JPS6140077A - Buried type surface plane laser oscillator - Google Patents

Buried type surface plane laser oscillator

Info

Publication number
JPS6140077A
JPS6140077A JP16089784A JP16089784A JPS6140077A JP S6140077 A JPS6140077 A JP S6140077A JP 16089784 A JP16089784 A JP 16089784A JP 16089784 A JP16089784 A JP 16089784A JP S6140077 A JPS6140077 A JP S6140077A
Authority
JP
Japan
Prior art keywords
layer
type
current
active layer
active
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16089784A
Other languages
Japanese (ja)
Other versions
JPH0325037B2 (en
Inventor
Kenichi Iga
伊賀 健一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Science and Technology Agency
Original Assignee
Research Development Corp of Japan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Research Development Corp of Japan filed Critical Research Development Corp of Japan
Priority to JP16089784A priority Critical patent/JPS6140077A/en
Publication of JPS6140077A publication Critical patent/JPS6140077A/en
Publication of JPH0325037B2 publication Critical patent/JPH0325037B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/10Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
    • H01S5/18305Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] with emission through the substrate, i.e. bottom emission
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/10Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
    • H01S5/18308Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] having a special structure for lateral current or light confinement
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/20Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/22Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
    • H01S5/2205Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
    • H01S5/2222Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers having special electric properties

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)

Abstract

PURPOSE:To operate a GaAs/GaAlAs laser with a low oscillation threshold current, by making the area of an active layer smaller than that of a clad layer, and forming a p-n junction current constriction layer between the active and clad layers. CONSTITUTION:An n type GaAlAs clad layer 13, a p tyep GaAs active layer 16, a p type GaAlAs split layer 17, a p type GaAlAs clas layer 18 and p type GaAlAs cap layer 19 are epitaxially grown on an n type GaAs substrate 12, and the layers 17-19 are etched in the shape of a column. The active layer 16 is selectively melted back, and the space around the active layer 16 is filled with a p type GaAlAs current block layer 14. The split layer 17 is selectively melted back, and an n type GaAlAs layer 15 is deposited so as to bury the layer 17 and the like. The substrate 12 is etched to expose the epitaxial surface which serves as a reflecting mirror, and electrodes 20, 21 are formed. In this way, the current constricting function is increased, and it is therefore possible to operate a plane emission laser with a low oscillation threshold current.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、GaAs/GaAQAs面発光レーザ発振装
置に関し、特にクラッド層の面積に対し活性層の面積を
小さくした構造をとることと、pn接合の逆バイアスを
利用する電流狭窄層を再現性よく確実に形成することに
より、発振しきい値電流の低減を可能にしたG a A
 s / G a A Q A s面発光レーザ発振装
置に関する。
Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a GaAs/GaAQAs surface-emitting laser oscillation device, and particularly relates to a structure in which the area of an active layer is smaller than that of a cladding layer, and a p-n junction. By reliably forming a current confinement layer using the reverse bias of G a
The present invention relates to a surface emitting laser oscillator.

〔従来の技術〕[Conventional technology]

第2図は、従来の面発光レーザの1例を示した霞もので
:ある。図中、1はn形GaAs基板、2はn形GaA
QAsクラッド崩、3はGaAs活性層、4はp形Ga
AQAsクラッド層、5は反射表面、6は電極、7は鏡
面電極、8は電流、9は活性幀域、IOは光共振経路、
11はレーザ光を表わす。       □ 図示の装置は、電極6および鏡面電極7の間に所定の゛
レベル以上の電流8を流すことにより、GaAs活性層
3に活性領域9を生成させ、反射表面5と鏡面電極7と
の藺にファブリベロー共振器を形成させている。その結
果、光共振経路10にしたがって光共振が生じ、レーザ
光11が放射されるものである。
FIG. 2 shows an example of a conventional surface emitting laser. In the figure, 1 is an n-type GaAs substrate, 2 is an n-type GaA
QAs cladding collapse, 3 is GaAs active layer, 4 is p-type Ga
AQAs cladding layer, 5 is a reflective surface, 6 is an electrode, 7 is a mirror electrode, 8 is a current, 9 is an active area, IO is an optical resonance path,
11 represents a laser beam. □ The illustrated device generates an active region 9 in the GaAs active layer 3 by passing a current 8 of a predetermined level or higher between the electrode 6 and the specular electrode 7, and creates an active region 9 between the reflective surface 5 and the specular electrode 7. A Fabry Bellows resonator is formed. As a result, optical resonance occurs along the optical resonance path 10, and laser light 11 is emitted.

