JPS6145489A - Production of magnetic bubble device - Google Patents

Abstract

PURPOSE:To omit adhesives by loading a resin case into which a bias magnet or the like is inserted to a shielding case, adhering the magnet or the like to the shielding case by magnitization from the external, and then injecting a filler. CONSTITUTION:An insulating substrate mounting a chip and a coil are inserted and fixed into/to a hole 10a of the resin case 10 and the bias magnet and magnetic adjuster plates 11, 12, 11', 12' are inserted into a recessed part 10b. Under said state, the case 10 is loaded to the shielding case 13 and the case 13 is externally magnetized, so that the magnet and the magnetic adjuster plates 11, 12, 11', 12' are adhered to the case 13 respectively by the magnetizing force. The filler 14 is injected from grooves 10c into their gaps to fill the gaps with the filler 14. Consequently, the process using adhesives can be omitted and a magnetic bubble memory device prevented from the deterioration of heat discharge and magnitization due to the adhesives is formed.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a magnetic bubble memory device. Generally, magnetic thin films have magnetic domains with easy magnetization axes in the in-plane direction, but in some types of magnetic thin films, such as orthoferrite and magnetic garnet, magnetic domains have easy magnetization axes perpendicular to the film plane.

This thin film has an upward Kf when no external magnetic field is applied.
The magnetic domains in the force direction and the downward magnetic domains are intermingled alternately in stripes with almost equal area, but when a downward vertical magnetic field is applied from the outside, the upward magnetic domains become helical,
The downward magnetic domain expands, and finally the upward magnetic domain becomes a cylindrical magnetic domain with a diameter of several μm. This cylindrical magnetic domain is called a bubble domain.

Magnetic bubble memory devices utilize these bubble domains as memory elements because these bubble domains can move freely within the magnetic thin film depending on the gradient of the magnetic field. FIG. 1 shows an example of this magnetic bubble memory device. To briefly explain this, the chip 1 is mounted on an insulating substrate 2, and around it are drive coils 3 and 4 orthogonally provided for applying a horizontal rotating magnetic field to the chip 1, and these are molded. Or resin case 5
is inserted into a shield case 9 which also serves as a yoke, together with a bias magnet 7 and a magnetic shunt plate 8 which are fitted into a recess formed on the outside of a mold or resin case 5.

In this way, in the magnetic bubble memory device, the bias magnet 7 and the magnetic shunt plate 8 are bonded with adhesive, then adhered to the recessed part of the resin case 5 with adhesive, and then coated with adhesive to form a shield. It is loaded into case 9. Therefore, in such a magnetic bubble memory device, a layer of adhesive is formed between the bias magnet 7 and the magnetic shunt plate 8, and between the bias magnet 7 and the shield case 9, and the thickness of the adhesive layer also varies. . This causes variations in the magnetic resistance of the magnetic circuit and variations in the heat dissipation effect. The present invention has been devised to improve this drawback.

For this reason, the present invention includes a resin case into which a magnetic bubble memory chi knob and a coil for driving the bubble of the chip are inserted, and a bias magnet and a magnetic shunt plate fitted into a recess formed on the outside of the resin case. In a magnetic bubble memory device in which a bias magnet and a magnetic shunt plate are inserted into a recessed part of the resin case, the resin case is inserted into the shield case, and then the magnetic bubble memory device is By magnetizing the bias magnet, the bias magnet and the magnetic shunt plate are bonded to the shield case by magnetic force, and then a filler is injected into the gap between the shield case and the resin case to bond the bias magnet and the magnetic shunt plate. It is characterized by fixing the plate 12I.

Embodiments of the present invention will be described in detail below based on the accompanying drawings.

FIG. 2 shows an exploded perspective view of a magnetic bubble memory device assembled by the method of the present invention, with the exception that the chip, 'f, tA edge substrates and coils inserted into the resin case are not shown. In the figure, numeral 10 is a resin case, 11, 11
' is a bias magnet, 12, 12 ' is a magnetic shunt plate,
13 is a shield case that also serves as a yoke. The resin case 10 has holes 10a into which chips, insulating substrates, coils, etc. are inserted, and bias magnets 1-11, 11'.
A concave portion 10b into which the magnetization shunt vi12, 12' is fitted is formed. Each of these members is assembled as follows.

First, the insulating substrate on which the chip is mounted and the coil are inserted and fixed into the hole 10a of the resin case 10, and then the magnetic shunt plate 12 or 12' and the bias magnet 11 or 11' are fitted into the recess 10b of the resin case 10 in an overlapping manner. In this state, it is charged into the shield case 13.

After that, the bias magnets 11 , 11 ′ are magnetized from the outside of the shield case 13 , and the bias magnets 11 , 11 ′ and the magnetic shunt plates 12 , 1 are magnetized by the magnetic force.
2' and the shield case 13. Next, as shown in FIG. 3, the grooves 10c and 10c' of the resin case 10 are
Filler 14 is injected into the recess 10b of the resin case IO.
and bias magnet 11 or 11' and magnetic shunt plate 12
Or fill the gap with 12'.

The magnetic bubble memory device assembled in this way requires adhesive or filler between the shield case 13 and the bias magnets 11, 11', and between the bias magnets 11, 11' and the magnetic shunt plates 12, 12'. Because there is no intrusion, heat transfer is good, magnetic resistance is reduced, and variations in these factors are also reduced.

Furthermore, it is safe against vibrations because it is fixed by the filler 14.

As explained above, the method for manufacturing a magnetic bubble memory device of the present invention improves the heat dissipation and magnetic properties of the magnetic bubble memory device by using magnetic force to bond the shield case, the bias magnet, and the magnetic shunt plate. By omitting the bonding process using adhesive, assembly man-hours can be reduced.

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view of an example of a conventional magnetic bubble memory device.
2 and 3 are diagrams for explaining the present invention in detail, and FIG. 2 is an exploded perspective view of a magnetic bubble memory device;
FIG. 3 is an assembled sectional view thereof. 10... Resin case, 11, 11'... Bias magnet, 12,
12'...Magnetic shunt plate, 13...Shield case, 14...Filling material.

Claims (1)

[Claims] 1. A shield that also serves as a yoke, consisting of a resin case into which a magnetic bubble memory chip and a coil for driving the bubbles of the chip are inserted, and a bias magnet and a magnetic shunt plate fitted into a recess formed on the outside of the resin case. In a magnetic bubble memory device that is inserted into a case, a bias magnet and a magnetic shunt plate are inserted into a recessed part of the resin case, and then the resin case is inserted into a shield case, and then the bias magnet is magnetized from the outside. Accordingly, the bias magnet and the magnetic shunt plate are bonded to the shield case by magnetic force, and then a filler is injected into the gap between the shield case and the resin case to fix the bias magnet and the magnetic shunt plate. A method of manufacturing a magnetic bubble memory device characterized by: