JPS6123629A - Resin composition having electromagnetic wave shielding ability - Google Patents
Resin composition having electromagnetic wave shielding abilityInfo
- Publication number
- JPS6123629A JPS6123629A JP14518084A JP14518084A JPS6123629A JP S6123629 A JPS6123629 A JP S6123629A JP 14518084 A JP14518084 A JP 14518084A JP 14518084 A JP14518084 A JP 14518084A JP S6123629 A JPS6123629 A JP S6123629A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- resin composition
- electromagnetic wave
- wave shielding
- aromatic vinyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 20
- 239000000203 mixture Substances 0.000 claims abstract description 27
- 229920000049 Carbon (fiber) Polymers 0.000 claims abstract description 19
- 239000004917 carbon fiber Substances 0.000 claims abstract description 19
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000007822 coupling agent Substances 0.000 claims abstract description 16
- 229920006164 aromatic vinyl copolymer Polymers 0.000 claims abstract description 14
- 239000004014 plasticizer Substances 0.000 claims abstract description 12
- 230000000694 effects Effects 0.000 abstract description 23
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 abstract description 10
- -1 nitrile compound Chemical class 0.000 abstract description 10
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 abstract description 7
- 229920001577 copolymer Polymers 0.000 abstract description 5
- 229920003244 diene elastomer Polymers 0.000 abstract description 5
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 abstract description 3
- 239000005062 Polybutadiene Substances 0.000 abstract description 3
- 150000002825 nitriles Chemical class 0.000 abstract description 3
- 229920002857 polybutadiene Polymers 0.000 abstract description 3
- 229920002554 vinyl polymer Polymers 0.000 abstract description 2
- 229920000459 Nitrile rubber Polymers 0.000 abstract 1
- 229920003023 plastic Polymers 0.000 description 15
- 239000004033 plastic Substances 0.000 description 15
- 230000000704 physical effect Effects 0.000 description 14
- 229920005989 resin Polymers 0.000 description 14
- 239000011347 resin Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 13
- 238000002347 injection Methods 0.000 description 12
- 239000007924 injection Substances 0.000 description 12
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 238000002156 mixing Methods 0.000 description 7
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 6
- 239000003963 antioxidant agent Substances 0.000 description 5
- 229920006026 co-polymeric resin Polymers 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 235000014113 dietary fatty acids Nutrition 0.000 description 5
- 229930195729 fatty acid Natural products 0.000 description 5
- 239000000194 fatty acid Substances 0.000 description 5
- 239000000835 fiber Substances 0.000 description 5
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 150000004665 fatty acids Chemical class 0.000 description 4
- 239000008188 pellet Substances 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 3
- 239000011231 conductive filler Substances 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000000314 lubricant Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229920002239 polyacrylonitrile Polymers 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 239000003381 stabilizer Substances 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- IEKHISJGRIEHRE-UHFFFAOYSA-N 16-methylheptadecanoic acid;propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CC(C)CCCCCCCCCCCCCCC(O)=O.CC(C)CCCCCCCCCCCCCCC(O)=O.CC(C)CCCCCCCCCCCCCCC(O)=O IEKHISJGRIEHRE-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- UMHKOAYRTRADAT-UHFFFAOYSA-N [hydroxy(octoxy)phosphoryl] octyl hydrogen phosphate Chemical compound CCCCCCCCOP(O)(=O)OP(O)(=O)OCCCCCCCC UMHKOAYRTRADAT-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- SAOKZLXYCUGLFA-UHFFFAOYSA-N bis(2-ethylhexyl) adipate Chemical compound CCCCC(CC)COC(=O)CCCCC(=O)OCC(CC)CCCC SAOKZLXYCUGLFA-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- PMJHHCWVYXUKFD-SNAWJCMRSA-N (E)-1,3-pentadiene Chemical group C\C=C\C=C PMJHHCWVYXUKFD-SNAWJCMRSA-N 0.000 description 1
- KZVBBTZJMSWGTK-UHFFFAOYSA-N 1-[2-(2-butoxyethoxy)ethoxy]butane Chemical compound CCCCOCCOCCOCCCC KZVBBTZJMSWGTK-UHFFFAOYSA-N 0.000 description 1
- JEYLQCXBYFQJRO-UHFFFAOYSA-N 2-[2-[2-(2-ethylbutanoyloxy)ethoxy]ethoxy]ethyl 2-ethylbutanoate Chemical compound CCC(CC)C(=O)OCCOCCOCCOC(=O)C(CC)CC JEYLQCXBYFQJRO-UHFFFAOYSA-N 0.000 description 1
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 1
- IHXNSHZBFXGOJM-UHFFFAOYSA-N 2-methylbut-2-enenitrile Chemical compound CC=C(C)C#N IHXNSHZBFXGOJM-UHFFFAOYSA-N 0.000 description 1
- TVONJMOVBKMLOM-UHFFFAOYSA-N 2-methylidenebutanenitrile Chemical compound CCC(=C)C#N TVONJMOVBKMLOM-UHFFFAOYSA-N 0.000 description 1
- LVNLBBGBASVLLI-UHFFFAOYSA-N 3-triethoxysilylpropylurea Chemical compound CCO[Si](OCC)(OCC)CCCNC(N)=O LVNLBBGBASVLLI-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- HIBWGGKDGCBPTA-UHFFFAOYSA-N C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 Chemical compound C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 HIBWGGKDGCBPTA-UHFFFAOYSA-N 0.000 description 1
- SRORDPCXIPXEAX-UHFFFAOYSA-N CCCCCCCCCCCCCP(CCCCCCCCCCCCC)(O)(OCCCCCCCC)OCCCCCCCC.CCCCCCCCCCCCCP(CCCCCCCCCCCCC)(O)(OCCCCCCCC)OCCCCCCCC Chemical compound CCCCCCCCCCCCCP(CCCCCCCCCCCCC)(O)(OCCCCCCCC)OCCCCCCCC.CCCCCCCCCCCCCP(CCCCCCCCCCCCC)(O)(OCCCCCCCC)OCCCCCCCC SRORDPCXIPXEAX-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 239000004803 Di-2ethylhexylphthalate Substances 0.000 description 1
