JPS6127664A - リ−ド端子の取付方法 - Google Patents

リ−ド端子の取付方法

Info

Publication number
JPS6127664A
JPS6127664A JP14763784A JP14763784A JPS6127664A JP S6127664 A JPS6127664 A JP S6127664A JP 14763784 A JP14763784 A JP 14763784A JP 14763784 A JP14763784 A JP 14763784A JP S6127664 A JPS6127664 A JP S6127664A
Authority
JP
Japan
Prior art keywords
lead
lead terminals
clips
lead frame
sides
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14763784A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0470777B2 (mo
Inventor
Noritaka Koshiba
小柴　則隆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wako Sangyo KK
Original Assignee
Wako Sangyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wako Sangyo KK filed Critical Wako Sangyo KK
Priority to JP14763784A priority Critical patent/JPS6127664A/ja
Publication of JPS6127664A publication Critical patent/JPS6127664A/ja
Publication of JPH0470777B2 publication Critical patent/JPH0470777B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP14763784A 1984-07-18 1984-07-18 リ−ド端子の取付方法 Granted JPS6127664A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14763784A JPS6127664A (ja) 1984-07-18 1984-07-18 リ−ド端子の取付方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14763784A JPS6127664A (ja) 1984-07-18 1984-07-18 リ−ド端子の取付方法

Publications (2)

Publication Number Publication Date
JPS6127664A true JPS6127664A (ja) 1986-02-07
JPH0470777B2 JPH0470777B2 (mo) 1992-11-11

Family

ID=15434835

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14763784A Granted JPS6127664A (ja) 1984-07-18 1984-07-18 リ−ド端子の取付方法

Country Status (1)

Country Link
JP (1) JPS6127664A (mo)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4816427A (en) * 1986-09-02 1989-03-28 Dennis Richard K Process for connecting lead frame to semiconductor device
US4989318A (en) * 1988-06-09 1991-02-05 Oki Electric Industry Co., Ltd. Process of assembling terminal structure

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4522623Y1 (mo) * 1967-12-27 1970-09-07
JPS5259265U (mo) * 1975-10-29 1977-04-30
JPS5618448A (en) * 1979-07-24 1981-02-21 Sony Corp Composite electronic part

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4522623Y1 (mo) * 1967-12-27 1970-09-07
JPS5259265U (mo) * 1975-10-29 1977-04-30
JPS5618448A (en) * 1979-07-24 1981-02-21 Sony Corp Composite electronic part

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4816427A (en) * 1986-09-02 1989-03-28 Dennis Richard K Process for connecting lead frame to semiconductor device
US4989318A (en) * 1988-06-09 1991-02-05 Oki Electric Industry Co., Ltd. Process of assembling terminal structure
US5081764A (en) * 1988-06-09 1992-01-21 Oki Electric Industry Co., Ltd. Terminal structure and process of fabricating the same

Also Published As

Publication number Publication date
JPH0470777B2 (mo) 1992-11-11

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