JPS6119783A - Copper colloid catalyst solution for electroless plating and its preparation - Google Patents
Copper colloid catalyst solution for electroless plating and its preparationInfo
- Publication number
- JPS6119783A JPS6119783A JP13961984A JP13961984A JPS6119783A JP S6119783 A JPS6119783 A JP S6119783A JP 13961984 A JP13961984 A JP 13961984A JP 13961984 A JP13961984 A JP 13961984A JP S6119783 A JPS6119783 A JP S6119783A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- solution
- electroless plating
- gelatin
- metal particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010949 copper Substances 0.000 title claims abstract description 53
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 49
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 49
- 239000003054 catalyst Substances 0.000 title claims abstract description 24
- 238000007772 electroless plating Methods 0.000 title claims abstract description 15
- 239000000084 colloidal system Substances 0.000 title abstract description 16
- 238000002360 preparation method Methods 0.000 title 1
- 239000000243 solution Substances 0.000 claims abstract description 25
- 239000007864 aqueous solution Substances 0.000 claims abstract description 17
- 229920001223 polyethylene glycol Polymers 0.000 claims abstract description 17
- 239000002202 Polyethylene glycol Substances 0.000 claims abstract description 16
- 239000002923 metal particle Substances 0.000 claims abstract description 16
- 108010010803 Gelatin Proteins 0.000 claims abstract description 14
- 229920000159 gelatin Polymers 0.000 claims abstract description 14
- 239000008273 gelatin Substances 0.000 claims abstract description 14
- 235000019322 gelatine Nutrition 0.000 claims abstract description 14
- 235000011852 gelatine desserts Nutrition 0.000 claims abstract description 14
- YPTUAQWMBNZZRN-UHFFFAOYSA-N dimethylaminoboron Chemical compound [B]N(C)C YPTUAQWMBNZZRN-UHFFFAOYSA-N 0.000 claims abstract 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 14
- 229910001431 copper ion Inorganic materials 0.000 claims description 14
- 239000007788 liquid Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 abstract description 11
- 239000002184 metal Substances 0.000 abstract description 11
- 239000003513 alkali Substances 0.000 abstract description 3
- 229920003023 plastic Polymers 0.000 abstract description 3
- 239000004033 plastic Substances 0.000 abstract description 3
- 230000032683 aging Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract description 2
- 238000001556 precipitation Methods 0.000 abstract description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 14
- 229910052763 palladium Inorganic materials 0.000 description 7
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 4
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000005187 foaming Methods 0.000 description 3
- 230000005070 ripening Effects 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 150000003606 tin compounds Chemical class 0.000 description 3
- JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- UORVGPXVDQYIDP-UHFFFAOYSA-N borane Chemical compound B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 description 2
- RJTANRZEWTUVMA-UHFFFAOYSA-N boron;n-methylmethanamine Chemical compound [B].CNC RJTANRZEWTUVMA-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 238000006722 reduction reaction Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 1
- RILZRCJGXSFXNE-UHFFFAOYSA-N 2-[4-(trifluoromethoxy)phenyl]ethanol Chemical compound OCCC1=CC=C(OC(F)(F)F)C=C1 RILZRCJGXSFXNE-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 229910000085 borane Inorganic materials 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000004925 denaturation Methods 0.000 description 1
- 230000036425 denaturation Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000001119 stannous chloride Substances 0.000 description 1
- 235000011150 stannous chloride Nutrition 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
Description
【発明の詳細な説明】
（技術分野）
本発明は無電解めっき用銅コロイド触媒液およびその製
造方法に係わり、詳しくは電気絶縁物性特にプラスチッ
クを活性化して無電解めっきによる金属被覆工程の準備
を行なうための銅コロイド触媒液に関するものである。Detailed Description of the Invention (Technical Field) The present invention relates to a copper colloidal catalyst solution for electroless plating and a method for producing the same, and more specifically, to activate electrical insulating properties, particularly plastics, to prepare for a metal coating process by electroless plating. The present invention relates to a copper colloidal catalyst solution for carrying out this process.
（従来技術）
一般に電子工業においてはプラスチックを無Ｎ１解めっ
きにより金属被覆し導電化することが広く行なわｎてい
る。例えば印刷配線板の製造においては、銅張りエポキ
シ樹脂積層板の表面の所望の位置に貫通孔を形成した後
貫通孔壁に無電解めっき用触媒を吸着させ次いで無電解
銅めっき等の無電解めっきにより貫通孔壁面に金属被覆
を行ない貫通孔壁面を導電化することが行なわれている
。(Prior Art) Generally, in the electronics industry, plastics are coated with metal by N1-free plating to make them conductive. For example, in the production of printed wiring boards, after forming through holes at desired positions on the surface of a copper-clad epoxy resin laminate, an electroless plating catalyst is adsorbed onto the walls of the through holes, and then electroless plating such as electroless copper plating is performed. Accordingly, the walls of the through-holes are coated with metal to make the walls of the through-holes electrically conductive.
無電解めっき用触媒としてはパラジウム金属が、一般に
使用されておりパラジウム金属の貫通孔壁面への形成は
、貫通孔壁面を塩化第一錫と塩化パラジウムの混合コロ
イド水溶液に接触させた後水洗する。この貫通孔壁面へ
はパラジウム金属と錫化合物が同時に吸着する。無電解
めっきの触媒となるためにはパラジウム金属と同時に吸
着した錫化合物を塩酸溶液あるいはホウフッ化水素酸溶
液に浸漬して除去し、パラジウム金属が露出するように
しなければならない。しかし上記酸水溶液に浸漬する際
、錫化合物の除去と同時にパラジウム金属も除去される
場合がある。特に銅張りエポキシ樹脂積層板の貫通孔壁
のガラス表面からはパラジウム金属が除去されやすく、
シばしば貫通孔壁への無電解鋼めっき析出不良の原因と
なっていた。Palladium metal is generally used as a catalyst for electroless plating, and palladium metal is formed on the wall surface of the through hole by bringing the wall surface of the through hole into contact with a mixed colloidal aqueous solution of stannous chloride and palladium chloride, and then washing with water. Palladium metal and a tin compound are simultaneously adsorbed onto the wall surface of this through hole. In order to serve as a catalyst for electroless plating, the tin compound adsorbed at the same time as the palladium metal must be removed by immersion in a hydrochloric acid solution or a fluoroboric acid solution to expose the palladium metal. However, when immersing in the above acid aqueous solution, palladium metal may also be removed at the same time as the tin compound is removed. In particular, palladium metal is easily removed from the glass surface of the through-hole wall of copper-clad epoxy resin laminates.
This often caused poor electroless steel plating deposition on the through-hole walls.
（発明の目的）
本発明の目的は上記従来の無電解めっき用触媒液の欠点
を除去した新規な無電解めっき用触媒液およびその製造
方法を提供することにある。(Object of the Invention) An object of the present invention is to provide a novel catalyst solution for electroless plating that eliminates the drawbacks of the conventional catalyst solution for electroless plating, and a method for producing the same.
（発明の構成）
本発明の無電解めっき用触媒液は、銅金属粒子の濃度が
０．３ｇ／ｊ！以上と銅金属粒子１ｇ当りセラチン０．
８ｇ以上と平均分子量１，ｏ ｏ ｏ〜２０，０００の
ポリエチレングリコールを含むＰＨ２〜４の銅コロイド
水溶液から成り、銅コロイド水溶液は２価の銅イオンと
平均分子量１，０００〜２０，０００のポリエチレング
リコールと２価の銅イオンＩｇ当り、前記ポリエチレン
グリコールの存在下でアルカリ熟成した。、ｓｇ以上の
ゼラチンを含むＰＨ１〜２゜かつ液温４０〜７０℃の水
溶液に２価の銅イオン１ｇ当り１．２ｇ以上のジメチル
アミンボランを添加し、２価の銅イオンを金属銅に還元
した後、該水溶液のＰＨを２〜４に調整することから製
造される。(Structure of the Invention) The catalyst liquid for electroless plating of the present invention has a concentration of copper metal particles of 0.3 g/j! In addition to the above, ceratin per gram of copper metal particles is 0.
It consists of a copper colloid aqueous solution with a pH of 2 to 4 containing polyethylene glycol of 8 g or more and an average molecular weight of 1,000 to 20,000, and the copper colloid aqueous solution contains divalent copper ions and polyethylene with an average molecular weight of 1,000 to 20,000. Alkaline ripening was performed in the presence of the polyethylene glycol per glycol and Ig of divalent copper ion. , 1.2 g or more of dimethylamine borane per 1 g of divalent copper ions is added to an aqueous solution containing gelatin of sg or more with a pH of 1 to 2° and a liquid temperature of 40 to 70°C to reduce the divalent copper ions to metallic copper. After that, the pH of the aqueous solution is adjusted to 2-4.
本発明の銅コロイド触媒液において、アルカリ熟成した
ゼラチンを使用すると銅コロイドの吸着性および安定性
が著しく向上することケ見い出した。銅コロイド触媒液
中のゼラチンの濃度は銅金属粒子１ｇ当り０８ｇ以上が
必要であり、ゼラチンの！１度が０８ｇより減少すると
銅金属粒子が凝集沈殿する。また本発明の銅コロイド触
媒液の製造において２価の銅イオン源としては、硫酸鋼
あるいは水酸化第２銅が使用でき、水溶液のＰＨ調整に
は硫酸および木酸化ナトＩＪウムあるいは水酸化カリウ
ムが使用される。２価の銅イオンをジメチルアミンポラ
ンで還元する際、水素ガスの発生に伴い発泡するが水溶
液中の泡立ちを減少させ、２価の銅イオンの還元反応を
均一にするためにブチルアルコール等の消泡性のおるア
ルコールを使用してもよい。It has been found that when alkali-ripened gelatin is used in the copper colloid catalyst solution of the present invention, the adsorption and stability of copper colloids are significantly improved. The concentration of gelatin in the copper colloidal catalyst solution must be 0.8 g or more per 1 g of copper metal particles, and the concentration of gelatin must be at least 0.8 g per 1 g of copper metal particles. When 1 degree decreases below 08 g, copper metal particles coagulate and precipitate. Further, in the production of the copper colloidal catalyst solution of the present invention, steel sulfate or cupric hydroxide can be used as a divalent copper ion source, and sulfuric acid and sodium wood oxide or potassium hydroxide can be used to adjust the pH of the aqueous solution. used. When divalent copper ions are reduced with dimethylamine poran, foaming occurs due to the generation of hydrogen gas, but in order to reduce the foaming in the aqueous solution and to make the reduction reaction of divalent copper ions uniform, a quencher such as butyl alcohol is used. Foaming alcohol may also be used.
