JPS61265231A - Chip mounting equipment - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an apparatus for supplying electronic components in an automatic electronic component mounting apparatus for automatically mounting electronic components on printed circuit boards.

2. Description of the Related Art In recent years, it has become common to attach chip-shaped electronic components (hereinafter referred to as chips) to substrates on which electronic circuits are printed (hereinafter referred to as printed circuit boards). Various methods have been proposed for mounting the chip on a printed circuit board, and there are also many types of packaging for the chip.

Conventionally, as shown in FIG. 3, as one of the packaging methods, wafer-type chips 7 are mounted on all jigs 6, the jigs 6 are attached to the electronic component supply device 1, and a plurality of jigs 6 are placed horizontally. In the electronic component supply device 1, a block 3 is fixed on the x-y; Said X
- A predetermined chip 7 is moved to the suction position by the Y table 2. The wafer type chip 7 is sucked by a transfer head (hereinafter referred to as head) 81C of the transfer device 9 and transferred to the positioning device 10, positioned, further sucked by the head 8, and then printed by the transfer device 9. The configuration was such that it was attached to the board 12.

Problems to be Solved by the Invention However, with the above configuration, the X-axis direction (arrow B) of the Hx-y table 2 is long, so the stopping accuracy in the X-axis direction is poor, and increasing the stopping accuracy requires high cost. Therefore, it is difficult to increase the movement speed. Furthermore, since the jig 6 on the block 3 is moved from side to side, a large space is required.

Means for Solving the Problems The technical means of the present invention for solving the above problems is to use an indexing device on the X-Y table. The jigs are arranged in an annular shape on the inch-inch device.

Operation: With this technical means, a plurality of wafer type chips are indexed by type into a predetermined position by an indexing device, and the lower X-Y table operates within the range of the wafer type chips to place the chips at a suction position. It has the effect of moving the

As a result, the operating range of the X-Y table is narrower, the cumulative error is reduced, and the accuracy of the X-Y table is increased.
The moving speed of the jig can be increased and space can be saved.

Embodiment FIG. 2 shows the entire electronic component automatic mounting device 24 in one embodiment of the present invention, and FIG. The figure is shown below.

The process will be explained in detail along the flow of the printed circuit board 12 in FIG. A board stock 19 for stocking the printed circuit boards 12, a lifter device (loader) 17, an extrusion device 2Q for extruding and supplying the printed circuit boards 12, and a conveyor 11 are provided on the left side, and a board holder 21 for moving in the X-Y direction is provided in the center. is provided, and the printed circuit board 12 is positioned by the board holder 21 and a chip is mounted thereon.

The mounted printed circuit board 12 is inserted (arrow C) into a board stock 19 held by a lifter device (unloader) 18 by an unloading guide rail 26 and an unloading device 25. Epoxy resin is placed behind the board holder 21. A unit 16 and a pasic machine 9 are provided, and an electronic component positioning device 1o and an electronic component pushing device 15 (hereinafter abbreviated as ejector) are provided in front of the board holder 21. Three heads sa and ab move in the direction (arrow).

8C are provided at equal intervals, and the electronic component supply device 1 is provided in front of the ejector 16. The electronic component supply device 1 includes a motor 4 that drives the x@ axis and a motor 5 that drives the Y axis.
Intermittent feed (arrow D)
An index device 14 and a drive motor 13 thereof are provided, and a jig 6 on which wafer-type chips 7t are mounted is arranged and mounted in an annular manner on the top of the index device 14.

Next, we will discuss the effect. The mounting operation of the chip 7 is that the chip 7 from the electronic component supply device 1 is sucked by the ejector 16 and the head 8C, and at the same time, the head 8b sucks the chip that was transferred and positioned in the previous process, and at the same time, the head 5aFi prints. Apply adhesive to the substrate 12. The three heads 8 are simultaneously lowered in the input direction (arrow) by the pacic machine 9, the head 8C transfers the chip onto the positioning device 1o, and the head 8b applies adhesive to the printed circuit board 12 with the head 8&. The head Sa is mounted at the predetermined position where it was applied, and the adhesive is supplied to the head Sa by the epoxy unit 16, and then the heads 8a and 8b are returned to the input direction.

8C performs the above operation and chips one after another? It is adsorbed, positioned, and mounted on the printed circuit board 12. The electronic component supply device 1 feeds the wafer type chips 7 to predetermined positions according to the type by the indexing device 14 intermittently feeds (arrow D) all the way through the sorted wafer type chips 7 using the X-Y table. The selected chip 7 is moved to a predetermined position by moving completely in the B direction (arrow), and the chip 7 is attracted by the mounting action and placed on the printed circuit board 1.
It is attached to 2.

By arranging the jig 6 in an annular manner in the indexing device 14 as described above, the types of wafer type chips 7 can be sorted by rotating the iD force direction arrow).

Effects of the Invention As described above, the present invention improves accuracy by arranging and indexing chips of different wafer types in a ring shape. Higher movement speed? It can be done quickly, and by narrowing the movement range of the X-Y table, it is possible to realize a highly accurate and compact electronic component supply device.

[Brief explanation of the drawing]

FIG. 1 is a plan view of an electronic component supply device according to an embodiment of the present invention, FIG. 2 is a perspective view of an electronic component automatic mounting device equipped with the same device, and FIG. 3 is a plan view of a conventional electronic component supply device. be. 1...Electronic component supply device, 2...X-
Y tape nope 6...Jig, 7...Wafer type electronic components (chips), 8...Transfer head (head), 9...Transfer Device (paysic machine), 10...Positioning device, 11...
... Conveyor, 12 ... Printed circuit board, 1
4... Index device, 16... Electronic component pushing up device (ejector). Name of agent: Patent attorney Toshio Nakao and 1 other person No. 3
figure

Claims (1)

[Claims] A stocking means for stocking electronic components, an electronic component suction device for transferring the electronic components, a Cartesian coordinate table for moving the stocked electronic components to a predetermined position, and an intermittent feed in the rotational direction. An electronic component supply device comprising an intermittent feeding device, the intermittent feeding device being provided on the orthogonal coordinate table, and a plurality of means for stocking the electronic components arranged in a ring above the intermittent feeding device. .