JPS61267604A - Shuttle for carrying integrated circuit device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention broadly relates to a device that evaluates the function of an integrated circuit device (hereinafter abbreviated as IC device) and moves the IC device to a testing machine for testing the device. Regarding the field. It also relates narrowly to the field of shuttles for linearly moving an IC device from one position to another while pivoting the IC device to a distribution box or chute, etc. In a preferred embodiment of the invention, such functionality is provided. It is implemented to protect the IC device from damage during such movements performed at high speeds.

[Conventional technology and problems]

Since the beginning of the semiconductor industry, measurements have been performed to ensure the quality of manufactured IC devices. The typical device is DIP (Dual In-Line or Tsukege)
, 5OIC (small integrated circuit).

PLCC (plastic lead, chipless carrier)
It is. Therefore, the test equipment not only confirms whether the IC device is operable or not, but also measures the degree of operation.
It has been devised to evaluate the degree of integration of circuits in C devices.

The quality evaluations accomplished by such test equipment are performed at high speeds, resulting in the need for handler equipment to circulate the IC devices to be tested at commensurately high speeds to the test locations that couple them to the test equipment. Ta. For example, a handler's input magazine may have multiple trajectories (as many as 8 or 10) and a single test position. In such cases, the shuttle may be used to transport IC devices to the input of a chute that receives the IC devices and transports them to a test location.
C devices are located proximate to the exit ends of their respective tracks. Typically, the shuttle that facilitates this operation is one that moves at high speed and in a straight line.

The structure of an IC device varies depending on the nature of the device. For example, a 5OIC (small integrated circuit) has a substantially flat body portion with a plurality of tower-shaped contacts formed around its outer periphery, whereas a DIP typically has a rectangular body portion having a row of elongated contacts extending from each of the elongated sides of the body portion, the contacts extending generally perpendicular to the plane formed by the opposing surfaces of the body portion. ing. However, regardless of the structure of the IC device, the body portion is primarily composed of ceramic or silicon type materials. Therefore, the main body part is easily cracked and destroyed, and this is particularly noticeable when the main body is moved unexpectedly and at high speed by the shuttle as described above. The present invention solves these problems of the prior art. And it is an improved shuttle mechanism for using IC device handler devices at high speeds.

[Means for solving problems]

The present invention is a shuttle mechanism capable of transporting an IC device from one location to another, or from one direction to another. The mechanism has a guide element having a generally flat surface along which the body portion of the IC device moves as it enters the shuttle. The wedge stopper is arranged opposite the guide surface and has a surface that is inclined and opposite to the plane formed by the guide surface.

The face of the wedge stop slopes toward the guide surface and in the direction of movement of the IC device as it enters and exits the shuttle.

The wedge stop has an edge closest to the generally flat surface of the guide.

Such a structure is part of the present shuttle invention.
~The IC device operated by Dofun is a wedge strike 714
wedge engagement between the surface and the substantially flat surface of the guy P, and during sudden acceleration or deceleration of the shuttle when moving from one position to another position or from one direction to another, the shuttle can be held in place. can be held.

Therefore, the chance of damaging the IC device, especially the main body of the device, can be minimized.

The preferred embodiment of the present invention is specifically designed as a shuttle transport version of a DIP (Dual In-Line Package) device. In this specification, the shuttle is DIPt
When in the receiving position, the guide may be formed as a substantially vertically extending tongue. As the DIP moves into the shuttle, its contacts straddle the tongue, and the space between the sides of the tongue and the row of contacts is preferably small.

A preferred implementation provides a wall facing the surface of the tongue that can engage one of the opposing surfaces of the DIP body portion. The wall is separated from the surface of the tongue by a distance slightly greater than the thickness of the DIP body. This wall has a pair of wedges that can be moved back and forth through the wall. has
When the wedge stopper reciprocates toward the surface of the tongue, the DI
Hold the P main body part and use the IC when accelerating or decelerating the shuttle.
This can prevent rattling noises from the device. The wall has a wedge stop firmly mounted thereto, and the IC
Approach the surface of the tongue that engages the main body part of the device.

It will be appreciated that it is made to reciprocate with the wedge stop for separation. When the shuttle is used as a sorter shuttle, the shuttle can be used in combination with a plurality of distribution boxes, and IC devices carried by the shuttle are discharged into the distribution boxes. Such distribution boxes may incorporate optical detection means such as light emitting diodes (LEDs) or inverters. When the shuttle is so used, it has a wing that is carried into the distribution box when it is in position to eject the IC device, the wing that intercepts the light beam t-a from the LED. , masking the receptor. The detection means are further provided for transmitting a signal when the receptor is sufficiently obscured, thereby causing the wedge horn 4 to move away from the surface of the tongue in order to release the IC device carried by the shuttle. The actuation of the retracting means begins.

In a preferred embodiment, the wedge stock is biased toward a position closest to the surface of the tongue. Means are provided to overcome this bias when the shuttle in the proper position is detected, thereby retracting the wedge horn and releasing the IC device carried by the shuttle.

Therefore, the present invention resides in an improved secondary shuttle structure to overcome the problems of the prior art. The features of the device of the invention and the advantages derived from them will become clearer with reference to the following ``Example'' section of the specification and claims, as well as the accompanying drawings.

〔Example〕

Identical elements are designated by the same reference numerals throughout the drawings. FIG. 6 shows an integrated circuit device (hereinafter abbreviated as IC device) 10t, which is the type to be transported in the present invention. The IC device is characterized in the prior art as a DIP (dual in-line package). IC device 10 also has a generally rectangular body portion 12 . Body portion 12 has a predetermined thickness 14 . A plurality of contacts 16 extend across each long side of body portion 12 in a peg-like manner.

The plurality of contacts 16 extend from the main body part 12 in a direction substantially perpendicular to a plane formed by one of the two opposing surfaces 18 and 1g' of the main body part 12.

FIG. 1 illustrates a shuttle 20 according to the present invention.

This particular illustrated shuttle 20 accepts DIPI
The shuttle 20 is of a type that moves across the entrances of a plurality of distribution boxes or chutes into which IC devices are discharged.

However, it will be appreciated that the present invention also contemplates implementing this feature on other types of shuttles, such as rotating shuttles that pivot about a single axis.

The shuttle 20 of FIG. 1 moves along a rail 22 having an upper track 24 and a lower track 26. The shuttle 20 of FIG.

As is clear from FIG. flc5, the back surface 28 of the shuttle transport platform 30 has a pair of upper rollers 32 and a lower roller 34, respectively.
and ride on the upper track 24 and the upper and lower tracks 26, respectively. The tracks 24.26 are grooves 36 on which rollers 32.34 ride.
．． 38, whereby the shuttle mechanism
It is held on 2.

If such a drive mechanism is used, FIG. 1 shows a belt drive means for moving the shuttle linearly along the rail, the bell 40 will be held rigidly against the shuttle 20 so that the belt 40 will move relative to the rail 22. When moving in the longitudinal direction, the shuttle 20 moves as well. However, it will be appreciated that any other suitable shuttle drive means may be used for this drive means.

2, 3, and 4, the shuttle 20 has a generally longitudinally extending tongue-shaped guide 42, and as is apparent from FIG. 4, the guide 42 is U-shaped to reduce weight. It can be a cross section of U.

The legs 44,46 of the figure are separated by a distance equal to the width of the body portion 12 of the DIPIO to be handled. The upper end 48 of the guide 42 may be beveled as described below (as indicated by the next numeral 50 to facilitate entry into the throat 52 of the IC device 10). , the IC device 10 entering the shuttle 20 has υ leg 4
Two rows of contacts 16 in contact with end faces 54 and 56 of 4 and 46
An opposing generally planar surface 18' of the body portion 12 therebetween engages an inclined surface 50 of the upper end 48 of the guide 42.

In this way, the nigga contactor 16 straddles the guide 42,
The shuttle 20 further includes a wall 58 facing the flat end surface 54.56 of the guide leg 44.46;
is any conventional thickness 1 of the body portion 12 of DIPl, 0
It is separated from said tip surface 54.56 by a distance greater than 4. With such an arrangement, the present invention can be used with any commercially available DIP.

In the preferred embodiment a pair of wedge stops 62.6
2' is made to reciprocate through a hole formed in the wall 58 for approaching and leaving the distal end faces 54, 56 of the guide legs in a manner to be described below. Between the tip surface 64 and 64' of the wedge stone/46162' [60 is the wedge stopper 62]
．． This reciprocating movement of 62' is variable.

Although a preferred embodiment of the invention has been described above with respect to the reciprocating movement of the wedge stops 62, 62', the invention also
4. Wall 5 facing the almost flat tip surface 54° 56 of 46
8 supports a wedge stone/# 62 + 62', whose wedge stones 462, 62' are fixed to the wall 58,
It will be understood that a structure that reciprocates toward and away from the tongue-shaped guide 42 is also assumed. In such alternative embodiments, the space between the wall 58 and the distal end faces 54, 56 of the guide legs is approximately equal to the thickness 14 of the body portion 12 of the DIPIO when the wall 58 is closest to the guide 42.
It will be slightly larger.

As is apparent from FIG. 4, the preferred embodiment of the present invention employs a pair of integrally molded wedge stops 62, 62', the arms of which are spaced apart from each other by a distance substantially equal to the width of the DIPIO. There is. It will be appreciated that, apart from such a structure as contemplated by the preferred embodiment, a single wedge stopper would function equally well to achieve the design goals of the structure.

The throat 52 through which the DIPIO passes is formed by the distal end surfaces 54,56 of the guide legs and the wall 58.
Regardless of the relationship of the wedge stone/#62, 62' to the wall 5 (i.e., whether the wedge stop is arranged for reciprocating movement through the wall 58 as in the preferred embodiment)
8, the wedge stopper 62.
The distal surface 64.64' of 62' is angled toward the guide 42 in the direction of the DIPIO passing through the throat 52. As a result, when the IC device 1O enters the throat 52 from the top of the shuttle 20, a wedge strut or 62.62'
The distal end face 64.64 of the wedge stop 62.62' at the position of closest reciprocation towards the guide
' and the legs 44, 46 of the U-shaped tongue 42 form a wedge. Wedge strike cello 2 in this position
．． 62', the stop not only blocks movement of the IC device 10 out of the shuttle 20, but also eliminates device rattling due to the vomiting effect.

When a shuttle of the type shown in this figure is closest to the distribution box or discharge chute from which the IC device is discharged, the DIP
It is necessary to be able to retract the wedge stop 62, 62' so that 10 can freely escape from the throat 52 into the distribution box or discharge seat. In the preferred embodiment, the wedge ston/162, 62' is biased into a position that closes the throat 52 by means such as a spring 66 that urges its extension 68 in the appropriate direction.

As shown in Figures 2, 3 and 4, Sugeling 66
abuts the shoulder 70 formed by the shuttle carriage 30 at one end and releases butane 74 at the opposite end.
The tongue 74 is in contact with the shoulder 72 formed by the tongue 74.
Is there a wedge at its end? It is supported by an extension 68. When the release button 74 is pressed, the spring piston is overcome and the wedge stones 462, 62' are moved away from the guide 42 to allow the desired free egress of the IC device IO carried by the shuttle 20. .

An important feature of the invention is that the I
The release button 74 is actuated by means 2 provided on the particular distribution box or discharge sheet from which the C device 10 is to be discharged. For example, processor means (not shown) may be used if the shuttle 20 is moved across a plurality of ejection sheets to receive IC devices depending on the quality of the IC devices ascertained while the device is in the test position. ) transmits a signal to begin operating the mechanism only in the appropriate distribution box. As a result, release button 74 will not be actuated if shuttle 20 is not in the proper dispensing box position.

Shuttle 2 at a particular discharge distribution box 76 location as shown in FIG.
Indicates 0. Shuttle 20 is shown supporting wing-like projections 78 extending rearwardly from shuttle platform 30. When the shuttle 20 is in each stage, with the formed throat 52 aligned with one distribution box, the wing-like projections 78 are inserted into the slits 80 formed in the element 82 supported by the distribution box. be located. Light emitting diode (LED
) 84 indicates that optical receptor 86 and winglet 78 are not located within a particular slit 80 .

In operation, again using the example of a shuttle that accomplishes the design objective of discharging a tested IC device at a test location into an appropriate distribution box, the processor means linearly moves the shuttle 20 to the appropriate distribution box. In order to do this, instructions are given to a step motor (not shown). At the same time, the processor means provides a signal to an actuator 88 which is actuated by a solenoid valve 90 at the distribution box location to cause the wedge stop to retract when the actuator 88 receives a signal indicating that the shuttle 20 is in the proper position. Press release button 74 on shuttle 20.

As described below, the IC device 10 reports the correct minute record 76.
A number of safety devices are provided to ensure that the First, a signal is sent to the stepper motor to move the stepper motor in a direction that positions the shuttle 20 in proximity to the correct distribution box. Second, the shuttle 20 is detected by the optical detection means 84,86 as being in the correct distribution box. And finally, the signal is sent to the actuator 88 only in the correct distribution box so that it overcomes the wedge stopper spring piers 66 so that the IC device 10 supported within the throat 52 of the shuttle 20
to release.

The numerous features and advantages of the invention encompassed herein will be apparent from the foregoing description. However, it will be appreciated that this disclosure is in many respects only illustrative. In detail,
Modified embodiments may be made without exceeding the scope of the present invention, especially in terms of shape, size, and arrangement of parts. Naturally, the scope of the invention is defined in the appended claims.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a shuttle according to the invention installed in orbit; FIG. 2 is a partially exploded side view of the shuttle of FIG. 1; FIG. 3 is similar to FIG. FIG. 4 is a bottom view of the shuttle of FIG. 1; FIG. 5 is a rear view of the shuttle shown in FIG. 1; FIG. 6 is a rear view of the shuttle shown in FIG. A perspective view of DIP. DESCRIPTION OF SYMBOLS 10... Integrated circuit (IC) device, 12... Main body part, 20... Shuttle, 30... Shuttle carrier, 4
2... Tongue-shaped guide, 52... Throat, 62... Wedge-shaped guide J? , 74...Release button, 76...
Distribution box, 88...actuator.

Claims (1)

[Claims] 1. A shuttle for transporting an integrated circuit having a plate-like main body, the shuttle having: (a) a substantially flat surface that can be engaged with one of the opposing side surfaces of the integrated circuit main body; , a guide for guiding the movement of the main body of the integrated circuit when the integrated circuit enters the shuttle; (b) a guide disposed opposite to the guide and facing the generally flat surface of the guide from the direction in which the integrated circuit enters the shuttle; wedge means having a surface inclined relative to the generally flat surface of the guide angled to form an edge proximate the generally flat surface thereof. 2. The integrated circuit main body portion has a predetermined thickness, and the wedge means is capable of reciprocating movement toward and away from the substantially flat surface of the guide, and the wedge means is capable of reciprocating so as to approach and move away from the substantially flat surface of the guide. 2. The shuttle of claim 1, wherein the edge of the wedge is separated from the generally planar surface of the guide by a distance less than or equal to the thickness of the integrated circuit body portion when in the closest position to the surface. 3. The shuttle of claim 2, wherein the integrated circuit enters from the top thereof and is further provided with means for moving said shuttle across its entrance to a plurality of ejection chutes. 4. A dual in-line package having a plate-like main body portion elongated along one axis and two rows of contact elements extending from opposite elongated edges of the main body portion and substantially perpendicular to the plane formed by the main body portion. Accepts integrated circuit devices,
A dispensing shuttle comprising: (a) a tongue member having a surface for engaging a first surface of the body portion oriented in the direction in which the contact elements of the collecting surface extend; and (b) facing said surface of the tongue member. a wall having a width slightly larger than the thickness of the integrated circuit main body portion between the two; a pair of wedge stops for preventing downward movement of the dual in-line packaged integrated circuit device through the throat, the wedge stops having a surface engageable by the integrated circuit device entering the throat; , these surfaces being angled downwardly towards said surface of the tongue. 5. A shuttle for dispensing dual in-line packaged integrated circuit devices into at least one distribution box having an optical detection means for confirming the presence of the shuttle at a location where the integrated circuit device is ejected into the distribution box; Claim 4 further comprising means for cooperating with optical detection means supported by the shuttle and for signaling the presence of the shuttle at a suitable location for ejecting the integrated circuit device carried by the shuttle into the distribution box. Shuttle as described in. 6. The shuttle of claim 5, wherein said cooperating means has a wing-like projection extending from the shuttle to intercept the light beam transmitted by the optical detection means. 7. The shuttle of claim 4 further comprising means for biasing the wedge stop toward the surface of the tongue. 8. A shuttle for dispensing dual in-line packaged integrated circuit devices to at least one distribution box, the shuttle comprising:
The distribution box has means for counteracting the biasing force of the wedge stop toward the surface of the tongue, and the distribution box actuates said means when the shuttle carrying the integrated circuit device is in the proper position of the distribution box. 8. A shuttle as claimed in claim 7 for releasing an integrated circuit device.