(発明が解決しよ4とする問題点〕 □ 上記例示した従来の面発光レーザでは、利得領域が
活性層の厚みの長さしかないため、発振しきい値電流密
度が高くなり、またp形りラッド層での電流法がりおよ
び活性層での小数キヤ、リアの拡散による発振に寄与し
ない漏れ電流が多いために、しきい値電流が高くなり、
熱の発生などによって室温連続動作が困難であるという
問題点があった。
(Problems to be solved by the invention) □ In the conventional surface emitting laser exemplified above, the gain region is only as long as the thickness of the active layer, so the oscillation threshold current density is high, and the p-type The threshold current becomes high because there is a large amount of leakage current that does not contribute to oscillation due to the current flow in the redundant layer and the diffusion of fractional carriers and rears in the active layer.
There was a problem in that continuous operation at room temperature was difficult due to the generation of heat.

発振し今い値電流を低減するには、しきい値電流密度を
下げるか、活性領域の面積を小さくしなくてはならない
。しきい値電流密度を下げる方法には、高反射率の反射
鏡を形成する方法、もしくは活性層を厚くして利得領域
を増やす方法があるが、前者はレーザ光出力が著しく小
さくなるという問題があり、後者の方法でも、活性層の
厚みはキャリアの拡散長以下に制限される。
In order to reduce the threshold current due to oscillation, the threshold current density must be lowered or the area of the active region must be reduced. There are two ways to lower the threshold current density: forming a reflector with a high reflectance, or increasing the gain region by thickening the active layer, but the former has the problem of significantly decreasing laser light output. However, even in the latter method, the thickness of the active layer is limited to less than the carrier diffusion length.

〔問題点を解決するための手段〕[Means for solving problems]

この発明は、上述した問題点を解決し、面発光レーザを
従来方式のものより低い発振しきい値電流で動作させる
ことを可能にするため、クラッド層の面積に対して活性
層の面積を小さくできて、かつ電流狭窄層を再現性よく
確実に形成できる埋め込み構造を導入するものである。
This invention solves the above-mentioned problems and enables surface-emitting lasers to operate with a lower oscillation threshold current than conventional systems by reducing the area of the active layer relative to the area of the cladding layer. The purpose is to introduce a buried structure that can form a current confinement layer reliably with good reproducibility.

〔実施例〕〔Example〕

第1図は、本発明に基づく面発光レーザの1実施例の断
面図であり、図中、12はn形GaAs基板、13はn
形G a A A A s  (XAt=0.4)クラ
ッド層、14はp形G a A fl A s (X 
At =’0.4)電流ブロック層、15はn形G a
 A Q A s  (XAL=0.4)層1.16は
p形GaAs活性層、17はp形G a A Q A 
s (XAL =0.3)スプリット層、18はp形G
 a A 、Q A s (X at =0.45)ク
ラッド層、19はP”−G、aAUAsキャンプ層、2
0はAu/ Z n / A uなどのp側電極、21
はA u / G eなどのn側電極、22はAu反射
膜、23は光共振経路、24は電流、25はレーザ光を
表わす。
FIG. 1 is a cross-sectional view of one embodiment of a surface emitting laser based on the present invention, in which 12 is an n-type GaAs substrate, 13 is an n-type GaAs substrate, and 13 is an n-type GaAs substrate.
14 is a p-type Ga A fl A s (X At=0.4) cladding layer,
At ='0.4) Current blocking layer, 15 is n-type Ga
A Q A s (XAL=0.4) layer 1.16 is p-type GaAs active layer, 17 is p-type Ga A Q A
s (XAL = 0.3) split layer, 18 is p-type G
a A , Q A s (X at =0.45) cladding layer, 19 is P''-G, aAUAs camp layer, 2
0 is a p-side electrode such as Au/Zn/Au, 21
22 is an Au reflective film, 23 is an optical resonance path, 24 is a current, and 25 is a laser beam.

