JPS61196533U - - Google Patents

Info

Publication number
JPS61196533U
JPS61196533U JP1985081443U JP8144385U JPS61196533U JP S61196533 U JPS61196533 U JP S61196533U JP 1985081443 U JP1985081443 U JP 1985081443U JP 8144385 U JP8144385 U JP 8144385U JP S61196533 U JPS61196533 U JP S61196533U
Authority
JP
Japan
Prior art keywords
pellet
light
camera
illuminating
light source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985081443U
Other languages
English (en)
Other versions
JPH0219969Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985081443U priority Critical patent/JPH0219969Y2/ja
Publication of JPS61196533U publication Critical patent/JPS61196533U/ja
Application granted granted Critical
Publication of JPH0219969Y2 publication Critical patent/JPH0219969Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案に係るワイヤボンデイング用照
明装置の一実施例を示す概略側面図、第２図は本
考案に係るワイヤボンデイング用照明装置の他の
実施例を示す概略側面図、第３図は第１図実施例
の動作説明図、第４図と第５図はリードフレーム
の放熱板にマウントされた半導体ペレツトの部分
側面図と部分平面図、第６図は半導体ペレツトの
電極パツドの部分平面図、第７図は第６図の電極
パツドの映像信号の波形図、第８図は第７図の波
形の２値化波形図、第９図と第１０図は従来のワ
イヤボンデイング用照明装置の各概略側面図であ
る。 １……半導体ペレツト、３……放熱板、９……
ＴＶカメラ、１１，１２，１５……光源、１３，
１４…絞り板。

Claims (1)

    【実用新案登録請求の範囲】
  1. 放熱板上に載置された半導体ペレツトと該ペレ
    ツトに対向・配置されたＴＶカメラとの間に上記
    ペレツト上を照明する光源を配置したものにおい
    て、上記光源の照射光を散乱させて上記ペレツト
    上に照射する機能を有すると共に該ペレツトから
    の反射光を制限する絞り板を上記ＴＶカメラとペ
    レツトとの間に配置したことを特徴とするワイヤ
    ボンデイング用照明装置。
JP1985081443U 1985-05-30 1985-05-30 Expired JPH0219969Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985081443U JPH0219969Y2 (ja) 1985-05-30 1985-05-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985081443U JPH0219969Y2 (ja) 1985-05-30 1985-05-30

Publications (2)

Publication Number Publication Date
JPS61196533U true JPS61196533U (ja) 1986-12-08
JPH0219969Y2 JPH0219969Y2 (ja) 1990-05-31

Family

ID=30628228

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985081443U Expired JPH0219969Y2 (ja) 1985-05-30 1985-05-30

Country Status (1)

Country Link
JP (1) JPH0219969Y2 (ja)

Also Published As

Publication number Publication date
JPH0219969Y2 (ja) 1990-05-31

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