- 239000013032 Hydrocarbon resin Substances 0.000 description 1
- 239000006057 Non-nutritive feed additive Substances 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 241001178521 Sarotherodon caroli Species 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 229920001893 acrylonitrile styrene Polymers 0.000 description 1
- WNLRTRBMVRJNCN-UHFFFAOYSA-L adipate(2-) Chemical compound [O-]C(=O)CCCCC([O-])=O WNLRTRBMVRJNCN-UHFFFAOYSA-L 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- ZDWGXBPVPXVXMQ-UHFFFAOYSA-N bis(2-ethylhexyl) nonanedioate Chemical compound CCCCC(CC)COC(=O)CCCCCCCC(=O)OCC(CC)CCCC ZDWGXBPVPXVXMQ-UHFFFAOYSA-N 0.000 description 1
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- MYPDDNAJRRJUCE-UHFFFAOYSA-N buta-1,3-diene;2-methylprop-2-enenitrile;styrene Chemical compound C=CC=C.CC(=C)C#N.C=CC1=CC=CC=C1 MYPDDNAJRRJUCE-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 238000004581 coalescence Methods 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 239000006084 composite stabilizer Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 230000003292 diminished effect Effects 0.000 description 1
- XMQYIPNJVLNWOE-UHFFFAOYSA-N dioctyl hydrogen phosphite Chemical compound CCCCCCCCOP(O)OCCCCCCCC XMQYIPNJVLNWOE-UHFFFAOYSA-N 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- 150000002191 fatty alcohols Chemical class 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229920006270 hydrocarbon resin Polymers 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000000944 linseed oil Substances 0.000 description 1
- 235000021388 linseed oil Nutrition 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000001883 metal evaporation Methods 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000002530 phenolic antioxidant Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- PMJHHCWVYXUKFD-UHFFFAOYSA-N piperylene Natural products CC=CC=C PMJHHCWVYXUKFD-UHFFFAOYSA-N 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- APSBXTVYXVQYAB-UHFFFAOYSA-M sodium docusate Chemical group [Na+].CCCCC(CC)COC(=O)CC(S([O-])(=O)=O)C(=O)OCC(CC)CCCC APSBXTVYXVQYAB-UHFFFAOYSA-M 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Landscapes
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Conductive Materials (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は、共重合体と炭素繊維と可塑剤及びカップリン
グ剤とからなる樹脂組成物とすることにより得られる、
良好な電磁波遮蔽性果を有し、かつ耐衝撃強度などの力
学物性に優れた、樹脂組成物に関するものである。Detailed Description of the Invention (Field of Industrial Application) The present invention provides a resin composition comprising a copolymer, carbon fiber, a plasticizer, and a coupling agent.
The present invention relates to a resin composition that has good electromagnetic wave shielding properties and excellent mechanical properties such as impact strength.
本発明により提供される樹脂組成物は、事務機器、電子
計算機、TVレシーバ−1などの電子機器の筐体等に用
いられる。The resin composition provided by the present invention is used for the casing of electronic equipment such as office equipment, electronic computers, and TV receiver-1.
(従来の技術)
従来、事務機器、電子計算機、TVレシーバ−1などの
電子機器は、それ自体が電磁波の発生源となり、周囲の
電子機器の誤動作やノイズの原因となっていた。(Prior Art) Conventionally, electronic devices such as office equipment, electronic computers, and TV receivers have themselves been sources of electromagnetic waves, causing malfunctions and noise in surrounding electronic devices.
一方、これらの電子機器は、その近傍に設置された電気
機器などの影響を受け、それ自身が誤動作やノイズを発
生することも有る。On the other hand, these electronic devices are affected by electrical devices installed nearby, and may malfunction or generate noise themselves.
これら電子機器の筐体には、電磁波を遮蔽する性能を有
する板金や、アルミダイキャストなどが使用されており
、この場合には、電磁波による障害はある程度防止され
ていた。The housings of these electronic devices are made of sheet metal, die-cast aluminum, or the like, which has the ability to shield electromagnetic waves, and in this case, interference due to electromagnetic waves can be prevented to some extent.
しかしながら近年、成形の容易さ、自由なデデイン、軽
量性、などのメリットにより、プラスチック材料が電子
機器の筐体に数多く使われている。However, in recent years, plastic materials have been widely used for the housings of electronic devices due to their advantages such as ease of molding, flexible design, and light weight.
プラスチック材料は、一般に導電性に乏しく、電磁波な
遮蔽する性能が殆んどない為に、電子機器の筐体にプラ
スチック材料を用いる場合は、電磁波忙対する遮蔽処理
が必要となる。Plastic materials generally have poor conductivity and have almost no ability to shield electromagnetic waves, so when plastic materials are used in the housing of electronic devices, shielding treatment for electromagnetic waves is required.
特に、最近では、国内、国外を問わず、電子機器からの
ta波の放射に対して厳しい制限が加えられており、プ
ラスチック材料の電磁波遮蔽処理に対する要求が高まり
つつある。In particular, recently, strict restrictions have been placed on the radiation of TA waves from electronic devices, both domestically and internationally, and there is an increasing demand for electromagnetic wave shielding treatments for plastic materials.
プラスチック材料に電磁波遮蔽効果を付与する方法とし
て、従来より■、アルミニウム箔や導電テープの貼り合
せ、■、亜鉛溶射、■、導電塗料の塗工、■、プラスチ
ックメッキ、■、真空蒸着、スパッタリング、イオンシ
レーティング、■、導電性フィラー混入導電性プラスチ
ックによる成形、など数多(の方法が検討されている。Conventional methods for imparting electromagnetic shielding effects to plastic materials include: ■ Laminating aluminum foil or conductive tape, ■ Zinc spraying, ■ Coating conductive paint, ■ Plastic plating, ■ Vacuum deposition, sputtering, A number of methods are being considered, including ion silating, (1) molding with conductive plastic mixed with conductive filler, etc.
■ アルミニウム箔や導電テープの貼り合わせによる電
磁波遮蔽効果を付与する手法は、作業に熟練を要する、
複雑な形状に適さないといった数多くの欠点を有し、最
近では、殆んど行なわれていない。■ The method of applying electromagnetic wave shielding effect by laminating aluminum foil or conductive tape requires skill.