本発明のポリエチレングリコールは、２価の銅イオンの
ジメチルアミンボランによる還元速度をコノトロールし
、微小鋼金属粒子の生成に寄与し、その添加量は２価の
銅イオン１ｇ当ｔ） ０．８ ｇ以上が適当である。ポ
リエチレングリコールはゼラチンのアルカリ熟成の際添
加されるが、この場合ポリエチレングリコールはゼラチ
ンのアルカリによる熟成度（変性度）をコントロールす
る。ジメチルアミノボラ７により還元された２価の銅イ
オ／は銅金属粒子となり、ゼラチンにより保護されコロ
イド粒子（銅コロイド）を形成する。銅コロイドはＰＨ
４以下で安定でありＰＨが４をこえると銅コロイドは凝
集沈殿してしまう。銅コロイドの銅張りエポキシ樹脂積
層板の貫通孔壁への吸着は銅コロイド触媒液のＰＨが２
〜４ですぐれており、また該貫通孔壁に吸着した銅コロ
イドのゼラチン保護膜（銅金属粒子を保護している膜）
は水洗により容易に除去され、銅金属粒子が該貫通孔壁
′に残り、無電解めっき用触媒として働く。なお銅コロ
イド触媒液中の銅金属粒子の濃度は０．３ｇ／／以上が
適当であり、０．３ｇ／／よりも減少すると銅コロイド
の吸着性が著しく減少する。The polyethylene glycol of the present invention controls the rate of reduction of divalent copper ions by dimethylamine borane and contributes to the production of micro steel metal particles, and the amount added is 0.8 g (t) per 1 g of divalent copper ions. The above is appropriate. Polyethylene glycol is added during alkaline ripening of gelatin, and in this case polyethylene glycol controls the degree of ripening (denaturation degree) of gelatin with alkali. Divalent copper io/ reduced by dimethylaminobora 7 becomes copper metal particles, which are protected by gelatin to form colloidal particles (copper colloid). Copper colloid has a pH
It is stable at a pH of 4 or less, and if the pH exceeds 4, the copper colloid will coagulate and precipitate. Adsorption of copper colloid to the through-hole walls of a copper-clad epoxy resin laminate occurs when the pH of the copper colloid catalyst solution is 2.
It is excellent in ~4 and also has a gelatin protective film of copper colloid adsorbed on the wall of the through hole (a film that protects copper metal particles).
is easily removed by washing with water, and the copper metal particles remain on the through-hole walls and act as a catalyst for electroless plating. Note that the concentration of copper metal particles in the copper colloid catalyst liquid is suitably 0.3 g// or more, and if it decreases below 0.3 g//, the adsorption of copper colloid will be significantly reduced.
（実施例） 以下、本発明を実施例により詳細に説明する。(Example) Hereinafter, the present invention will be explained in detail with reference to Examples.
〔実施例−１〕
セラチン１０ｇと平均分子量１，ｏ ｏ ｏのポリエチ
レングリコール１０ｇ１約７００ｍ／の純水に溶解し、
液温６０℃に保持しながら２８％（重量％）の水酸化ナ
トリウムを１５ｍＡ！添加し、約１ｏ分間アルカリ熟成
した。次いで６０％（重量％）の硫酸水溶液ｔ１５ｍ／
添加し、アルカリ土類金属ゼデチ７水溶液のＰＨ’ｔｌ
、８に調整した後、硫酸銅（Ｃｕ８０４＋ り１（２ｏ
） ｔ” ２４．９ ｇ溶解させ九人に濃度１００ｇ
＃のジメチルアミ／ボラン水溶液を１００ｍ１添加し、
液温６０℃で銅イオンを完全に金属銅に還元した。なお
消泡剤としてブチルアルコールｔ２０ｍｌ添加した。水
溶液の温度を室温まで冷却し、水溶液の全量を純水を加
えて１１とし、銅コロイド触媒液の濃縮液を製造した。[Example-1] 10 g of seratin and 10 g of polyethylene glycol with an average molecular weight of 1,000 ml were dissolved in about 700 m/p of pure water,
28% (wt%) sodium hydroxide at 15mA while maintaining the liquid temperature at 60℃! and alkali aging for about 10 minutes. Next, 60% (wt%) sulfuric acid aqueous solution t15m/
Add and adjust the PH'tl of the alkaline earth metal zedethi 7 aqueous solution
, 8, and then copper sulfate (Cu804+) 1 (2o
) t” 24.9 g Dissolved in 9 people at a concentration of 100 g
Add 100ml of # dimethylamine/borane aqueous solution,
Copper ions were completely reduced to metallic copper at a liquid temperature of 60°C. Additionally, 20 ml of butyl alcohol was added as an antifoaming agent. The temperature of the aqueous solution was cooled to room temperature, and the total amount of the aqueous solution was made up to 11 by adding pure water to produce a concentrated solution of copper colloidal catalyst solution.