第1図に示す構造の製作工程は、次のi)乃至vi)の
ようになる。なおこの工程は、第3図のi)乃至vi)
に対応的に図示されている。
The manufacturing process of the structure shown in FIG. 1 is as follows i) to vi). Note that this step is performed in steps i) to vi) in Figure 3.
are shown correspondingly.

i)1回めの結晶成長で、DH構造を成す13.16.
17.18.19の各層をエピタキシャル成長させた後
に、化学エツチング等により17.18.19の層を円
柱状にエツチングする。(第3図i))そして、2回目
の液相成長を行う。(第3図ii)〜v))ii)まず
、A、QMi成比XALが小さいものほどメルトバック
速度が速くなることを利用する選択メルトバック法を用
いて、斜線で示すp形GaAs活性層16を選択的にメ
ルトバックする。(第3図1i)) 、iii 、)そして、p形G a A Q A s 
(XAL=0.4)電流ブロック層14で活性層16の
回りを埋め込む。(第3図1ii))     ” iv)さらに、選択ノル。ドパツクを行いp形GaAD
 A s (X at =0.3)スプリット層17を
メルトバックする。(第3図1v)) ■)その後にn形G a A II A 5  (Xa
t =0.4) 15で回りを埋め込む。(第3図V)
) vi)最後に、GaAs基板12をエツチングして、反
射鏡となるエビ面を露出させ、電極20.21等を形成
して加工工程は終了する。(第3図vi)) このレーザは、第3図V)に示すように選択メルトバッ
ク法によりくびれ形のメサ構造を形成し、電流狭窄機能
を強化した埋め込みレーザである。
i) 13.16. which forms a DH structure in the first crystal growth.
After the layers 17, 18, and 19 are epitaxially grown, the layers 17, 18, and 19 are etched into a cylindrical shape by chemical etching or the like. (Fig. 3i)) Then, a second liquid phase growth is performed. (Fig. 3 ii) to v)) ii) First, the p-type GaAs active layer shown with diagonal lines was 16 is selectively melted back. (Fig. 3 1i) ) , iii , ) and p-type G a A Q A s
(XAL=0.4) The area around the active layer 16 is filled with the current blocking layer 14. (Fig. 3 1ii)) ” iv) Furthermore, a selection node is applied to the p-type GaAD.
A s (X at =0.3) The split layer 17 is melted back. (Fig. 3 1v)) ■) Then n-type G a A II A 5 (Xa
t = 0.4) Fill in the surrounding area with 15. (Figure 3 V)
vi) Finally, the GaAs substrate 12 is etched to expose the shrimp surface that will serve as a reflecting mirror, and the electrodes 20, 21, etc. are formed, and the processing process is completed. (FIG. 3 vi)) This laser is a buried laser in which a constriction-shaped mesa structure is formed by the selective meltback method to strengthen the current confinement function, as shown in FIG. 3 V).

このため熱放散が優れている。また、新たにp形G a
 A II A s (Xat=0.3)スプリット層
17をp形りラッド層1Bと活性層16との間に設けて
いることにより、電流狭窄構造が拡散電位のみならずp
n接合の逆方向特性によって形成されるので、一層強化
されている。
Therefore, heat dissipation is excellent. In addition, a new p-type Ga
By providing the A II A s (Xat=0.3) split layer 17 between the p-type rad layer 1B and the active layer 16, the current confinement structure
Since it is formed by the reverse direction characteristic of the n-junction, it is further strengthened.

さらに、従来は電流狭窄構造をpnpn構造に・よって
形成する場合、2回目の結晶成長時に微細な膜厚のコン
トロールを必要としたが、このレーザでは各メサのまわ
りのp形G a A Q A s (XAL=0.4)
電流ブロック層14の層厚が多少異なっていても、スプ
リット層17を選択メルトバックすることにより、電流
狭窄構造が確実に形成される。
Furthermore, conventionally, when forming a current confinement structure with a pnpn structure, it was necessary to finely control the film thickness during the second crystal growth, but with this laser, the p-type Ga A Q A around each mesa is s (XAL=0.4)
Even if the thickness of the current blocking layer 14 is slightly different, by selectively melting back the split layer 17, a current confinement structure can be reliably formed.