It has many drawbacks, such as not being suitable for complex shapes, and is rarely used these days.
■ 亜鉛溶射や■、導電性塗料の塗工は、現在液も一般
的に用いられる方法であるが、複雑な形状では膜厚が不
均一=になる上に、基材との密着性が不充分で、導電層
の剥落により、電磁波遮蔽効果が失なわれたり、火災の
危険があるとされる。■ Zinc thermal spraying and ■ coating with conductive paints are commonly used methods, but with complex shapes, the film thickness becomes uneven and the adhesion to the base material is uneven. However, if the conductive layer peels off, the electromagnetic wave shielding effect may be lost and there may be a risk of fire.
■ プラスチックメッキは、その耐久性や密着性が良好
ではあるが、基材となるプラスチックの種類が限られて
おり、更に、その対象も小型品に限定される。■ Plastic plating has good durability and adhesion, but the types of plastic that can be used as base materials are limited, and furthermore, its application is limited to small products.
■ 真空蒸着、スパッタリング、イオンブレーティング
などは、金属蒸着技術の応用で良好な電磁波遮蔽効果が
得られるが、装置が高価である上に、高度な技術が必要
であるので、商業生産は、殆んど行なわれていない。■Vacuum evaporation, sputtering, ion blating, etc. can achieve good electromagnetic shielding effects by applying metal evaporation technology, but the equipment is expensive and advanced technology is required, so commercial production is almost impossible. It is not done often.
以上に述べてきた様な、プラスチック成形品の表面に導
電層を形成し、電磁波遮蔽効果を付与する手法に対して
、■、導電性フィシーをグラスチック中に分散複合化し
て導電性プラスチックの成形品は、導電層の剥落による
電磁波遮蔽効果の低下や、火災の危険の心配はない。In contrast to the above-mentioned method of forming a conductive layer on the surface of a plastic molded product and imparting an electromagnetic wave shielding effect, 1. Molding of conductive plastic by dispersing and compounding conductive fissies in glass. There is no concern that the electromagnetic wave shielding effect will deteriorate due to peeling of the conductive layer or that there will be a risk of fire.
しかしながら、この様な導電性プラスチック成形品は、
導電性フィラーを多重に加えなければ、電磁波の遮蔽効
果が一ヒがらず、添加量を増加するとベースになるプラ
スチックの力学物性を損なったり、不良な外観となり、
更にコスト的にも非常に高価なものとなる、といった欠
点を有している。However, such conductive plastic molded products are
If multiple conductive fillers are not added, the electromagnetic wave shielding effect will not be completely diminished, and increasing the amount added may impair the mechanical properties of the base plastic or result in a poor appearance.
Furthermore, it has the disadvantage of being extremely expensive.
特に、導電性フィラーが増加すると、樹脂との均一分散
性が悪くなったり、混線中の繊維の切断による遮蔽効果
の低下、樹脂組成物の粘度上昇に伴なう成形性の困難塵
の増加及び溶融温度上昇による樹脂劣化から(る成形品
物性の低下及び炭素繊維に対する樹脂の濡れ不足による
成形品物性、特に耐衝撃強度の低下や、更に着色性不良
等の欠点かあった。In particular, when the amount of conductive filler increases, its uniform dispersibility with the resin deteriorates, the shielding effect decreases due to the cutting of fibers during cross-wire, and the viscosity of the resin composition increases, making moldability difficult and increasing the amount of dust. There were disadvantages such as a decrease in the physical properties of the molded product due to resin deterioration due to an increase in melting temperature, a decrease in the physical properties of the molded product, especially impact resistance strength, due to insufficient wetting of the resin to carbon fibers, and poor coloring properties.
(発明か解決しようとする問題点)
本発明はかかる欠点の解決を目的とするものであり、共
重合体と炭素繊維と可塑剤との混合物にカップリング剤
を加える事により、共重合体と繊維との分散が均一で、
しかも繊維の切断が殆んど無く、且つ樹脂組成物の流動
性か向上するので、成形性か良好で、溶融温度を必要以
上に高める事かないので、樹脂劣化からくる物性低下及
び外観不良かなり、更にまた、樹脂の炭素繊維に対する
濡れも充分である為、成形品物性特に耐衝撃強度の良好
な、電磁波遮蔽性を有する樹脂組成物を提供するもので
ある。(Problems to be Solved by the Invention) The present invention aims to solve these drawbacks, and by adding a coupling agent to a mixture of the copolymer, carbon fiber, and plasticizer, Uniform dispersion with fibers,
In addition, there is almost no cutting of fibers, and the fluidity of the resin composition is improved, resulting in good moldability and the melting temperature not being raised more than necessary, resulting in a significant decrease in physical properties and poor appearance due to resin deterioration. Furthermore, since the resin sufficiently wets the carbon fibers, it is possible to provide a resin composition that has good physical properties of molded articles, particularly good impact strength, and has electromagnetic wave shielding properties.
(問題点を解決するための手段ン
すなわち本発明は、
t1+ −zチレy性不a和二トリルージエンデムー
芳香族ビニル共重合体またはこれとエチレン性不飽和ニ
トリル−芳香族ビニル共重合体との混合物57〜90重
量%
(2)可塑剤6〜25重量%
(3)炭素繊維5〜40重量%
(4) カップリング剤0.2〜5重量%からなるこ
とを特徴とする電磁波遮蔽性を有する樹脂組成物である
。(Means for solving the problem, that is, the present invention is directed to the use of a t1+ -z ethylene unsaturated nitrile-dienedemu aromatic vinyl copolymer or an ethylenically unsaturated nitrile-aromatic vinyl copolymer thereof). 57-90% by weight of a mixture with (2) 6-25% by weight of a plasticizer, (3) 5-40% by weight of carbon fiber, and (4) 0.2-5% by weight of a coupling agent. It is a resin composition with properties.
本発明の電磁波遮蔽性を有する樹脂組成物のベースとな
る樹脂は、エチレン性不飽和二トリルーゾエンゴムー芳
香族ビニル共重合体またはこれとエチレン性不飽和ニト
リル−芳香族ビニル共重合体との混合物か用いられる。The base resin of the electromagnetic wave shielding resin composition of the present invention is an ethylenically unsaturated nitrile rubber-aromatic vinyl copolymer or an ethylenically unsaturated nitrile-aromatic vinyl copolymer. A mixture of is used.
、本発明におけるエチレン性不飽和ニトリル化
合物とは、例えば、アクリロニトリル、メタクリロニト
リル、エタクリロニトリル、メチルメタクリロニトリル
などであり、アクリロニトリル及ヒメタクリロニトリル
が特に好ましい。Examples of the ethylenically unsaturated nitrile compound in the present invention include acrylonitrile, methacrylonitrile, ethacrylonitrile, and methylmethacrylonitrile, with acrylonitrile and hismethacrylonitrile being particularly preferred.
本発明におけるジエンゴムは、1種またはそれ以上の共
役1,6−ジエン、例えば、ブタジェン、イソプレン、
2−クロロ−1,6−シタジエン、1−クロロ−1,3
−ブタジェン、ピペリレンなどの任意のゴム状重合体で
あるが、特にシタジエンが好ましい。The diene rubber in the present invention includes one or more conjugated 1,6-dienes, such as butadiene, isoprene,
2-chloro-1,6-citadiene, 1-chloro-1,3
- Any rubbery polymer such as butadiene, piperylene, etc., but sitadiene is particularly preferred.
本発明における芳香族ビニル化合物とは、スチレン、α
−メチルスチレン、ビニルトルエン、ジビニルベンゼン
、クロロスチレン、などの単独あるいは混合物を意味す
るが、なかでもスチレン単独で用いると、本発明の場合
にはより良い結果を与える。The aromatic vinyl compounds in the present invention include styrene, α
- Means methylstyrene, vinyltoluene, divinylbenzene, chlorostyrene, etc. alone or in mixtures, among which styrene alone gives better results in the present invention.
更に本発明の、エチレン性不飽和ニトリル−ジエンゴム
−芳香族ビニル共重合体どしては、ジエンゴムまたはジ
エンゴム50重量%以上を含有するジエン含有重合体2
0〜75重量部、好ましくは20〜60重職部に、エチ
レン性不飽和ニトリル化合物及び芳香族ビニル化合物の
混合物80〜25重量部、好ましくは80〜40重量部
をグラフトさせた重合体が良い。Furthermore, the ethylenically unsaturated nitrile-diene rubber-aromatic vinyl copolymer of the present invention is a diene rubber or a diene-containing polymer 2 containing 50% by weight or more of a diene rubber.
A good polymer is a polymer in which 80 to 25 parts by weight, preferably 80 to 40 parts by weight of a mixture of an ethylenically unsaturated nitrile compound and an aromatic vinyl compound is grafted to 0 to 75 parts by weight, preferably 20 to 60 parts by weight.
一方、エチレン性不飽和ニトリル−ジエンゴム−芳香族
ビニル共重合体とエチレン性不飽和ニトリル−芳香族ビ
ニル共重合体との混合物を用いる場合、その比率は、前
者が25〜99重量部、好ましくは65〜65重量部、
後者が1〜75重量部、好ましくは65〜65重量部の
範囲が良い。On the other hand, when a mixture of ethylenically unsaturated nitrile-diene rubber-aromatic vinyl copolymer and ethylenically unsaturated nitrile-aromatic vinyl copolymer is used, the ratio of the former is 25 to 99 parts by weight, preferably 65 to 65 parts by weight,
The latter is preferably in a range of 1 to 75 parts by weight, preferably 65 to 65 parts by weight.
前記範囲以外では、成形性および物性が低下する。Outside the above range, moldability and physical properties deteriorate.
これらの製造方法は、例えば特公昭51−37675号
公報があげられる。前記共重合体又はその混合物の添加
量は、57〜90重量%であり、この範l111以外で
は、成形性および物性が低下する。These manufacturing methods are described, for example, in Japanese Patent Publication No. 37675/1983. The amount of the copolymer or mixture thereof added is from 57 to 90% by weight, and outside this range, moldability and physical properties deteriorate.
次に本発明に用いる可塑剤は、具体的には、ンタル酸エ
ステル系としては、ジブチルフタレートl「
ジ・2−エチルへキシル7タレート、脂肪酸エステル系
としては、ジ・2−エチルへキシルアジペート、ジブチ
ルセパケート、ジ・2−エチルへキシルセパケート、ジ
・2−エチルへキシルアゼレート、エポキシ系としては
、エポキシ化脂肪酸モノエステル、エポキシ化大豆油、
エポキシ化アマニ油、リン酸エステル系としては、トリ
クレジルホスフェート、トリ・2−エチルへキシルフォ
スフェート、トリプトキシエチルフォスフェート、エー
テル系としては、トリエチレングリコールジ・2−エチ
ルブチレート、ジブチルカルビトールアジヘート、ジブ
チルカルケトールホルマール、ポリエステル系としては
、アジピン酸ポリエステル、セペシン酸ポリエステル、
アゼライン酸ポリエステル及び塩素系としては、塩素化
脂肪族エステル、塩素化パラフィン等の少な(とも1種
であって、好ましくは、7タル酸エステル系、リン酸エ
ステル系及び脂肪酸エステル系可塑剤である。Next, the plasticizers used in the present invention are, specifically, dibutyl phthalate, dibutyl phthalate, di-2-ethylhexyl 7-talate, dibutyl phthalate, di-2-ethylhexyl adipate, di-2-ethylhexyl adipate, etc. , dibutyl sepacate, di-2-ethylhexyl sepacate, di-2-ethylhexyl azelate, epoxidized fatty acid monoester, epoxidized soybean oil,
Epoxidized linseed oil, phosphoric acid esters include tricresyl phosphate, tri-2-ethylhexyl phosphate, and triptoxyethyl phosphate; ether-based compounds include triethylene glycol di-2-ethyl butyrate and dibutyl Carbitol adipate, dibutyl calketol formal, polyesters include adipic acid polyester, sepecic acid polyester,
Azelaic acid polyester and chlorine-based plasticizers include chlorinated aliphatic esters, chlorinated paraffins, etc. .
可塑剤の添加量は、3〜25重量%、好ましくは5〜1
5重量%であり、添加量が6重量%未満では、混線時の
樹脂の溶融粘度が高いため繊維長が短かく切断され、し
かも分散不良を起し遮蔽性効果が低下し、しかも粘度上
昇に伴なう成形性が困難となる。また、25重量%を越
えると、力学物性、耐熱性か低下し、しかも可塑剤のブ
リードによる成形品のベトッキが現われる。The amount of plasticizer added is 3 to 25% by weight, preferably 5 to 1% by weight.
5% by weight, and if the amount added is less than 6% by weight, the melt viscosity of the resin at the time of wire crossing is high, so the fiber length is cut short, poor dispersion occurs, the shielding effect decreases, and the viscosity increases. This makes moldability difficult. If it exceeds 25% by weight, the mechanical properties and heat resistance will deteriorate, and the molded product will become sticky due to plasticizer bleeding.
さらえ本発明に用いる炭素繊維は、ポリアクリロニトリ
ル系炭素繊維、ぎツチ系炭素繊維、フェノール系炭素繊
維の群より選ばれる1種又は2種以北の混合物が用いら
れるが、なかでもポリアクリロニトリル系炭素繊維を単
独で用いると特に良好な電磁波遮蔽効果が得られる。Furthermore, the carbon fiber used in the present invention is one type or a mixture of two or more selected from the group of polyacrylonitrile carbon fiber, Gitsuchi carbon fiber, and phenolic carbon fiber. Among them, polyacrylonitrile carbon fiber is used. Particularly good electromagnetic wave shielding effects can be obtained when the fibers are used alone.
炭素繊維の添加量は、5〜40重量%、好ましくは10
〜25重量%であり、添加量が5重量%未満では電磁波
遮蔽効果が殆んど得られず、添加量:が40重量%を越
えると押出成形、射出成形か困難であり、更に成形品の
力学物性に劣るものとなる。また、本発明に用いるカッ
プリング剤は、A 体的にシラン系カップリング剤とし
ては、γ−クロロゾロピルトリメトキシシラン、ビニル
トリクロルシラン、ビニルトリエトキシシラン、ビ二ル
トリス(β−メトキシエトキシ)シラン、γ−メタアク
リロキシプロピルトリメトキシシラン、β−(3,4−
エポキシシクロヘキシル)エチルトリメトキシシラン、
γ−グリシげキシプロピルトリメトキシシラン、γ−メ
ルカプトゾロピルトリメトキシシラン、γ−アミノゾロ
ピルトリエトキシシラン、N−β−(アミノエチル)−
γ−アミノノロビルトリメトキシシ2ン、γ−ウレイド
プロピルトリエトキシシラン、N−β−(アミノエチル
)−γ−アミノプロ♂ルメチルジメトキシシラン。チタ
ネート系カップリング剤としては、イソプロピルトリイ
ソステアロイルチタネート、イソプロピルトリデシルベ
ンゼンスルホニルチタネート、イソプロピルトリス(ジ
オクチルパイロフォスフェート)チタネート、テトライ
ソプロピルビス(ジオクチルホスファイト)チタネート
、テトラオクチルビス(ジトリデシルホスファイト)チ
タネート、テトラ(2,2−ジアリルオキシメチル−1
−ブチル)ビス(ジ−トリデシル)ホスファイトチタネ
ート、ビス(ジオクチルパイロホスフェート)オキシア
セテートチタネート、トリス(ジオクチルパイロ7オス
フエート)エチレンチタネート及びアルミニウム系カッ
プリング剤等より選ばれる一種、又は二種以上の混合物
が用いろ斉る。The amount of carbon fiber added is 5 to 40% by weight, preferably 10% by weight.
~25% by weight, and if the amount added is less than 5% by weight, almost no electromagnetic wave shielding effect will be obtained, and if the amount added exceeds 40% by weight, it will be difficult to perform extrusion molding or injection molding, and furthermore, the molded product will be difficult to form. The mechanical properties are inferior. The coupling agent used in the present invention is A. Examples of the silane coupling agent include γ-chlorozolopyltrimethoxysilane, vinyltrichlorosilane, vinyltriethoxysilane, and vinyltris(β-methoxyethoxy). Silane, γ-methacryloxypropyltrimethoxysilane, β-(3,4-
epoxycyclohexyl)ethyltrimethoxysilane,
γ-glycypropyltrimethoxysilane, γ-mercaptozolopyltrimethoxysilane, γ-aminozolopyltriethoxysilane, N-β-(aminoethyl)-
γ-Aminonorobyltrimethoxysilane, γ-ureidopropyltriethoxysilane, N-β-(aminoethyl)-γ-aminopropylmethyldimethoxysilane. Titanate coupling agents include isopropyl triisostearoyl titanate, isopropyl tridecylbenzenesulfonyl titanate, isopropyl tris (dioctyl pyrophosphate) titanate, tetraisopropyl bis (dioctyl phosphite) titanate, and tetraoctyl bis (ditridecyl phosphite). Titanate, tetra(2,2-diallyloxymethyl-1
- One type, or a mixture of two or more selected from the group consisting of butyl) bis(di-tridecyl) phosphite titanate, bis(dioctyl pyrophosphate) oxyacetate titanate, tris(dioctyl pyro7 osphate) ethylene titanate, aluminum-based coupling agent, etc. Let's use it.
なかでも、カップリング剤にシラン系カッシリング剤を
用いると、耐衝撃強度などの力学物性に特に浸れた樹脂
組成物が得られ、更にシラン系カップリング剤のなかで
も、γ−グリシドキシプロビル・トリメトキシシランを
用いると、耐衝撃強度などの力学物性に最も優れた樹脂
組成物が得られる。In particular, when a silane-based coupling agent is used as a coupling agent, a resin composition with particularly high mechanical properties such as impact strength can be obtained. - When trimethoxysilane is used, a resin composition with the best mechanical properties such as impact strength can be obtained.
