JPS6130421B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an auxiliary holder for semiconductor substrates, and in particular to a semiconductor substrate storage box (hereinafter referred to as quartz carrier) basically consisting of two round rods used in a diffusion furnace, etc.
This invention relates to a semiconductor substrate auxiliary holder used for transferring semiconductor substrates between the present invention and another semiconductor substrate storage and release box.

Conventionally, in this type of transfer, it has been common to transfer semiconductor substrates directly between a groove in a quartz carrier and a groove in another semiconductor substrate storage box. Generally, when transferring semiconductor substrates between semiconductor substrate storage boxes, it is essential that the pitches between the semiconductor substrates housed in the semiconductor substrates be constant and at equal intervals. However, in a quartz carrier, the semiconductor substrate is held in a state close to point contact near the outer periphery, so the inclination of the semiconductor substrate is not constant.

It has the disadvantage that the groove pitch changes due to thermal deformation, and it has been extremely difficult to use the quartz carrier itself to transfer semiconductor substrates to other semiconductor substrate storage boxes.

The present invention was devised to eliminate these drawbacks, and its characteristics are that a quartz carrier is housed at the bottom of the quartz carrier, and when the semiconductor substrate is completely removed from the groove of the quartz carrier, it is accurately held by a blade-like member, and the semiconductor substrate is removed. It has a structure in which the pitches between the two are constant and equally spaced.

This method has the advantage that although the semiconductor substrates are housed in quartz carriers when transferred between semiconductor substrate storage boxes, the grooves in the quartz carriers do not need to be used during actual transfer.

The drawings will be explained in detail below. 1 to 7 show an embodiment of the present invention. First of all, a description will be given of the case where the quartz carrier 6 and the semiconductor substrate 8 are installed and held. As shown in FIGS. Set the groove at one end that does not contain the holder at the position of the guide plate 2 of the auxiliary holder 1. (This automatically positions the quartz carrier 6 and the blade-like member 3 of the auxiliary holder 1.) Next, the quartz carrier 6 is moved along the guide plate 2 in the direction of arrow A.
At this time, when the point shown in FIG. 4 is reached, the semiconductor substrate 8
begins to be guided in the pitch direction by the wing-like member 3. When the semiconductor substrate 8 is further moved in the direction of arrow A and reaches the point shown in FIG. 5, the semiconductor substrate 8 comes into contact with the groove 4 of the auxiliary holder, and the quartz carrier 6 and the semi-conductor substrate 8 begin to separate. The state shown in FIG. 6 after further movement in the direction of arrow A is the state in which the quartz carrier 6 and semiconductor substrate 8 are installed on the auxiliary holder 1. In this state, the quartz carrier 6 and the semiconductor substrate 8 are completely separated, so the accuracy of the quartz carrier 6 has no effect on the transfer between the auxiliary holder 1 and another semiconductor substrate storage box. Above, we have explained how to operate the quartz carrier 6 and the semiconductor substrate 8 from the uninstalled state to the installed state, but conversely, when taking out the quartz carrier 6 and the semiconductor substrate 8 from the auxiliary holder 1, the above procedure is completely different. It goes without saying that a predetermined objective can be achieved by performing the opposite operation. As explained above, if the auxiliary holder of the present invention is used, the pitch between the semiconductor substrates can be maintained at an even distance while holding the quartz carrier and the semiconductor substrate, and the semiconductor substrate can be transferred to or from another semiconductor substrate storage box. is easily performed. In particular, the auxiliary holder of the present invention is effective when used as a dedicated carrier in the process of transferring semiconductor substrates to other semiconductor substrate storage boxes in batch processing of each quartz carrier.

Although the present invention has been described in the embodiments using the shapes shown in FIGS. Needless to say, the present invention is applicable to all configurations regardless of the shape as long as it has a means for guiding and holding by a wing-like member and a structure in which the quartz carrier and the semiconductor substrate are separated in the installed state.

[Brief explanation of the drawing]

Fig. 1 is a perspective view showing one embodiment of the present invention;
The figure is a perspective view showing a state in which a quartz carrier and a semiconductor substrate are installed and held in one embodiment shown in FIG. 1, FIGS. 3 to 6 are sectional views showing the operation, and FIG.
The figure is a side view of the state shown in FIG. 6. In the figures, 1...auxiliary holder, 2...guide plate, 3...wing-like member, 4...groove of auxiliary holder, 5...substrate, 6...quartz carrier, 7...quartz carrier groove, 8... is a semiconductor substrate.

Claims (1)

[Claims] 1. In a semiconductor substrate auxiliary holder for transferring a semiconductor substrate from a quartz carrier in which two parallel round bars are provided with opposing grooves for holding semiconductor substrates,
A plurality of blade-like members made of thin plates are arranged on the base at the same pitch as the grooves of the quartz carrier, and the plate width of each blade-like member is formed to fit between the parallel round bars of the quartz carrier. One blade-shaped member is formed wider than the other blade-shaped members and serves as a positioning plate that can be inserted into the groove of the quartz carrier, and the bottom surface between each blade-shaped member is arranged so that the quartz carrier holding the semiconductor substrate is connected to the blade-shaped member. A semiconductor substrate auxiliary holder, characterized in that the semiconductor substrate auxiliary holder is provided at a height such that each semiconductor substrate comes into contact with the bottom surface portion and is separated from the groove of the quartz carrier when the semiconductor substrates are placed in a group and placed on the base.