JPS61222144A - セラミツク製ワイヤボンデイング用キヤピラリ - Google Patents

セラミツク製ワイヤボンデイング用キヤピラリ

Info

Publication number
JPS61222144A
JPS61222144A JP60289122A JP28912285A JPS61222144A JP S61222144 A JPS61222144 A JP S61222144A JP 60289122 A JP60289122 A JP 60289122A JP 28912285 A JP28912285 A JP 28912285A JP S61222144 A JPS61222144 A JP S61222144A
Authority
JP
Japan
Prior art keywords
wire
capillary
bonding
conductive material
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60289122A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0588545B2 (2
Inventor
ジエームス　エフ．ヒーフリング
ジエームス　ダブリユウ．プリツチヤード
ロジヤー　ジエイ　スターマン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of JPS61222144A publication Critical patent/JPS61222144A/ja
Publication of JPH0588545B2 publication Critical patent/JPH0588545B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
JP60289122A 1984-12-21 1985-12-21 セラミツク製ワイヤボンデイング用キヤピラリ Granted JPS61222144A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US684654 1984-12-21
US06/684,654 US4691854A (en) 1984-12-21 1984-12-21 Coatings for ceramic bonding capillaries

Publications (2)

Publication Number Publication Date
JPS61222144A true JPS61222144A (ja) 1986-10-02
JPH0588545B2 JPH0588545B2 (2) 1993-12-22

Family

ID=24748982

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60289122A Granted JPS61222144A (ja) 1984-12-21 1985-12-21 セラミツク製ワイヤボンデイング用キヤピラリ

Country Status (2)

Country Link
US (1) US4691854A (2)
JP (1) JPS61222144A (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62158335A (ja) * 1985-12-28 1987-07-14 Kyocera Corp ワイヤボンディング用キャピラリ−

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5102004A (en) * 1988-06-08 1992-04-07 Transtech Service Network, Inc. Method and apparatus for packaging refrigerated goods
US5246159A (en) * 1989-07-19 1993-09-21 Nec Corporation Method for forming a bump by bonding a ball on an electrode of an electronic device and apparatus for forming the same
US7124927B2 (en) * 1999-02-25 2006-10-24 Reiber Steven F Flip chip bonding tool and ball placement capillary
US6651864B2 (en) * 1999-02-25 2003-11-25 Steven Frederick Reiber Dissipative ceramic bonding tool tip
US6354479B1 (en) * 1999-02-25 2002-03-12 Sjm Technologies Dissipative ceramic bonding tip
US20060071050A1 (en) * 1999-02-25 2006-04-06 Reiber Steven F Multi-head tab bonding tool
US7032802B2 (en) * 1999-02-25 2006-04-25 Reiber Steven F Bonding tool with resistance
US7389905B2 (en) 1999-02-25 2008-06-24 Reiber Steven F Flip chip bonding tool tip
US20080197172A1 (en) * 1999-02-25 2008-08-21 Reiber Steven F Bonding Tool
US20070131661A1 (en) * 1999-02-25 2007-06-14 Reiber Steven F Solder ball placement system
US20060261132A1 (en) * 1999-02-25 2006-11-23 Reiber Steven F Low range bonding tool
SG91867A1 (en) * 2000-05-24 2002-10-15 Casem Asia Pte Ltd Improved apparatus and method for dispensing solder
EP1363707A4 (en) * 2000-08-22 2004-09-08 Microcoating Technologies Inc NARROW DIAMETER NEEDLE WITH REDUCED INTERIOR DIAMETER TIP
US6729527B2 (en) * 2001-01-30 2004-05-04 Kulicke & Soffa Investments, Inc. Bonding tool with polymer coating
US7249702B2 (en) 2003-12-04 2007-07-31 Kulicke And Soffa Industries, Inc. Multi-part capillary
US7322507B2 (en) * 2005-01-17 2008-01-29 Amkor Technology, Inc. Transducer assembly, capillary and wire bonding method using the same
US20070085085A1 (en) * 2005-08-08 2007-04-19 Reiber Steven F Dissipative pick and place tools for light wire and LED displays
DE102022001130A1 (de) 2022-03-25 2023-09-28 Jonas Münz Sonotrode sowie Vorrichtung und Verfahren zum Ultraschallschweißen von Stahl
CN223943150U (zh) * 2022-04-28 2026-02-24 库利克和索夫工业公司 焊线工具

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5267261A (en) * 1975-11-10 1977-06-03 Toshiba Corp Lead wire joining tool
JPS5856431A (ja) * 1981-09-30 1983-04-04 Adamando Kogyo Kk キヤピラリ−チツプ

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB487178A (en) * 1936-07-27 1938-06-16 Siemens Ag Improvements in or relating to soldering irons
US2501616A (en) * 1947-04-08 1950-03-21 Sprague Electric Co Soldering iron tip
GB1072871A (en) * 1963-01-14 1967-06-21 Post Office Improvements in or relating to time division multiplex pulse code modulation communication systems
US3358897A (en) * 1964-03-31 1967-12-19 Tempress Res Co Electric lead wire bonding tools
US3542277A (en) * 1968-03-25 1970-11-24 Motorola Inc Wire bonding needle and method for making same
DE2164822A1 (de) * 1971-12-27 1973-07-19 Reinhard Weichert Potentialfreie loetspitze bzw. loetspitzenhuelse aus isoliermaterial, direkt oder indirekt beheizt
US3863827A (en) * 1972-11-10 1975-02-04 Mech El Ind Inc Tailless wire bonder
JPS5080763A (2) * 1973-11-14 1975-07-01
SU582073A1 (ru) * 1975-10-10 1977-11-30 Ордена Трудового Красного Знамени Институт Проблем Материаловедения Устройство дл дуговой сварки плав щимс электродом с увеличенным вылетом электрода
JPS54281A (en) * 1976-10-15 1979-01-05 Fujiya Oodeo Kk Method of finishing bearing of turntable shaft
US4340166A (en) * 1978-11-22 1982-07-20 Kulicke & Soffa Industries, Inc. High speed wire bonding method
US4327860A (en) * 1980-01-03 1982-05-04 Kulicke And Soffa Ind. Inc. Method of making slack free wire interconnections
US4387283A (en) * 1981-08-03 1983-06-07 Texas Instruments Incorporated Apparatus and method of forming aluminum balls for ball bonding

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5267261A (en) * 1975-11-10 1977-06-03 Toshiba Corp Lead wire joining tool
JPS5856431A (ja) * 1981-09-30 1983-04-04 Adamando Kogyo Kk キヤピラリ−チツプ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62158335A (ja) * 1985-12-28 1987-07-14 Kyocera Corp ワイヤボンディング用キャピラリ−

Also Published As

Publication number Publication date
JPH0588545B2 (2) 1993-12-22
US4691854A (en) 1987-09-08

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term