JPS6128281A - Solid-state image pickup device - Google Patents

Abstract

PURPOSE:To attain a solid-state image pickup device with inexpensive material cost and simple structure by bonding a glass filter to a semiconductor image pickup element, sealing incorporatedly a resin to the bonded element so that the upper face of the glass filter is exposed and the exposed face is formed directly to a photodetector section. CONSTITUTION:First the image pickup element 2 is fixed onto a lead frame 8 via silver paste resin and external leads 9 arranged radially are bonded by a metallic fine wire 3. Then a color filter 6 is adhered to the image pickup element 2 via an adhesives and after the adhesives is cured, the incorporated bonded body between the image pickup element 2 and the color filter 6 is sealed by the resin so that the upper face of the color filter 6 is exposed. Finally, the sealing resin detoured to the exposed face of the color filter 6 is polished by grinding particles with very fine grain (e.g., No. 10,000-15,000) to smooth the photodetecting section.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a sealing structure for a solid-state imaging device used in a VTR camera or the like, particularly a semiconductor imaging element and a glass filter.

[Prior art]

A conventional solid-state imaging device of this type is shown in Figure 2, for example! It is configured as shown. That is, the image sensor 12 is placed in the mounting recess 11c of the container 11, and the filter 16 is bonded to the image sensor 12 via the adhesive 15. It is hermetically sealed from the top by a translucent glass face plate 14 that functions as a lid.
With internal connection leads and external lead-out leads,
A connection is made between the image pickup element 12 and the internal connection lead lla using thin metal wires 13&c.

However, this structure has the disadvantage that the container is made of ivy, which increases the cost of materials, and the container and glass face plate have special shapes, resulting in poor productivity and high manufacturing costs. Ta.

[Purpose of the invention]

The purpose of the present invention is to overcome such drawbacks and to integrally seal the solid-state image sensor and the glass filter with resin, thereby achieving
It is an object of the present invention to provide a solid-state imaging device in which a glass filter surface is formed as an exposure part, and the material cost is low and the structure is simple.

[Structure of the invention]

A solid-state imaging device according to the present invention includes a solid-state imaging device, a glass filter bonded onto the solid-state imaging device, and a sealing resin that seals the solid-state imaging device and the glass filter so that the top surface of the glass filter is exposed. It is made of a molded body and is configured so that the exposed surface of the glass filter is directly formed as a light receiving section.

〔Example〕

An embodiment of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a cross-sectional view of essential parts of an embodiment of the solid-state imaging device of the present invention.

In FIG. 1, 2 is a semiconductor imaging cable, 6 is a color filter, 7 is a sealing resin, 8 is a lead frame made of Kovar or 42 alloy, 9 is an external lead, and 3 is a thin metal wire made of gold, etc. be.

In manufacturing the imaging device, first, the imaging cord 2 is fixed onto the lead frame 8 via silver paste resin, etc., and the thin metal wire 3 is inserted between it and the external lead-out leads 9 arranged radially.
and then connect the color filter 6 to the top of the image sensor 2.
are attached via an adhesive, and after the adhesive hardens, the integrally bonded body of the image sensor 2 and the color filter 6 is sealed with a resin so that the upper surface of the color filter 6 is exposed.

Finally, the sealing resin wrapped around the exposed surface of the color filter 6 is coated with extremely fine particles (for example, 10°000~
No. 15.000) is polished with abrasive grains to smooth the light receiving area. Here, the thickness of the color filter 6 bonded onto the imaging cable 2 is preferably set to about 3 mm.

As explained above, according to the present invention, the conventional expensive ceramic container is not required, and at the same time, the structure is extremely simple, and both the material price and manufacturing cost are reduced, and the product can be manufactured at extremely low cost. . Especially when manufacturing home VTR cameras, the demand for which is expected to increase in the future,
This greatly contributes to cost reduction.

〔Effect of the invention〕

As explained above, according to the solid-state imaging device of the present invention, a glass filter is bonded onto a semiconductor imaging cable, and the bonded body is integrally resin-sealed so as to expose the top surface of the glass filter. Since it is constructed so that the exposed surface can be formed directly on the light-receiving section, it has the advantage that the conventional expensive cellic container is not required and the structure is extremely simple. Therefore, there is an advantage that both material costs and manufacturing costs are reduced, and the product can be manufactured at extremely low cost.

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view of a main part showing an embodiment of a solid-state image sensor of the present invention, and FIG. 2 is a cross-sectional view of a main part showing an example of a conventional solid-state image sensor. 2... Solid-state image sensor 11c... Recessed portion 3...
Thin metal wire 12... Solid-state imaging device 6... Glass filter 13... Thin metal wire 7... Sealing resin 14... Translucent gaff face plate 8... Lead frame 15... Adhesive resin 9 ... External lead-out lead 16... Glass filter 11... Selantsk storage container 11a... Internal connection lead 11b... External lead-out lead

Claims (1)

[Claims] It is characterized by comprising a solid-state image sensor, a glass filter bonded onto the solid-state image sensor, and a sealed resin molded body in which the solid-state image sensor and the glass filter are sealed so that the top surface of the glass filter is exposed. solid-state image sensor.