JPS61264792A - Electronic part mounting apparatus - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an electronic component automatic mounting device for automatically mounting electronic components onto a printed circuit board.

BACKGROUND OF THE INVENTION In recent years, many devices have been proposed for automatically mounting electronic components onto printed circuit boards, and there is a growing demand for devices that can be mounted more reliably and quickly. Conventionally, the vertically movable suction device (hereinafter referred to as nozzle) installed in the transfer head of an electronic component placement device applies strong pressure during placement or suction, resulting in damage such as cracking or chipping of electronic components. By reducing the mass of the vertically moving nozzle, electronic components were prevented from cracking or chipping.

Problems to be Solved by the Invention However, with the above structure, although it is desirable to reduce the weight of the nozzle, there are problems in that the strength is weakened, processing is difficult, and costs are high.

Therefore, the present invention maintains the strength of the nozzle with a simple structure, and allows fine adjustments to be made by processing the weight of the nozzle or less through easy processing.

A means for solving the problem and a technical means of the present invention for solving the above-mentioned problem is to provide the pressure mechanism below the nozzle with an elastic body that rebounds and urges it upward.

For production The effect of this technical means is as follows.

When the nozzle descends downward to mount an electronic component on a printed circuit board, or to pick up an electronic component from an electronic component supply device, the nozzle pressurized by the adjustable pressure mechanism does not allow mounting or suction. conduct.

At this time, in order to adjust the pressurizing force to below the mass of the nozzle, an elastic body that urges upward is applied. This allows fine adjustment from pressure.

Example Examples of the present invention will be described below.

In FIG. 3, an electronic component supply device 9 for stocking electronic components 11 on an indexing device 12 is provided in the center front, an electronic component pushing device (not shown) is provided behind it, and an electronic component positioning device is provided behind it. Device 13
Further, a board holder 7 is arranged behind the board holder 7, which positions and holds the printed circuit board 5, moves in the orthogonal direction, and waits at a predetermined position. Transfer device 1 on top of it
is provided, and the transfer device 1 is provided with a transfer head 21. Next, the configuration of the transfer head 21 will be described.

In FIG. 1, a detection shielding plate 6o is fixed to the upper part of the main body 4o of the transfer head 21, which is rotatably supported by the block '44 by a bearing 46 and a lower row 242, and the main body 40 is rotated at the lower part thereof. timing pulley 4
9 and a timing belt 48 are provided, and the main body 40 performs indexing by a motor (not shown).

At the bottom of the main body, there is a sleeve 38 arranged in an annular manner on a horizontal plane.
Eight types of nozzles 39 are provided, which can correspond to the shape of the electronic component 11, and each can be moved up and down.The up and down movement of the nozzle 39 is arbitrarily selected and intermittent feeding is performed at a predetermined position. The vertical movement is achieved by pushing the roller 22 fixed to the block 23 in the inward direction by an external drive. block 2
3 is held by two slide bearings 25 of a holder 26, and is urged upward by a spring 52, and a block 27 and a bottle 2B are provided at the bottom of the shaft 24. A sliding sleeve 31 is provided on the upper part of the sleeve 38, and a return spring 3 is inserted between the sliding sleeve 31
A nozzle shaft 36 is provided in the sleeve 31. At the lower end of the nozzle shaft 36 is a replaceable nozzle 39.
comes to descend in direction B, and a hole for air suction is provided inside, and vacuum is drawn from the main body 4o to the eve 41. A downward adjustment block 29 is provided at the upper part of the nozzle shaft 36, a shaft 32 is provided next to it, a pressurizing spring 33 is provided between the shaft 37 of the main body 4o and the shaft 32, and the nozzle shaft 36 and the sleeve are provided with a pressure spring 33. A spring 36 is provided between the nozzle shafts 38 and 38 to bias the nozzle shaft 36 upward.

Next, we will discuss the effect. Nozzle 39 of transfer head 21
is selected by index using the motor, timing belt 48, and timing pulley 49, and an arbitrary nozzle is positioned at the bottom of the vertical movement mechanism. The roller 22 is pushed in the A direction by an external drive, and the shaft 24, the jib block 27, and the bin 28 are lowered from the block 23 against the spring 52.

As shown in FIG. 2(a), normally the nozzle
When the block 27 and pin 28 are lowered as shown in FIG. , the nozzle shaft 36 is a pressurizing spring 33
Since the nozzle shaft 36 is biased in the direction C, the nozzle shaft 36 descends via the shaft 32. However, the pressure spring 3
The nozzle shaft 36 further descends in the direction B against the spring 36 whose pressing force is smaller than the spring force of No. 3. Descending nozzle 3
The electronic component 11 is attracted to the tip of the nozzle 9, and when it comes into contact with the printed circuit board 5, the shaft 24, the block 27, the pin 28, or the sleeve 31 further descends, the nozzle shaft 3e stops, and the pressing force of the nozzle shaft 36 is applied. The difference between the downward bias of the pressure spring 33 and the upward bias of the spring 36 becomes the pressing force applied to the electronic component 11 . Furthermore, since the shaft 37 moves up and down in the D direction, the downward biasing force of the pressure spring 33 can be adjusted.

In other words, the pressure with which the nozzle shaft 36 and nozzle 39 descend downward can be finely adjusted by the difference between the spring force of the pressurizing spring 33 and the spring force of the spring 36.
6 and the nozzle 39 can be set at a pressure lower than their own weight.

Effects of the Invention As described above, in the present invention, by providing a spring that is opposite to a spring for applying pressure, a pressure difference can be set by selecting the spring, and the pressure difference is applied to electronic components. , there is no need to reduce the weight of the nozzle body, it can be selected freely, and pressures can be arbitrarily set from less than the nozzle's own weight to greater pressures, making it compatible with the types of electronic components and eliminating problems such as cracks and chips. This makes it possible to realize an excellent electronic component mounting device.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a sectional view of a main part thereof, and FIG. 3 is a perspective view of the electronic component mounting apparatus. 1...Transfer device, 2...Extrusion device, 5...Printed circuit board, 11...Electronic component, 2o...Electronic component Automatic mounting device, 21.
...Transfer head, 24...Shaft%3
3... Pressure spring, 36... Nozzle shaft, 35... Ha$, 39...
nozzle.

Claims (1)

[Claims] A transfer head that transfers electronic components is provided with a plurality of suction devices arranged in an annular shape that move up and down to adsorb electronic components, a pressure mechanism that adjusts the descent of each of the suction devices, and a pressure mechanism that repulses the descending suction devices. An electronic component mounting device characterized by being provided with an elastic body that biases upward.