JPS61208890A - 混成集積回路 - Google Patents

混成集積回路

Info

Publication number: JPS61208890A
Authority: JP; Japan
Prior art keywords: metal substrate; conductive path; circuit; hybrid integrated; integrated circuit
Prior art date: 1985-03-14
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

JP5086485A

Other languages

English (en)

Japanese (ja)

Other versions

JPH0376797B2 (fr

Inventor

風見　明

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Tokyo Sanyo Electric Co Ltd

Sanyo Electric Co Ltd

Original Assignee

Tokyo Sanyo Electric Co Ltd

Sanyo Electric Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1985-03-14

Filing date

1985-03-14

Publication date

1986-09-17

1985-03-14 Application filed by Tokyo Sanyo Electric Co Ltd, Sanyo Electric Co Ltd filed Critical Tokyo Sanyo Electric Co Ltd

1985-03-14 Priority to JP5086485A priority Critical patent/JPS61208890A/ja

1986-09-17 Publication of JPS61208890A publication Critical patent/JPS61208890A/ja

1991-12-06 Publication of JPH0376797B2 publication Critical patent/JPH0376797B2/ja

Status Granted legal-status Critical Current

Links

239000000758 substrate Substances 0.000 claims description 34
229910052751 metal Inorganic materials 0.000 claims description 28
239000002184 metal Substances 0.000 claims description 28
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
239000011889 copper foil Substances 0.000 description 7
239000012790 adhesive layer Substances 0.000 description 5
229920001721 polyimide Polymers 0.000 description 5
125000006850 spacer group Chemical group 0.000 description 5
239000004642 Polyimide Substances 0.000 description 4
238000004080 punching Methods 0.000 description 3
229910000831 Steel Inorganic materials 0.000 description 2
238000005452 bending Methods 0.000 description 2
239000003990 capacitor Substances 0.000 description 2
230000000694 effects Effects 0.000 description 2
238000005516 engineering process Methods 0.000 description 2
239000003822 epoxy resin Substances 0.000 description 2
239000011888 foil Substances 0.000 description 2
229920000647 polyepoxide Polymers 0.000 description 2
239000004065 semiconductor Substances 0.000 description 2
239000010959 steel Substances 0.000 description 2
239000000853 adhesive Substances 0.000 description 1
230000001070 adhesive effect Effects 0.000 description 1
229910052782 aluminium Inorganic materials 0.000 description 1
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
238000005530 etching Methods 0.000 description 1
239000011810 insulating material Substances 0.000 description 1
238000009413 insulation Methods 0.000 description 1
230000010354 integration Effects 0.000 description 1
239000000463 material Substances 0.000 description 1
TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
239000009719 polyimide resin Substances 0.000 description 1
229920003002 synthetic resin Polymers 0.000 description 1
239000000057 synthetic resin Substances 0.000 description 1

Landscapes

Insulated Metal Substrates For Printed Circuits (AREA)
Combinations Of Printed Boards (AREA)

JP5086485A 1985-03-14 1985-03-14 混成集積回路 Granted JPS61208890A (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP5086485A JPS61208890A (ja)	1985-03-14	1985-03-14	混成集積回路

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP5086485A JPS61208890A (ja)	1985-03-14	1985-03-14	混成集積回路

Publications (2)

Publication Number	Publication Date
JPS61208890A true JPS61208890A (ja)	1986-09-17
JPH0376797B2 JPH0376797B2 (fr)	1991-12-06

Family

ID=12870586

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP5086485A Granted JPS61208890A (ja)	1985-03-14	1985-03-14	混成集積回路

Country Status (1)

Country	Link
JP (1)	JPS61208890A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS63308994A (ja) *	1987-06-11	1988-12-16	Japan Radio Co Ltd	混成集積回路用基板

1985
- 1985-03-14 JP JP5086485A patent/JPS61208890A/ja active Granted

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS63308994A (ja) *	1987-06-11	1988-12-16	Japan Radio Co Ltd	混成集積回路用基板

Also Published As

Publication number	Publication date
JPH0376797B2 (fr)	1991-12-06

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