JPS61292346A - 樹脂封止型半導体装置 - Google Patents

樹脂封止型半導体装置

Info

Publication number
JPS61292346A
JPS61292346A JP60134658A JP13465885A JPS61292346A JP S61292346 A JPS61292346 A JP S61292346A JP 60134658 A JP60134658 A JP 60134658A JP 13465885 A JP13465885 A JP 13465885A JP S61292346 A JPS61292346 A JP S61292346A
Authority
JP
Japan
Prior art keywords
resin
heat sink
bed
molded layer
mold layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60134658A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0363822B2 (2
Inventor
Toshihiro Kato
加藤　俊博
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP60134658A priority Critical patent/JPS61292346A/ja
Priority to KR1019860004702A priority patent/KR900001833B1/ko
Priority to EP86304725A priority patent/EP0206771B1/en
Priority to DE8686304725T priority patent/DE3684184D1/de
Publication of JPS61292346A publication Critical patent/JPS61292346A/ja
Priority to US07/334,771 priority patent/US4924351A/en
Publication of JPH0363822B2 publication Critical patent/JPH0363822B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP60134658A 1985-06-20 1985-06-20 樹脂封止型半導体装置 Granted JPS61292346A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP60134658A JPS61292346A (ja) 1985-06-20 1985-06-20 樹脂封止型半導体装置
KR1019860004702A KR900001833B1 (ko) 1985-06-20 1986-06-13 수지봉합형 반도체장치
EP86304725A EP0206771B1 (en) 1985-06-20 1986-06-19 Packaged semiconductor device
DE8686304725T DE3684184D1 (de) 1985-06-20 1986-06-19 Verkapselte halbleiteranordnung.
US07/334,771 US4924351A (en) 1985-06-20 1989-04-10 Recessed thermally conductive packaged semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60134658A JPS61292346A (ja) 1985-06-20 1985-06-20 樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
JPS61292346A true JPS61292346A (ja) 1986-12-23
JPH0363822B2 JPH0363822B2 (2) 1991-10-02

Family

ID=15133527

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60134658A Granted JPS61292346A (ja) 1985-06-20 1985-06-20 樹脂封止型半導体装置

Country Status (2)

Country Link
JP (1) JPS61292346A (2)
KR (1) KR900001833B1 (2)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0194643A (ja) * 1987-10-06 1989-04-13 Oki Electric Ind Co Ltd 薄型構造の半導体装置の製造方法
JPH07169882A (ja) * 1991-05-23 1995-07-04 At & T Corp モールドされた集積回路パッケージ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0194643A (ja) * 1987-10-06 1989-04-13 Oki Electric Ind Co Ltd 薄型構造の半導体装置の製造方法
JPH07169882A (ja) * 1991-05-23 1995-07-04 At & T Corp モールドされた集積回路パッケージ

Also Published As

Publication number Publication date
KR870000753A (ko) 1987-02-20
JPH0363822B2 (2) 1991-10-02
KR900001833B1 (ko) 1990-03-24

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term