JPS6122859B2 - - Google Patents

Info

Publication number
JPS6122859B2
JPS6122859B2 JP53097251A JP9725178A JPS6122859B2 JP S6122859 B2 JPS6122859 B2 JP S6122859B2 JP 53097251 A JP53097251 A JP 53097251A JP 9725178 A JP9725178 A JP 9725178A JP S6122859 B2 JPS6122859 B2 JP S6122859B2
Authority
JP
Japan
Prior art keywords
thickness
plate
insulating plate
wiring metal
metal plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP53097251A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5524464A (en
Inventor
Hitoshi Matsuzaki
Akira Nishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9725178A priority Critical patent/JPS5524464A/ja
Publication of JPS5524464A publication Critical patent/JPS5524464A/ja
Publication of JPS6122859B2 publication Critical patent/JPS6122859B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP9725178A 1978-08-11 1978-08-11 Complex semiconductor system Granted JPS5524464A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9725178A JPS5524464A (en) 1978-08-11 1978-08-11 Complex semiconductor system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9725178A JPS5524464A (en) 1978-08-11 1978-08-11 Complex semiconductor system

Publications (2)

Publication Number Publication Date
JPS5524464A JPS5524464A (en) 1980-02-21
JPS6122859B2 true JPS6122859B2 (mo) 1986-06-03

Family

ID=14187343

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9725178A Granted JPS5524464A (en) 1978-08-11 1978-08-11 Complex semiconductor system

Country Status (1)

Country Link
JP (1) JPS5524464A (mo)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5642410Y2 (mo) * 1976-08-12 1981-10-05

Also Published As

Publication number Publication date
JPS5524464A (en) 1980-02-21

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