本液中の銅金属粒子の濃度は６．３ｇ＃、ゼラチンの濃
度は１０ｇ／／、平均分子ｌｉ１，０００のポリエチレ
ングリコールの濃度はｌＯｇ／１１である。The concentration of copper metal particles in this liquid is 6.3 g#, the concentration of gelatin is 10 g//, and the concentration of polyethylene glycol with an average molecular weight li of 1,000 is 10 g/11.
〔実施例−２〕
実施例−１における平均分子量１，０（１０のポリエチ
レングリコールの代９に平均分子量２，０００゜６．０
００．および２Ｑ、０００の３種のポリエチレングリコ
ールを使用し、実施例−１と同様な操作により３棟の銅
コロイド触媒液の濃縮液を製造した。[Example-2] Average molecular weight 1,0 in Example-1 (average molecular weight 2,000°6.0 for polyethylene glycol 9 in 10)
00. Using three types of polyethylene glycols, ie, 2Q, 000, and 2Q, 000, concentrates of three copper colloidal catalyst solutions were produced in the same manner as in Example-1.
〔実施例−３〕
実施例−１および実施例−２で製造した銅コロイド触媒
液とそれらの１０倍希釈液を準備し、硫酸水溶液でそれ
ぞれの銅コロイド触媒液のＰＨ１３，０に調整した。こ
れらの銅コロイド触媒液に貫通孔の形成された銅張りエ
ポキシ樹脂積層板を、液温４０℃で１分間浸漬した後、
１分間流水で水洗し次いで液温２５℃ＰＨ＝１３の無電
解銅めっき液に約１０分間浸漬し、貫通孔壁への無電解
鋼めっきの析出性を調べた。以上、本発明により貫通孔
壁の断面観察により、全ての試料の貫通孔壁への無電解
銅めっきの被覆は完全であることが確認され本発明の実
用性が立証された。[Example-3] The copper colloidal catalyst liquids produced in Example-1 and Example-2 and their 10-fold dilutions were prepared, and the pH of each copper colloidal catalyst liquid was adjusted to 13.0 with an aqueous sulfuric acid solution. After immersing a copper-clad epoxy resin laminate with through holes in these copper colloid catalyst solutions for 1 minute at a solution temperature of 40°C,
The sample was washed with running water for 1 minute, and then immersed in an electroless copper plating solution at a temperature of 25° C. and pH=13 for about 10 minutes to examine the precipitation of electroless steel plating on the walls of the through-hole. As described above, through cross-sectional observation of the through-hole walls according to the present invention, it was confirmed that the through-hole walls of all samples were completely coated with electroless copper plating, thus proving the practicality of the present invention.
ゝ・−二 ＝ζつゝ・-2 =ζ one
Claims (2)
子１ｇ当りゼラチン０．８ｇ以上と平均分子量１，００
０〜２０，０００のポリエチレングリコールを含むＰＨ
２〜４の水溶液から成る無電解めっき用銅コロイド触媒
液。(1) The concentration of copper metal particles is 0.3 g/l or more, the gelatin is 0.8 g or more per 1 g of copper metal particles, and the average molecular weight is 1,00.
PH containing polyethylene glycol from 0 to 20,000
Copper colloidal catalyst solution for electroless plating consisting of 2 to 4 aqueous solutions.
０００のポリエチレングリコールと２価の銅イオン１ｇ
当り前記ポリエチレングリコールの存在下でアルカリ熟
成した０．８ｇ以上のゼラチンを含むＰＨ１〜２、かつ
液温４０〜７０℃の水溶液に２価の銅イオン１ｇ当り１
．２ｇ以上のジメチルアミノボランを添加し、２価の銅
イオンを金属銅に還元した後、該水溶液のＰＨを２〜４
に調整する工程から成る無電解めっき用銅コロイド触媒
液の製造方法。(2) Divalent copper ion and average molecular weight 1,000-20,
000 polyethylene glycol and 1g of divalent copper ion
1 per 1 g of divalent copper ion in an aqueous solution with a pH of 1 to 2 and a liquid temperature of 40 to 70°C containing 0.8 g or more of gelatin that has been alkali-ripened in the presence of the polyethylene glycol.
