JPS61198769A - Hybrid integrated circuit - Google Patents

Abstract

PURPOSE:To reduce the size of the outer configuration, by arranging a chip carrier, on which a ROM is mounted, and conducting rubber in a recess in a ceramic case, fixing the chip carrier to the ceramic case itself, thereby omitting a fixed frame. CONSTITUTION:As an electronic circuit substrate for a hybrid integrated circuit, a ceramic case 1, in which a ROM mounting recess 5 is formed, is used. In said case 1, electronic circuits other than the ROM are incorporated. The recess 5 is a region, in which conducting rubber 6 and a chip carrier 7, on which the ROM is mounted, are placed. The conducting rubber 6 is put beneath the chip carrier 7. The ROM and the rubber are fixed to the case 1 by a cap 8 for compressing the ROM and the conducting rubber. Outer leads 2 are taking out of the case 1. A ceramic cap 3 is connected to the case 1 by solder 4. The chip carrier function is provided in the ceramic case itself. The hybrid integrated circuit is made compact, and its price is made low.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a refillable read-only memory EPRO.
M Also read-only memory IJPROM, etc. RO
The present invention relates to a hybrid integrated circuit equipped with M.

[Conventional technology]

FIG. 4 is an exploded perspective view showing the 31st conventional stile row, and FIG. 4 is a sectional view taken along the line BB showing the assembled state of FIG. 3.

Conventionally, the EPROM FROM was mounted on a chip carrier 7, and a fixing device was used to fix the 1'UM in a way to electrically disconnect from or connect to other electronic circuits. The frame 11 is fixed to the ceramic case IK with a suitable adhesive 12, and the chip carrier 7 is mounted on the rubber 6t ceramic case 1. In this case, the electrodes provided on the bottom surface of the chip carrier 7 and the ceramic A conductive rubber is placed on the opposing surface of the case 1 and crimped with a cap 8 for fixing the cap 8 in order to establish an electrical connection with the electrode.

Electronics other than ROM are bonded to the IC chip 9t-Au-8i by hard mounting method or soft mounting method using Ag paste. Configure the circuit. To protect the moisture resistance of the IC chip 9 or to protect the wiring wire 10, use an appropriate exterior ratio, for example,
A silicon resin, epoxy resin, or ceramic cap is sealed in low melting point glass or the like.

[Problem that the invention seeks to solve]

Conventionally, there has been a drawback that it is necessary to specially provide the fixed frame 11 and the cost is high. Furthermore, the conventional circuit has a high height, and the overall external size of the product must be increased by 2.

An object of the present invention is to reduce the cost of eliminating the conventional fixed frame 11t.

[Means for solving problems]

The hybrid integrated circuit of the present invention includes an electronic circuit board having a built-in recess, a conductive rubber, a chip carrier mounted with R(JM'i), and and a cap that is crimped into the recess to connect the box UM to the electronic circuit.

〔Example〕

FIG. 1 is an exploded perspective view showing an embodiment of the present invention, and FIG. 2 is a sectional view taken along the line A--A showing the assembled state shown in FIG. ROM
t-Mounted chip carrier 7 and conductive rubber 6't-
Ceramic case 1 has a recess 5 that secures the entire mounting area.
Provided for. An electronic circuit other than R (JM) is incorporated into the ceramic case 1.It can be easily formed by using a laminated ceramic multilayer substrate technology for the electronic circuit.The recess 5 can also be formed by punching an edge into the laminated ceramic substrate 1t, for example, in a mold. It is especially easy to form.Furthermore, it can be formed by hard mounting method using IC chip 9t-Au-8i, or by F-die bonding using soft mounting method using Ag paste. It is also possible to configure another electronic circuit by bonding the IC chip 9 with a rainbow wire.In order to protect the moisture resistance of the IC chip 9 and to protect the wiring wire 10, a suitable exterior material such as silicone resin, epoxy resin or the like can be used. Seal the frame and ceramic cap with low melting point glass, etc.

Fig. 2 shows an example of sealing with a ceramic cap 3 fully exposed 4? show. R, (with JM installed, place the chip carrier 7 [4] on the rubber band 6 and place the ROM fixing cap 8
Then, it is fixed to the ceramic case 1. in this case,
A conductive rubber 6 is crimped to electrically connect the electrode provided on the lower surface of the chip carrier and the opposing electrode provided on the ceramic case to form a desired electronic circuit.

〔Effect of the invention〕

According to the present invention, since the ceramic case itself has the function of completely fixing the chip carrier, there is no need to specially manufacture a conventional fixing frame, and the cost can therefore be reduced compared to the conventional circuit. Furthermore, by incorporating the present invention, the external size can be reduced.

[Brief explanation of the drawing]

! ! Figure 1 is an exploded perspective view showing one embodiment of the present invention, Figure 2 is a sectional view taken along line A-A showing the assembled state of Figure gi, Figures i1!3 are exploded perspective views showing the conventional example, and Figure 4 is FIG. 4 is a BB@1iiFr plane view showing the assembled state shown in FIG. 3; 1... Ceramic case, 2... External lead terminal, 3... Ceramic cap, 4...
...Solder, 5...Recess for mounting ROM,
6... Conductive rubber, 7... ROMTh
Equipped with chip carrier, 8...ROM
and conductive rubber pressure bonding cap, 9...IC chip, 10...wiring wire, 11...
・Fixing frame, 12-・・・Adhesive for fixing ROM A #l Figure

Claims (1)

[Claims] An electronic circuit board having a recess for storing an electronic circuit;
A hybrid device comprising a conductive rubber, a chip carrier on which a ROM is mounted, and a cap that presses the chip carrier into the recess through the conductive rubber to connect the ROM to the electronic circuit. integrated circuit.