところ、高い値を示
し、特に耐衝撃性に優れていた。また成形品の耐水性を
調べたところ、低い煮沸吸水率を示し、また劣化後の機
械強度も高い値を示した。これらの結果を第1表に示す
。Furthermore, when the mechanical strength of the molded product was measured, it showed a high value and was particularly excellent in impact resistance. In addition, when the water resistance of the molded product was examined, it showed a low boiling water absorption rate and a high mechanical strength after deterioration. These results are shown in Table 1.
比較例1
実施例1で得られた樹脂UP−1を使用し、第1表に示
す配合割合のイソロー)143Lおよびその他の化合物
を使用し、脂肪酸を加えず、その他は実施例1と同様に
処理してSMCを作製した。Comparative Example 1 Resin UP-1 obtained in Example 1 was used, Isolo 143L and other compounds were used in the proportions shown in Table 1, no fatty acid was added, and the rest was the same as in Example 1. SMC was produced by processing.
このSMCは室温(20〜25℃)で速やかに増粘した
が、フィルム剥離性が著しく劣っており、またSMC表
面に粘着性がみられ、取扱い作業性が劣っていた。Although this SMC rapidly thickened at room temperature (20 to 25° C.), its film releasability was extremely poor, and the SMC surface showed tackiness, resulting in poor handling workability.
このSMCを実施例1と同様に処理して成形を行なった
ところ、SMCが流動を始める圧力は8Q kg /
cmと高く、流動性が劣っていた:これらの結果を第1
表に示す。When this SMC was processed and molded in the same manner as in Example 1, the pressure at which the SMC began to flow was 8Q kg/
cm, and the fluidity was poor: These results were
Shown in the table.
比較例2
無水マレイン酸7.0モル、無水フタル酸3.0モル、
プロピレングリコール7.0モル、ジプロピレングリコ
ール3.7モルおよびハイドロキノン0.2gを窒素気
流下で混合し、150℃に昇温後、5時間を要して15
0℃から210℃に昇温し、さらに5時間脱水縮合し、
酸価30、ヒドロキシル価15の不飽和ポリエステルを
得た。この不飽和ポリエステル65gをハイドロキノン
0.01 gを含むスチレン35gに熔解させ、不飽和
ポリエステル樹脂UP−2を得た。この樹脂UP−2を
使用し、第1表に示す配合割合のマグネシウムおよびそ
の他の化合物を使用して、ガラス繊維含有量24(重量
)%のSMCを作製した。このSMCは40℃で48時
間熟成させる必要があった。Comparative Example 2 Maleic anhydride 7.0 mol, phthalic anhydride 3.0 mol,
7.0 mol of propylene glycol, 3.7 mol of dipropylene glycol, and 0.2 g of hydroquinone were mixed under a nitrogen stream, and after heating to 150°C, it took 5 hours to
The temperature was raised from 0°C to 210°C, and dehydration condensation was further carried out for 5 hours.
An unsaturated polyester having an acid value of 30 and a hydroxyl value of 15 was obtained. 65 g of this unsaturated polyester was dissolved in 35 g of styrene containing 0.01 g of hydroquinone to obtain unsaturated polyester resin UP-2. Using this resin UP-2 and magnesium and other compounds in the proportions shown in Table 1, an SMC with a glass fiber content of 24% (by weight) was produced. This SMC required aging at 40°C for 48 hours.
このSMCを実施例1と同様に処理して成形を行なった
ところ、SMCが流動を始める圧力は30kg/−であ
った。成形品の機械的強度および耐水性についても実施
例1と同様にして試験したが、いずれも実施例1の場合
より劣っていた。これらの結果を第1表に示す。When this SMC was treated and molded in the same manner as in Example 1, the pressure at which the SMC began to flow was 30 kg/-. The mechanical strength and water resistance of the molded article were also tested in the same manner as in Example 1, but both were inferior to those in Example 1. These results are shown in Table 1.
以下余白
ン
注 ■ レオメータ−法:圧縮荷重320g/ad(2
0φ円盤
の引きはがし力)
■ 圧力変換機を用いてプレスの加圧時の圧力を検出し
て、SMCの流動が
始まったときの圧力を測定した。Notes in the following margin ■ Rheometer method: Compressive load 320 g/ad (2
(Peeling force of 0φ disk) (2) A pressure transducer was used to detect the pressure when the press was pressurized, and the pressure when the SMC started flowing was measured.
■ JISK6911に準じて測定した。■ Measured according to JISK6911.
■ 曲げ強さ保持率
実施例2
メタアクリル酸172.6 g (2,0モル)、エピ
コート828 (シェル化学社製ビスフェノールエポキ
シ樹脂、エポキシ当量189)151.2g (0,4
0モル)、エピコート1.001(シェル化学社製ビス
フェノールエポキシ樹脂、エポキシ当量475)570
.0g (0,60モル)、エピコート1001 (
シェル化学社製ビスフェノールエポキシ樹脂、エポキシ
当量475)570.0g (0,60モル)、ヒドロ
キノン0.40 gおよびトリノチルベンジルアンモニ
ウムクロリド0.50gt−1120℃で7時間加熱し
て、不飽和エステルを得た。■ Bending strength retention Example 2 Methacrylic acid 172.6 g (2.0 mol), Epicote 828 (Shell Chemical Co., Ltd. bisphenol epoxy resin, epoxy equivalent 189) 151.2 g (0.4
0 mol), Epicote 1.001 (bisphenol epoxy resin manufactured by Shell Chemical Co., Ltd., epoxy equivalent: 475) 570
.. 0 g (0,60 mol), Epicote 1001 (
Bisphenol epoxy resin manufactured by Shell Chemical Co., Ltd., epoxy equivalent 475) 570.0 g (0.60 mol), hydroquinone 0.40 g and trinotylbenzylammonium chloride 0.50 gt - 11 Heated at 20°C for 7 hours to remove the unsaturated ester. Obtained.
次いで得られた酸価9の不飽和エステル70部とスチレ
ン30部とを混合して、不飽和エステル樹脂VE−1を
得た。この樹脂、VB−1を使用し、第・2表に示す配
合割合のイソネー)143L、ラウリン酸NAA−12
2(日本油脂社製)およびその他の化合物を使用して、
ガラス繊維(富士ファイバーグラス社製、ガラスロービ
ング、FER−0730の1インチチョツプドストラン
ド)含、有量601i量%のSMCを作製した。このS
MCは室温(20〜25℃)で速やかに増粘し、24時
間後のフィルム剥離性は良好であり、またSMC表面の
ベタツキもみられず、良好な取扱い作業性を示した。Then, 70 parts of the obtained unsaturated ester having an acid value of 9 and 30 parts of styrene were mixed to obtain an unsaturated ester resin VE-1. Using this resin, VB-1, isone) 143L and lauric acid NAA-12 with the blending ratio shown in Table 2.
2 (manufactured by NOF Corporation) and other compounds,
An SMC containing glass fiber (manufactured by Fuji Fiber Glass Co., Ltd., glass roving, 1-inch chopped strand of FER-0730) and having an amount of 601i was produced. This S
MC rapidly thickened at room temperature (20 to 25°C), had good film removability after 24 hours, and no stickiness was observed on the SMC surface, indicating good handling workability.
このSMCを圧縮成形機で箱型を用いて成形(成形温度
140℃、圧力100kg/cd、時間3分、厚さ3鶴
)を行なったところ、優れた外観を示す成形品が得られ
た。また成形時にSMCが流動を始める圧力を測定した
ところ、4.Qkg/c+Jであり、流動性に優れてい
た。さらに成形品の機械的強度を測定したとる、高い値
を示した。これらの結果を第2表に示す。When this SMC was molded using a box-shaped compression molding machine (molding temperature: 140° C., pressure: 100 kg/cd, time: 3 minutes, thickness: 3 mm), a molded product with an excellent appearance was obtained. We also measured the pressure at which SMC starts to flow during molding, and found that 4. Qkg/c+J, and had excellent fluidity. Furthermore, when the mechanical strength of the molded product was measured, it showed a high value. These results are shown in Table 2.
