JPS6141773A - 無電解めつき液の添加微粒子分離装置 - Google Patents
無電解めつき液の添加微粒子分離装置Info
- Publication number
- JPS6141773A JPS6141773A JP16259984A JP16259984A JPS6141773A JP S6141773 A JPS6141773 A JP S6141773A JP 16259984 A JP16259984 A JP 16259984A JP 16259984 A JP16259984 A JP 16259984A JP S6141773 A JPS6141773 A JP S6141773A
- Authority
- JP
- Japan
- Prior art keywords
- plating solution
- plating liquid
- plating
- pulverous
- particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1617—Purification and regeneration of coating baths
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16259984A JPS6141773A (ja) | 1984-07-31 | 1984-07-31 | 無電解めつき液の添加微粒子分離装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16259984A JPS6141773A (ja) | 1984-07-31 | 1984-07-31 | 無電解めつき液の添加微粒子分離装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6141773A true JPS6141773A (ja) | 1986-02-28 |
| JPH0257152B2 JPH0257152B2 (2) | 1990-12-04 |
Family
ID=15757652
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16259984A Granted JPS6141773A (ja) | 1984-07-31 | 1984-07-31 | 無電解めつき液の添加微粒子分離装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6141773A (2) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63119669U (2) * | 1987-01-28 | 1988-08-02 | ||
| JPH02301570A (ja) * | 1989-05-15 | 1990-12-13 | C Uyemura & Co Ltd | 無電解複合めっき装置 |
| WO2012130491A1 (de) * | 2011-03-31 | 2012-10-04 | Dürr Systems GmbH | Anlage für das behandeln von werkstücken mit einer prozessflüssigkeit |
-
1984
- 1984-07-31 JP JP16259984A patent/JPS6141773A/ja active Granted
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63119669U (2) * | 1987-01-28 | 1988-08-02 | ||
| JPH02301570A (ja) * | 1989-05-15 | 1990-12-13 | C Uyemura & Co Ltd | 無電解複合めっき装置 |
| WO2012130491A1 (de) * | 2011-03-31 | 2012-10-04 | Dürr Systems GmbH | Anlage für das behandeln von werkstücken mit einer prozessflüssigkeit |
| CN103476973A (zh) * | 2011-03-31 | 2013-12-25 | 杜尔系统有限公司 | 利用加工液来处理工件的设备 |
| CN103476973B (zh) * | 2011-03-31 | 2016-08-24 | 杜尔系统有限公司 | 利用加工液来处理工件的设备 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0257152B2 (2) | 1990-12-04 |
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