カップリング剤の添加量は、0.2〜5重量%、好まし
くは0.5〜6重量%であり、添加量が0.2重Wt
%未満では、耐衝撃強度などの力学物性の改良効果がな
く、また5重蓄気を越えると、酸素指数の低Fにより、
難燃性が低下するばかりか、耐衝撃強度などの力学物性
も劣ったものとなる。The amount of the coupling agent added is 0.2 to 5% by weight, preferably 0.5 to 6% by weight, and the amount added is 0.2 wt.
If it is less than %, there will be no improvement effect on mechanical properties such as impact strength, and if it exceeds 5-fold air accumulation, the oxygen index will be low due to F.
Not only does the flame retardance deteriorate, but also the mechanical properties such as impact strength become inferior.
更に本発明品の性能を改良する為に1酸化防止剤、安定
剤、滑剤などの加工助剤を添加することも出来る。Furthermore, processing aids such as antioxidants, stabilizers, and lubricants may be added to improve the performance of the products of the present invention.
詳(ハ、酸化防止剤として、フェノール系酸化防止剤、
硫黄系酸化防止剤、燐系酸化防止剤が用いられる。Details (c. As an antioxidant, phenolic antioxidant,
Sulfur-based antioxidants and phosphorus-based antioxidants are used.
酸化防止剤の添加骨は、樹脂1DO重量部に対して0.
01〜4重量部が好ましい。The amount of antioxidant added to the bone is 0.0% per 1 DO weight part of the resin.
01 to 4 parts by weight is preferred.
安定剤としては、金属石鹸、無機酸塩類、有機錫化合物
、複合安定剤が用いられる。As the stabilizer, metal soaps, inorganic acid salts, organic tin compounds, and composite stabilizers are used.
安定剤の添加量は、樹脂100重量部に対して0.01
〜4重量部が好ましい。The amount of stabilizer added is 0.01 parts by weight per 100 parts by weight of resin.
~4 parts by weight is preferred.
滑剤としては、パラフィン文び炭化水素樹脂、脂肪酸、
脂肪酸アミド、脂肪酸エステル、脂肪族アルコール、脂
肪酸と多価アルコールの部分エステルが用いられる。As lubricants, paraffin and hydrocarbon resins, fatty acids,
Fatty acid amides, fatty acid esters, fatty alcohols, and partial esters of fatty acids and polyhydric alcohols are used.
滑剤の添加量は、樹脂100重量部に対して0.01〜
4重量部か好ましい。The amount of lubricant added is 0.01 to 100 parts by weight of resin.
4 parts by weight is preferred.
次に、本発明の樹脂組成物の製造方法は、まず粉末状、
ビーズ状、ペレット状など各種形状のエチレン性不飽和
ニトリル−ジエンゴム−芳香族ビニル共重合体またはこ
れと各種形状のエチレン性不飽和二) IJシル−香族
ビニル共重合体との混合物、更に可塑剤、炭素繊維及び
カップリング剤からなるが、成形性や成形品物性の面よ
り、エチレン不飽和ニトリル−ジエンゴム−芳香族ビニ
ル共重合体は粉末状を、エチレン不飽和ニトリル−芳香
族ビニル共重合体は、ビーズ状を用いると更に好ましい
。また、本発明の組成物を均一なものとする為には、バ
ンバリーミキサ−、コニーダー、単軸押出機、2軸押比
機などの混線機、押出機にて混合混線を行ない、さらに
、混線機、押出機にて混合混線を行なう前にタンブラ−
1窩速ミキサー7cどの手段を用いて予備混合を行なっ
ても良い。Next, in the method for producing the resin composition of the present invention, first, powdery
Ethylenically unsaturated nitrile-diene rubber-aromatic vinyl copolymers in various shapes such as beads and pellets, or mixtures of this with ethylenically unsaturated 2) IJ sil-aromatic vinyl copolymers in various shapes, and further plasticized However, from the viewpoint of moldability and physical properties of the molded product, the powder form of the ethylenically unsaturated nitrile-diene rubber-aromatic vinyl copolymer is It is more preferable to use beads in the coalescence. In addition, in order to make the composition of the present invention uniform, mixing and mixing are performed in a mixer or extruder such as a Banbury mixer, a co-kneader, a single-screw extruder, or a twin-screw press ratio machine. Tumbler before mixing in the machine or extruder.
The premixing may be performed using any means such as the one-hole speed mixer 7c.
この混合混線を行なう事で得た樹脂組成物は、射出成形
機のホッパー内に供給し、可塑化シリンダー内で溶融し
、射出成形金型内に射出し、金型内で冷却固化した成形
品を取り出す事で、本発明の樹脂組成物を用いた射出成
形品を得ることかでき、同様に、樹脂組成物を押出成形
機のホッパー内に供給し、可塑化シリンダー内で浴融し
、押出機先端に設置したダイより押し出す事で、本発明
の樹脂組成物を用いた押出成形品を得ることができる。The resin composition obtained by performing this mixing and cross-mixing is supplied into the hopper of an injection molding machine, melted in a plasticizing cylinder, injected into an injection mold, and cooled and solidified in the mold to produce a molded product. By taking out the resin composition of the present invention, an injection molded product can be obtained.Similarly, the resin composition is fed into the hopper of an extrusion molding machine, melted in a bath in a plasticizing cylinder, and extruded. By extruding through a die installed at the tip of the machine, an extrusion molded product using the resin composition of the present invention can be obtained.
(実施例) 以下実施例により本発明の詳細な説明する。(Example) The present invention will be explained in detail below with reference to Examples.
実施例1〜8
樹脂として、組成比が、アクリロニトリル10重量%、
ポリブタジェン50重量%、スチレン40重量%からな
る粉末状アクリロニトリルーズタジエン〜スチレン共重
合樹脂(ABS樹脂)支びアクリロニトリル60重量%
、スチレン40重量係からなるビーズ状アクリロニトリ
ル−スチレン共重合樹脂(As樹脂)を用い、可塑剤は
、ジ−2エチルへキシルフタレート系の化工石鹸(株)
商品名「ビニサイサ゛−≠80」、炭素繊維は、ポリア
クリロニトリル系炭素繊維のチョツプドストランド東邦
レーヨン(株〕商品名[ベスファイトHTAC6S J
、 カップリング剤はシラン系カップリング剤であ
る、γ−グリシドキシプロピル・トで配合し、その配合
物をi4o’cに加熱されたバンバリーミキサ−中に投
入し、溶融混練し混合物が190℃に達した時点で取り
出し、直ちにミキシングロールにてシート状に冷却、粉
砕しペレットとした。Examples 1 to 8 As the resin, the composition ratio is acrylonitrile 10% by weight,
Powdered acrylonitrile loosetadiene consisting of 50% by weight of polybutadiene and 40% by weight of styrene - styrene copolymer resin (ABS resin) supported by 60% by weight of acrylonitrile
A bead-shaped acrylonitrile-styrene copolymer resin (As resin) consisting of 40% styrene by weight was used, and the plasticizer was di-2-ethylhexyl phthalate-based Kako Soap Co., Ltd.
The product name is "Vinicysa-≠80", and the carbon fiber is a chopped strand of polyacrylonitrile carbon fiber manufactured by Toho Rayon Co., Ltd., product name [Besphite HTAC6S J].
The coupling agent was γ-glycidoxypropyl, a silane-based coupling agent, and the mixture was put into a Banbury mixer heated to 4o'c and melted and kneaded until the mixture was 190% When the temperature reached ℃, it was taken out, immediately cooled into a sheet shape using a mixing roll, and crushed into pellets.
このペレットを、8オンス射出成形機のホッパー内に供
給し、可塑化シリンダー内で溶融し、射出成形金型内に
射出する。The pellets are fed into the hopper of an 8 ounce injection molding machine, melted in a plasticizing cylinder, and injected into an injection mold.
射出成形金型は、厚味3mμで15a角の筐体形状で、
デートは、口径2罷φのダイレクトr−トな用いた。The injection mold has a casing shape of 15mm square with a thickness of 3mm.
A direct rotor with a diameter of 2 mm was used as the date.
この様にして得られた成形品は、耐衝撃強度などの力学
物性、耐熱性、電磁波−遮蔽効果ともに優れたものであ
った。The molded product thus obtained was excellent in mechanical properties such as impact strength, heat resistance, and electromagnetic wave shielding effect.
実施例9〜11
第1表に示すような配合組成を実施例1と同様す方法で
ペレット化し、これを直径40WLA′n)押出機(r
、/b=24)のホッパー内に供給し、浴融して200
°Cの単層シートダイに供給する。Examples 9 to 11 The compositions shown in Table 1 were pelletized in the same manner as in Example 1, and pelletized using an extruder (diameter 40W LA'n) (r
, /b=24) into a hopper and melted in a bath of 200
Feed into a single layer sheet die at °C.
ダイの巾は6001n/m 、 リップは3.5FX
/F7!に調整され、この結果厚味3 m1mの単層シ
ートを得た。Die width is 6001n/m, lip is 3.5FX
/F7! As a result, a single layer sheet with a thickness of 3 ml and 1 m was obtained.
得られた単層シートは、第1表に示す通り、耐衝撃強度
などの力学物性、耐熱性、電磁波遮蔽効果の優れたもの
であった。As shown in Table 1, the obtained single-layer sheet had excellent mechanical properties such as impact strength, heat resistance, and electromagnetic wave shielding effect.
実施例12〜16
実施例1の粉末状アクリロニトリル−ブタジェン−スチ
レン共重合樹脂のかわりにメタクリロニトリル50重蓄
気、ポリブタシェフ10重穢チ及びスチレン40it%
からなる粉末状メタクリロニトリルーブタジエンースチ
レン共重合樹脂(MBS樹脂)を用い、他は第1表に示
す配合とした組成を実施例1と同様な方法でペレット化
し、これを用いて射出成形品を得た。物性を測定した結
果、耐衝撃強度などの力学物性、耐熱性、電磁波遮蔽効
果ともに優れていた。Examples 12 to 16 Instead of the powdered acrylonitrile-butadiene-styrene copolymer resin of Example 1, 50% of methacrylonitrile, 10% of polybutashev, and 40it% of styrene were used.
A powdered methacrylonitrile-butadiene-styrene copolymer resin (MBS resin) consisting of the following composition was pelletized in the same manner as in Example 1, and the other compositions were as shown in Table 1. I got the item. As a result of measuring the physical properties, it was found to be excellent in mechanical properties such as impact strength, heat resistance, and electromagnetic wave shielding effect.
実施例14
アクリロニトリル20重量%、ポリブタジェン20重量
%及びメチ2フ蓄気重量係からなるペレット状アクリロ
ニトリルーデタジエンースチレン共重合樹脂(ABS樹
脂)を用い、他は第1表に示す配合とした組成を実施例
1と同様な方法でペレット化し、これを用いて射出成形
品を得た。Example 14 A pelletized acrylonitrile-detadiene-styrene copolymer resin (ABS resin) consisting of 20% by weight of acrylonitrile, 20% by weight of polybutadiene, and 20% by weight of methane was used, and the other formulations were as shown in Table 1. The composition was pelletized in the same manner as in Example 1, and an injection molded product was obtained using the pellet.
物性を測定した結果、耐衝撃強度などの力学物性、耐熱
性及び電磁波遮蔽効果ともに優れていた。As a result of measuring the physical properties, it was found to be excellent in mechanical properties such as impact strength, heat resistance, and electromagnetic wave shielding effect.
実施例15
実施例1のγ−グリシドキシプロぎル・トリメトキシシ
ランのかわりに、イソプロピルトリイソステアロイルチ
タネートを用い、他は第1表に示す配合とした組成を実
施例1と同様な方法でペレット化し、これを用いて射出
成形品を得た。Example 15 A composition using isopropyl triisostearoyl titanate instead of γ-glycidoxyprogyltrimethoxysilane in Example 1, and the other formulations shown in Table 1 was pelletized in the same manner as in Example 1. This was used to obtain an injection molded product.
物性を測定した結果、耐衝撃強度などの力学物性、耐熱
性及び電磁波遮蔽効果ともに優れていた。As a result of measuring the physical properties, it was found to be excellent in mechanical properties such as impact strength, heat resistance, and electromagnetic wave shielding effect.