．． After adding 2 g or more of dimethylaminoborane to reduce divalent copper ions to metallic copper, the pH of the aqueous solution is adjusted to 2 to 4.
1. A method for producing a copper colloidal catalyst solution for electroless plating, which comprises a step of adjusting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13961984A JPS6119783A (en) | 1984-07-05 | 1984-07-05 | Copper colloid catalyst solution for electroless plating and its preparation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13961984A JPS6119783A (en) | 1984-07-05 | 1984-07-05 | Copper colloid catalyst solution for electroless plating and its preparation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6119783A true JPS6119783A (en) | 1986-01-28 |
Family
ID=15249504
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13961984A Pending JPS6119783A (en) | 1984-07-05 | 1984-07-05 | Copper colloid catalyst solution for electroless plating and its preparation |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6119783A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62290879A (en) * | 1986-06-11 | 1987-12-17 | Nec Corp | Catalytic solution of copper colloid for electroless plating and its production |
-
1984
- 1984-07-05 JP JP13961984A patent/JPS6119783A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62290879A (en) * | 1986-06-11 | 1987-12-17 | Nec Corp | Catalytic solution of copper colloid for electroless plating and its production |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| SU747437A3 (en) | Solution for activation of non-metallic surface prior to chemical metallization | |
| US5462628A (en) | Method for bonding two surfaces together | |
| CN101684554B (en) | Chemical copper plating solution for polyimide film and surface chemical copper plating method thereof | |
| CN104250731B (en) | Catalysts for electroless metallization containing five-membered heterocyclic nitrogen compounds | |
| US5203955A (en) | Method for etching an organic polymeric material | |
| JP6444664B2 (en) | Electroless metallization of dielectrics with alkali-stable pyrazine derivative-containing catalysts | |
| TW583274B (en) | Polyimide resin precursor solution, laminates for electronic components made by using the solution and process for production of the laminates | |
| CN1910041B (en) | Polyimide-metal laminates and polyimide circuit boards | |
| US9918389B2 (en) | Electroless metallization of dielectrics with alkaline stable pyrazine derivative containing catalysts | |
| CN102605360A (en) | Chemical silvering solution based on imidazolium ionic liquid and silvering method | |
| US5135779A (en) | Method for conditioning an organic polymeric material | |
| JPS6119783A (en) | Copper colloid catalyst solution for electroless plating and its preparation | |
| JPS6123764A (en) | Copper colloidal catalytic solution for electroless plating and its manufacture | |
| JPS6123762A (en) | Copper colloidal catalytic solution for electroless plating and its manufacture | |
| JPS6119784A (en) | Copper colloid catalyst solution for electroless plating and its preparation | |
| CN118957555A (en) | A reverse displacement deposition solution based on a low eutectic solvent and its application in preparing a metal activation layer by reverse displacement on a copper surface | |
| JPH0621157A (en) | Manufactured of copper polyimide substrate | |
| JPS6123763A (en) | Copper colloidal catalytic solution for electroless plating | |
| JPS637380A (en) | Catalytic solution of copper colloid for electroless plating and its production | |
| JPS6119782A (en) | Copper colloid catalyst solution | |
| US20220267906A1 (en) | Solution and process for the activation of nonconductive area for electroless process | |
| JPS6123765A (en) | Copper colloidal catalytic solution for electroless plating and its manufacture | |
| JPS62290879A (en) | Catalytic solution of copper colloid for electroless plating and its production | |
| RU2041575C1 (en) | Process of preparation of combined copper-polyimide surface to formation of coating by chemical conversion | |
| JPS61139672A (en) | Production of colloidal copper catalyst solution for electroless plating |