〔従来方法との比較〕[Comparison with conventional method]

第4図に、日本電気−より報告されたメサくびれ形埋め
込み構造(BGM)GaAffiAsレーザの構造図を
示す。このレーザの特徴は、次の通りである。
FIG. 4 shows a structural diagram of a mesa-waisted buried structure (BGM) GaAffiAs laser reported by NEC. The features of this laser are as follows.

i)化学エツチングにより、選択的にGaAQAS活性
層をエツチングしてクラッド層の幅より活性層の幅を狭
くしたメサストライプレーザである。
i) This is a mesa stripe laser in which the GaAQAS active layer is selectively etched by chemical etching to make the width of the active layer narrower than the width of the cladding layer.

ii )電流狭窄構造は、窪み部でp形GaAQAs電
流ブロック層の成長が完全に止まる液組成−長に特有な
性質を利用してpnpn構造を形成する。ところで、膜
厚方向に光を共振させる面発光レーザでは、活性層の厚
みを通常のストライプレーザのそれと比較して数十倍は
ど厚くする必要がある。このため、活性層の両側で結晶
成長が起り、上記したBCMレーザのように窪み部でp
形GaAIJAs電流ブロック層の成長を止めることは
できず、pnpn構造の電流狭窄構造を形成することは
不可能となる。このような場合、先に述べた様にスプリ
ット層を設けて、この層を選択的にメルトバックするこ
とによりpnpn構造を形成する方法が有効となる。
ii) The current confinement structure forms a pnpn structure by utilizing the properties specific to the liquid composition and length that the growth of the p-type GaAQAs current blocking layer is completely stopped in the recessed portion. Incidentally, in a surface emitting laser that resonates light in the film thickness direction, the thickness of the active layer needs to be several tens of times thicker than that of a normal striped laser. Therefore, crystal growth occurs on both sides of the active layer, and as in the above-mentioned BCM laser, p
The growth of the GaAIJAs current blocking layer cannot be stopped, making it impossible to form a pnpn current confinement structure. In such a case, it is effective to form a pnpn structure by providing a split layer and selectively melting back this layer as described above.

〔発明の効果〕〔Effect of the invention〕

以上詳細に説明したように、この発明によれば、従来の
面発光レーザに比べ、著しく発振しきい値電流を低くす
ることができ、高い信輔性をもつ面発光レーザを実現で
きる。この発明による面発光レーザは、従来の面発光レ
ーザの持つ、共振器のモノリシック製作、短共振器構造
による単−縦モード動作、狭山射角、二次元アレイ化等
の優れた特徴に加えて、低しきい値動作による高信頼性
を合わせ持っており、これからの光集積回路を構成する
上で、幅広い利用が期待されるもので、きわめて重要な
意義を有するものである。
As described in detail above, according to the present invention, the oscillation threshold current can be significantly lowered compared to conventional surface emitting lasers, and a surface emitting laser with high reliability can be realized. In addition to the excellent features of conventional surface emitting lasers, such as monolithic resonator fabrication, single-longitudinal mode operation due to short resonator structure, Sayama radiation angle, and two-dimensional array formation, the surface emitting laser according to the present invention has the following advantages: It also has high reliability due to low threshold operation, and is expected to be widely used in the construction of future optical integrated circuits, making it extremely important.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明に基づく面発光レーザの1実施例の断面
図、第2図は面発光レーザの従来例の断面図、第3図は
第1図に示す実施例の製作工程を示す説明図、第4図は
本発明の詳細な説明するための従来例の断面図である。 図中、12はn形GaAs基板、13はn形Ga A 
Q A s  (XAL=0.4)クラッド層、14は
p形G a A Q A s  (XAL=0.4)電
流ブロック層、15はn形G a A Q A s (
X At =0.4)層、16はp形GaAs活性層、
17はp形GaAQAS (XAL−0,3)層、18
はp形G a A A A s (Xat=0.45)
クラッド層、19はP” −GaAQAsキ’rツブ層
、20はA u / Z n / A uなどのp側電
極、21はA u / G eなどのn側電極、22は
Au反射膜、23は光共振経路、24は電流、25はレ
ーザ光を表わす。 特許出願人   新技術開発事業団 代理人弁理士  長谷用 文 廣 第 2 図 第 3 図 第 4 図
FIG. 1 is a sectional view of an embodiment of a surface emitting laser according to the present invention, FIG. 2 is a sectional view of a conventional surface emitting laser, and FIG. 3 is an explanation showing the manufacturing process of the embodiment shown in FIG. 1. 4 are sectional views of a conventional example for explaining the present invention in detail. In the figure, 12 is an n-type GaAs substrate, 13 is an n-type GaA
Q A s (XAL=0.4) cladding layer, 14 is p-type Ga A Q A s (XAL=0.4) current blocking layer, 15 is n-type Ga A Q A s (
X At =0.4) layer, 16 is a p-type GaAs active layer,
17 is p-type GaAQAS (XAL-0,3) layer, 18
is p-type G a AA A s (Xat=0.45)
A cladding layer, 19 a P''-GaAQAs chip layer, 20 a p-side electrode such as Au/Zn/Au, 21 an n-side electrode such as Au/Ge, 22 an Au reflective film, Reference numeral 23 represents an optical resonance path, 24 represents an electric current, and 25 represents a laser beam.Patent applicant: Patent attorney, New Technology Development Corporation, Fumihiro Hase, Figure 2, Figure 3, Figure 4.

