JPS6143559A - 化学メツキ用積層板 - Google Patents

化学メツキ用積層板

Info

Publication number
JPS6143559A
JPS6143559A JP60167122A JP16712285A JPS6143559A JP S6143559 A JPS6143559 A JP S6143559A JP 60167122 A JP60167122 A JP 60167122A JP 16712285 A JP16712285 A JP 16712285A JP S6143559 A JPS6143559 A JP S6143559A
Authority
JP
Japan
Prior art keywords
chemical plating
prepreg
adhesive layer
paper
laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60167122A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0441911B2 (cs
Inventor
良樹 村上
仁 土井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Risho Kogyo Co Ltd
Original Assignee
Risho Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Risho Kogyo Co Ltd filed Critical Risho Kogyo Co Ltd
Priority to JP60167122A priority Critical patent/JPS6143559A/ja
Publication of JPS6143559A publication Critical patent/JPS6143559A/ja
Publication of JPH0441911B2 publication Critical patent/JPH0441911B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating

Landscapes

  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Chemically Coating (AREA)
JP60167122A 1985-07-27 1985-07-27 化学メツキ用積層板 Granted JPS6143559A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60167122A JPS6143559A (ja) 1985-07-27 1985-07-27 化学メツキ用積層板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60167122A JPS6143559A (ja) 1985-07-27 1985-07-27 化学メツキ用積層板

Publications (2)

Publication Number Publication Date
JPS6143559A true JPS6143559A (ja) 1986-03-03
JPH0441911B2 JPH0441911B2 (cs) 1992-07-09

Family

ID=15843844

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60167122A Granted JPS6143559A (ja) 1985-07-27 1985-07-27 化学メツキ用積層板

Country Status (1)

Country Link
JP (1) JPS6143559A (cs)

Also Published As

Publication number Publication date
JPH0441911B2 (cs) 1992-07-09

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees