JPS6142875U - 両面配線板 - Google Patents

両面配線板

Info

Publication number
JPS6142875U
JPS6142875U JP12623384U JP12623384U JPS6142875U JP S6142875 U JPS6142875 U JP S6142875U JP 12623384 U JP12623384 U JP 12623384U JP 12623384 U JP12623384 U JP 12623384U JP S6142875 U JPS6142875 U JP S6142875U
Authority
JP
Japan
Prior art keywords
double
wiring board
copper foil
sided wiring
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12623384U
Other languages
English (en)
Other versions
JPH037969Y2 (ja
Inventor
進 白坂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP12623384U priority Critical patent/JPS6142875U/ja
Publication of JPS6142875U publication Critical patent/JPS6142875U/ja
Application granted granted Critical
Publication of JPH037969Y2 publication Critical patent/JPH037969Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図ないし第４図はこの考案の両面配線板の実施例を
示し、第１図および第２図は１実施例の製造工程を示す
斜視図および切断正面図、第３図および第４図は他の実
施例の製造工程を示す斜視図およびを切断右側面図、第
５図および第７図はそれぞれ従来の両面配線板の平面図
および切断正面図、第６図は第５図の切断正面図である
。 １０・・・絶縁基板、１１，１２・・・銅箔回路、１３
・・・貫通孔、１５・・・接続体、１６・・・侵入路、
１７・・・段部、２３・・・両面配線板。

Claims (1)

    【実用新案登録請求の範囲】
  1. 絶縁基板と、該基板の上、下の両面に形成された銅箔回
    路と、前記基板の前記両銅箔回路を含む部分に透設され
    た貫通孔と、前記貫通孔に挿通され半田の侵入路が形成
    された導電性の接続体と、前記接続体に形成され上面の
    前記銅箔回路に当接した段部と、前記侵入路に充填され
    前記両銅箔回−路を接続した半田とを備えた両面配線板
    。
JP12623384U 1984-08-20 1984-08-20 両面配線板 Granted JPS6142875U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12623384U JPS6142875U (ja) 1984-08-20 1984-08-20 両面配線板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12623384U JPS6142875U (ja) 1984-08-20 1984-08-20 両面配線板

Publications (2)

Publication Number Publication Date
JPS6142875U true JPS6142875U (ja) 1986-03-19
JPH037969Y2 JPH037969Y2 (ja) 1991-02-27

Family

ID=30684915

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12623384U Granted JPS6142875U (ja) 1984-08-20 1984-08-20 両面配線板

Country Status (1)

Country Link
JP (1) JPS6142875U (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52151865A (en) * 1976-06-01 1977-12-16 Du Pont Circuit board eyelet
JPS5344763U (ja) * 1976-09-21 1978-04-17
JPS5390403U (ja) * 1976-12-24 1978-07-24

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52151865A (en) * 1976-06-01 1977-12-16 Du Pont Circuit board eyelet
JPS5344763U (ja) * 1976-09-21 1978-04-17
JPS5390403U (ja) * 1976-12-24 1978-07-24

Also Published As

Publication number Publication date
JPH037969Y2 (ja) 1991-02-27

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