比較例3
実施例2で得られた樹脂VE−1を使用し、第2表に示
す配合割合のイソネート143Lおよびその他の化合物
を使用し、脂肪酸を加えず、その他は実施例2と同様に
処理してSMCを作製した。Comparative Example 3 Resin VE-1 obtained in Example 2 was used, Isonate 143L and other compounds were used in the proportions shown in Table 2, no fatty acid was added, and the rest was treated in the same manner as in Example 2. SMC was prepared by doing this.
このSMCは室温(20〜25℃)で速やかに増粘した
が、フィルム剥離性が着く劣っており、またSMC表面
に粘着性がみられ、取扱い作業性が劣っていた。This SMC rapidly thickened at room temperature (20 to 25°C), but had poor film releasability, and adhesiveness was observed on the SMC surface, resulting in poor handling and workability.
このSMCを実施例2と同様に処理して成形を行なった
ところ、SMCが流動を始める圧力は85kg/cdと
高く、流動性が劣っていた。これらの結果を第2表に示
す。When this SMC was treated and molded in the same manner as in Example 2, the pressure at which the SMC began to flow was as high as 85 kg/cd, and the fluidity was poor. These results are shown in Table 2.
原子余白 幹 第2表 注 ■〜■の測定法は第1表と同じ。atomic margin stem Table 2 Note: Measurement methods for ■ to ■ are the same as in Table 1.
第1表および第2表の結果から明らかなように、本発明
の樹脂組成物は、比較例2の場合に比して、取扱い作業
性および成形時の流動性に優れており、しかも機械的強
度および耐水性にも優れている。As is clear from the results in Tables 1 and 2, the resin composition of the present invention has excellent handling workability and fluidity during molding, as well as mechanical properties, compared to Comparative Example 2. It also has excellent strength and water resistance.
Claims (1)
得られる不飽和エステルおよび/または不飽和ポリエス
テル、(B)多官能イソシアネート化合物ならびに(C
)脂肪酸を含有してなる樹脂組成物。1, (A) an unsaturated ester and/or an unsaturated polyester obtained by reacting an epoxy resin with an unsaturated monobasic acid, (B) a polyfunctional isocyanate compound, and (C
) A resin composition containing a fatty acid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13965784A JPS6119619A (en) | 1984-07-05 | 1984-07-05 | Resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13965784A JPS6119619A (en) | 1984-07-05 | 1984-07-05 | Resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6119619A true JPS6119619A (en) | 1986-01-28 |
| JPS6361332B2 JPS6361332B2 (en) | 1988-11-29 |
Family
ID=15250369
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13965784A Granted JPS6119619A (en) | 1984-07-05 | 1984-07-05 | Resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6119619A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4822849A (en) * | 1987-08-03 | 1989-04-18 | Reichhold Chemicals, Inc. | Low shrink hybrid resins |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50126059A (en) * | 1974-03-26 | 1975-10-03 | ||
| JPS5513119A (en) * | 1978-07-13 | 1980-01-30 | Ajinomoto Co Inc | Solidifying agent for organic medium |
| JPS5560513A (en) * | 1978-10-31 | 1980-05-07 | Dainippon Ink & Chem Inc | Unsaturated polyester resin composition |
| JPS56150530A (en) * | 1980-04-24 | 1981-11-21 | Dainippon Ink & Chem Inc | Forming method for thermohardening resin |
-
1984
- 1984-07-05 JP JP13965784A patent/JPS6119619A/en active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50126059A (en) * | 1974-03-26 | 1975-10-03 | ||
| JPS5513119A (en) * | 1978-07-13 | 1980-01-30 | Ajinomoto Co Inc | Solidifying agent for organic medium |
| JPS5560513A (en) * | 1978-10-31 | 1980-05-07 | Dainippon Ink & Chem Inc | Unsaturated polyester resin composition |
| JPS56150530A (en) * | 1980-04-24 | 1981-11-21 | Dainippon Ink & Chem Inc | Forming method for thermohardening resin |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4822849A (en) * | 1987-08-03 | 1989-04-18 | Reichhold Chemicals, Inc. | Low shrink hybrid resins |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6361332B2 (en) | 1988-11-29 |
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