比較例1〜2
第2表に示すような配合組成で可塑剤を特許請求の範囲
に達せぬ量又は特許請求の範囲を越えた破添加したこと
以外は、実施例1と同様な方法で射出成形品を得た。Comparative Examples 1 to 2 Injection was carried out in the same manner as in Example 1, except that the composition as shown in Table 2 was used and a plasticizer was added in an amount that did not reach the claimed range or exceeded the claimed range. A molded product was obtained.
この射出成形品の物性測定結果を第2表に示す。Table 2 shows the results of measuring the physical properties of this injection molded product.
比較例3〜4
@2表に示すような配合組成で炭素繊維を1#許請求の
範囲に達せぬ量又は特許請求の範囲を越えた貴添加した
こと以外は、実施例1と同様な方法で射出成形品を得た
。Comparative Examples 3 to 4 The same method as in Example 1 except that carbon fiber was added in an amount less than the claimed range or in excess of the claimed range in the blending composition shown in @2 table. An injection molded product was obtained.
この射出成形品の物性測定結果を第2表に示す。Table 2 shows the results of measuring the physical properties of this injection molded product.
比較例5〜6
第2表に示すような配合組成で、カップリング剤を特許
請求の範囲に達せぬ量又は特許請求の範囲を越えた量添
加したこと以外は、実施例1と同様な方法で射出成形品
を得た。Comparative Examples 5 to 6 The same method as in Example 1, except that the composition was as shown in Table 2, and the coupling agent was added in an amount that was below the claimed range or in an amount that exceeded the claimed range. An injection molded product was obtained.
この射出成形品の物性測定結果を@2表に示す。The results of measuring the physical properties of this injection molded product are shown in Table 2.
なお、実施例文び比較例に示す成形品物性は、下記の方
法により測定を行なった。The physical properties of the molded products shown in the Examples and Comparative Examples were measured by the following method.
(1)電磁波遮蔽効果:デンカ法により、図面に示す電
磁波遮蔽効果測定装置を使用し、トラッキングジェネレ
ータにて励起した高周波′電圧を発信アンテナに印加し
、試料を介して受信した受信電圧と発信電圧との比をス
ペクトラムアナライザーにて測定した。(1) Electromagnetic wave shielding effect: Using the Denka method to measure the electromagnetic wave shielding effect shown in the drawing, a high-frequency voltage excited by a tracking generator is applied to the transmitting antenna, and the received voltage and the transmitted voltage received through the sample are The ratio was measured using a spectrum analyzer.
(2) 引張強度: JIS K−6871準拠法(
3) 曲げ強度、曲げ弾性率二ASTM D−790
孕拠法(4) アイゾツト衝撃強度: 、rrs K
−6871準拠法(ノツチ付)
(5) ビカット軟化温度二JIS K−7206準
拠法(6)酸素指数: JIS K−7201準拠法(
発明の効果)
本発明は、共重合体と、炭素繊維と、可塑剤及びカップ
リング剤とからなる樹脂組成物で良好な電磁波遮蔽性と
、樹脂の炭素繊維に対する儒れも充分であるため、成形
性にすぐれ、しかも成形品の耐衝撃強度などの力学物性
にもすぐれた効果を発揮するものである。(2) Tensile strength: JIS K-6871 compliant method (
3) Bending strength, bending modulus ASTM D-790
Conception method (4) Izot impact strength: , rrs K
-6871 compliant method (with notch) (5) Vicat softening temperature 2 JIS K-7206 compliant method (6) Oxygen index: JIS K-7201 compliant method (
Effects of the Invention) The present invention provides a resin composition consisting of a copolymer, carbon fibers, a plasticizer, and a coupling agent, which has good electromagnetic shielding properties and sufficient elasticity of the resin against carbon fibers. It has excellent moldability and also exhibits excellent effects on mechanical properties such as impact strength of molded products.
図面は、本発明のプラスチック成形体の電磁波遮蔽効果
の測定装置の概略図である。
符号
1・・・シールドボックス、2・・・プラスチック成形
品、3・・・発信アンテナ、4・・・受信アンテナ、5
・・・スペクトラムアナライず−、6・・・トラッキン
グジェネレーターThe drawing is a schematic diagram of an apparatus for measuring the electromagnetic wave shielding effect of a plastic molded body according to the present invention. Code 1... Shield box, 2... Plastic molded product, 3... Transmitting antenna, 4... Receiving antenna, 5
...Spectrum Analyzer, 6...Tracking Generator
Claims (4)
ビニル共重合体またはこれとエチレン性不飽和ニトリル
−芳香族ビニル共重合体との混合物57〜90重量%(1) Ethylenically unsaturated nitrile-diene rubber-aromatic vinyl copolymer or a mixture of this and ethylenically unsaturated nitrile-aromatic vinyl copolymer 57 to 90% by weight
物。(4) A resin composition having electromagnetic wave shielding properties characterized by comprising 0.2 to 5% by weight of a coupling agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14518084A JPS6123629A (en) | 1984-07-12 | 1984-07-12 | Resin composition having electromagnetic wave shielding ability |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14518084A JPS6123629A (en) | 1984-07-12 | 1984-07-12 | Resin composition having electromagnetic wave shielding ability |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6123629A true JPS6123629A (en) | 1986-02-01 |
| JPH0428010B2 JPH0428010B2 (en) | 1992-05-13 |
Family
ID=15379274
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14518084A Granted JPS6123629A (en) | 1984-07-12 | 1984-07-12 | Resin composition having electromagnetic wave shielding ability |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6123629A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108017866A (en) * | 2016-11-01 | 2018-05-11 | 中国石油化工股份有限公司 | A kind of polymer composition |
-
1984
- 1984-07-12 JP JP14518084A patent/JPS6123629A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108017866A (en) * | 2016-11-01 | 2018-05-11 | 中国石油化工股份有限公司 | A kind of polymer composition |
| CN108017866B (en) * | 2016-11-01 | 2021-04-09 | 中国石油化工股份有限公司 | Polymer composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0428010B2 (en) | 1992-05-13 |
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