JPS6135539A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6135539A
JPS6135539A JP15680384A JP15680384A JPS6135539A JP S6135539 A JPS6135539 A JP S6135539A JP 15680384 A JP15680384 A JP 15680384A JP 15680384 A JP15680384 A JP 15680384A JP S6135539 A JPS6135539 A JP S6135539A
Authority
JP
Japan
Prior art keywords
semiconductor device
laminated substrate
substrate
insulating
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15680384A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0414504B2 (2
Inventor
Toru Kamata
徹 鎌田
Shozo Noguchi
野口　召三
Yasuhiro Kurokawa
泰弘 黒川
Kazuaki Uchiumi
和明 内海
Hideo Takamizawa
秀男 高見沢
Keiichi Yotsuyanagi
四柳　啓一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP15680384A priority Critical patent/JPS6135539A/ja
Publication of JPS6135539A publication Critical patent/JPS6135539A/ja
Publication of JPH0414504B2 publication Critical patent/JPH0414504B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Ceramic Products (AREA)
  • Compositions Of Oxide Ceramics (AREA)
JP15680384A 1984-07-27 1984-07-27 半導体装置 Granted JPS6135539A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15680384A JPS6135539A (ja) 1984-07-27 1984-07-27 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15680384A JPS6135539A (ja) 1984-07-27 1984-07-27 半導体装置

Publications (2)

Publication Number Publication Date
JPS6135539A true JPS6135539A (ja) 1986-02-20
JPH0414504B2 JPH0414504B2 (2) 1992-03-13

Family

ID=15635662

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15680384A Granted JPS6135539A (ja) 1984-07-27 1984-07-27 半導体装置

Country Status (1)

Country Link
JP (1) JPS6135539A (2)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62193157A (ja) * 1986-02-08 1987-08-25 ロ−ベルト・ボツシユ・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング パワー素子パッケージ
JPS6318648A (ja) * 1986-07-11 1988-01-26 Toshiba Corp 窒化アルミニウム回路基板
JPS63244653A (ja) * 1987-03-31 1988-10-12 Toshiba Corp 半導体装置
JPH02192198A (ja) * 1989-01-20 1990-07-27 Nippon Cement Co Ltd Ｉｃチップ搭載多層配線基板
JPH0344310U (2) * 1989-08-31 1991-04-24
JPH09172108A (ja) * 1996-12-24 1997-06-30 Toshiba Corp 窒化アルミニウム回路基板

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50148965U (2) * 1974-05-27 1975-12-10
JPS54100410A (en) * 1978-01-24 1979-08-08 Tokyo Shibaura Electric Co Ceramic heat conductor
JPS5530815A (en) * 1978-08-25 1980-03-04 Toshiba Corp Semiconductor containing vessel
JPS60178647A (ja) * 1984-02-27 1985-09-12 Toshiba Corp 半導体装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50148965U (2) * 1974-05-27 1975-12-10
JPS54100410A (en) * 1978-01-24 1979-08-08 Tokyo Shibaura Electric Co Ceramic heat conductor
JPS5530815A (en) * 1978-08-25 1980-03-04 Toshiba Corp Semiconductor containing vessel
JPS60178647A (ja) * 1984-02-27 1985-09-12 Toshiba Corp 半導体装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62193157A (ja) * 1986-02-08 1987-08-25 ロ−ベルト・ボツシユ・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング パワー素子パッケージ
JPS6318648A (ja) * 1986-07-11 1988-01-26 Toshiba Corp 窒化アルミニウム回路基板
JPS63244653A (ja) * 1987-03-31 1988-10-12 Toshiba Corp 半導体装置
JPH02192198A (ja) * 1989-01-20 1990-07-27 Nippon Cement Co Ltd Ｉｃチップ搭載多層配線基板
JPH0344310U (2) * 1989-08-31 1991-04-24
JPH09172108A (ja) * 1996-12-24 1997-06-30 Toshiba Corp 窒化アルミニウム回路基板

Also Published As

Publication number Publication date
JPH0414504B2 (2) 1992-03-13

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