Claims (1)

【特許請求の範囲】[Claims] GaAs/GaAlAsレーザにおいて、選択メルトバ
ック法を用いて、活性層の面積をクラッド層の面積より
も小さく形成するとともに、活性層とクラッド層の間に
pn接合の逆バイアス特性を利用した電流狭窄層を形成
したことを特徴とする埋め込み型面発光レーザ発振装置
In GaAs/GaAlAs lasers, the selective meltback method is used to form the active layer area smaller than the cladding layer area, and a current confinement layer is created between the active layer and the cladding layer using the reverse bias characteristics of the pn junction. What is claimed is: 1. A buried surface emitting laser oscillation device characterized by forming:
JP16089784A 1984-07-31 1984-07-31 Buried type surface plane laser oscillator Granted JPS6140077A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16089784A JPS6140077A (en) 1984-07-31 1984-07-31 Buried type surface plane laser oscillator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16089784A JPS6140077A (en) 1984-07-31 1984-07-31 Buried type surface plane laser oscillator

Publications (2)

Publication Number Publication Date
JPS6140077A true JPS6140077A (en) 1986-02-26
JPH0325037B2 JPH0325037B2 (en) 1991-04-04

Family

ID=15724720

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16089784A Granted JPS6140077A (en) 1984-07-31 1984-07-31 Buried type surface plane laser oscillator

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02198184A (en) * 1989-01-27 1990-08-06 Oki Electric Ind Co Ltd Surface light emission type semiconductor laser device
JPH03190181A (en) * 1989-12-19 1991-08-20 Nec Corp Planar emission laser and manufacture thereof
EP0609836A1 (en) * 1993-02-01 1994-08-10 Nec Corporation Surface emitting laser and method for fabricating the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5511338A (en) * 1978-07-10 1980-01-26 Nippon Telegr & Teleph Corp <Ntt> Semiconductor laser device
JPS5698888A (en) * 1980-01-09 1981-08-08 Tokyo Inst Of Technol Light emitting semiconductor laser

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5511338A (en) * 1978-07-10 1980-01-26 Nippon Telegr & Teleph Corp <Ntt> Semiconductor laser device
JPS5698888A (en) * 1980-01-09 1981-08-08 Tokyo Inst Of Technol Light emitting semiconductor laser

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02198184A (en) * 1989-01-27 1990-08-06 Oki Electric Ind Co Ltd Surface light emission type semiconductor laser device
JPH03190181A (en) * 1989-12-19 1991-08-20 Nec Corp Planar emission laser and manufacture thereof
EP0609836A1 (en) * 1993-02-01 1994-08-10 Nec Corporation Surface emitting laser and method for fabricating the same
US5500868A (en) * 1993-02-01 1996-03-19 Nec Corporation Vertical-to-surface transmission electro-photonic device with ion implanted current control regions
US5637511A (en) * 1993-02-01 1997-06-10 Kurihara; Kaori Vertical-to-surface transmission electro-photonic device and method for fabricating the same

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JPH0325037B2 (en) 1991-04-04

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