JPS6149408A - Lead bonding device - Google Patents
Lead bonding deviceInfo
- Publication number
- JPS6149408A JPS6149408A JP17115784A JP17115784A JPS6149408A JP S6149408 A JPS6149408 A JP S6149408A JP 17115784 A JP17115784 A JP 17115784A JP 17115784 A JP17115784 A JP 17115784A JP S6149408 A JPS6149408 A JP S6149408A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- leads
- lead wire
- discharge end
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims abstract description 49
- 230000001070 adhesive effect Effects 0.000 claims abstract description 49
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 27
- 238000007599 discharging Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 4
- 239000011248 coating agent Substances 0.000 abstract 4
- 238000000576 coating method Methods 0.000 abstract 3
- 238000010586 diagram Methods 0.000 description 5
- 239000003292 glue Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/10—Connecting leads to windings
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、テレビ・ラジオ等の雷、気回路内に使用され
るヒーターチョーク等の電子部品であって、フェライト
コア等の電子部品素体にリード線を接着する装置に関す
るものである。Detailed Description of the Invention (Industrial Field of Application) The present invention relates to electronic components such as heater chokes used in lightning and air circuits of televisions and radios, and electronic component elements such as ferrite cores. The present invention relates to a device for bonding lead wires to.
（従来の技術）
従来は、ヒーターチョーク等の電子部品を製造する場合
において、コア等の素体にリード線の接着は、手作業で
行っていた。(Prior Art) Conventionally, when manufacturing electronic components such as heater chokes, lead wires were manually attached to an element body such as a core.
（発明が解決しようとする問題点）
従来は、手作業で行っていた為、接着剤の塗布量、接着
状態が不均一となね、製品の外観上のバラツキを生じて
いた。また、作業能率が低く、１個接着するのに約１０
秒かかり、ナ量生産するには作業員の増加が必要であり
、コスト高となっていた。従って、素体へのリード線の
接着作業を自動化することが望まれていた。(Problems to be Solved by the Invention) Conventionally, since this was done manually, the amount of adhesive applied and the state of adhesion were uneven, resulting in variations in the appearance of the product. In addition, the work efficiency is low, and it takes about 100 yen to glue one piece.
It takes several seconds, and an increase in the number of workers is required for mass production, resulting in high costs. Therefore, it has been desired to automate the work of adhering the lead wires to the element body.
（問題点を解決するための手段）
本発明は、リード線接着装置を折供するものであり、リ
ード線に接着剤を塗布する機構に特徴があるものである
。(Means for Solving the Problems) The present invention provides a lead wire bonding device, and is characterized by a mechanism for applying adhesive to the lead wires.
つマリ、リード線の移動する軌道上に接着剤吐出装置の
吐出端を配置し、該吐出端の形状を前記リード線の軌道
に対し接線方向に交わる形状とし、リード線が前記軌道
を移動することによ均、前記吐出端に吐出した接着剤を
前記リード線が拭い取ることにより、リード線に接着剤
を塗布することを特徴とするものである。The discharging end of the adhesive discharging device is arranged on the trajectory along which the lead wire moves, the shape of the discharging end is set to intersect with the trajectory of the lead wire in a tangential direction, and the lead wire moves on the trajectory. Particularly, the adhesive is applied to the lead wire by wiping the adhesive discharged to the discharge end with the lead wire.
（作用）
リード線の移動する軌道上に、その軌道に対し接線方向
に交わる形状の接着剤吐出端を配置することにより、リ
ード線は、移動中に、接着剤の吐出した接着剤吐出端に
当たり、吐出端面を押しつつ、すべり、接着剤を吐出端
から切り離す様に拭い取ることにより、リード線に接着
剤を塗布する。(Function) By arranging the adhesive discharging end in a shape that intersects tangentially with the trajectory on the trajectory of the lead wire, the lead wire can hit the adhesive discharging end of the adhesive while it is moving. , Apply adhesive to the lead wire by sliding while pressing the discharge end face and wiping to separate the adhesive from the discharge end.
このように、リード線が、接着剤吐出端に吐出した接着
剤を拭い取る機構により、リード線への接着剤の塗布ミ
ス及び接着剤の糸引き現象を防止することが可能となっ
た。In this way, the mechanism in which the lead wire wipes off the adhesive discharged to the adhesive discharge end makes it possible to prevent mistakes in applying the adhesive to the lead wire and the phenomenon of adhesive stringing.
接着剤吐出端に吐出した接着剤を拭い取る様にしてリー
ド線に接着剤を塗布する方法を用いる事により、接着剤
の塗布ミス及び糸引き現象を解決することが出来た。By using a method of applying adhesive to the lead wire by wiping off the adhesive discharged from the adhesive discharge end, it was possible to solve the adhesive application error and the stringing phenomenon.
（実施例）
第１図は、本発明に係る一実施例のり−ド紳接着装置を
示す模式図であり、第２図は、リード接着工程の断面図
であり、第６図は、接着剤吐出端プ の様子を示
す側面図であり、第４図は、リード線が接着剤を拭い取
る様子を示す図である。この実施例は、外局に４５度間
隔でコア保持部３が形成され、４５度間隔の間欠回転運
動機構を有する円板状の回転体２とコア供給部（イ）と
コア排出部に）と接着剤吐出機構とリード線挿入機構を
絹み合わせたものであり、オす、コア１がパーツフィー
ダーより送り出されて、コア供給部（イ）にて、回転体
２の一つのコア保持部６へ供給され、そのコアは、リー
ド線挿入機構にて、（ロ）の時点で、第２図（ａ）に示
す様に、リード線５が途中まで挿入される。この状態で
、（ロ）から（ハ）へ回転移動する際に、そのリード線
の移動する軌道上に接着剤吐出機構の吐出端が配置して
あり、リード線には、第２図（ｂ）の如く、接着剤６が
塗布される。この様子を更に詳しく説明すると、第３図
及び第ｄＦＡに示す様に、接着剤吐出部４の先端は、リ
ード線５の軌道７に対し接線方向に交わる形状とし１、
リード＃５が接着剤吐出端８と接触しながら退避し、接
着剤を拭い取る様にして、リード線５に接着剤が塗布さ
れるものである。この接着剤の塗布されたリード線を（
ハ）に２所定の位置まで更に挿入し、第２図（ｃ）の如
く、リード線を接着するものである。(Example) FIG. 1 is a schematic diagram showing a lead bonding device according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of the lead bonding process, and FIG. FIG. 4 is a side view showing the state of the discharge end, and FIG. 4 is a diagram showing how the lead wire wipes off the adhesive. In this embodiment, core holding parts 3 are formed at 45-degree intervals in the outer part, and a disk-shaped rotating body 2 having an intermittent rotation movement mechanism at 45-degree intervals, a core supply part (a), and a core discharge part) The core 1 is sent out from the parts feeder, and the core 1 is fed into the core holding section of the rotating body 2 at the core supply section (A). 6, and the lead wire 5 is inserted halfway into the core by the lead wire insertion mechanism at the point in time (b), as shown in FIG. 2(a). In this state, when rotating from (B) to (C), the discharge end of the adhesive discharge mechanism is placed on the trajectory along which the lead wire moves, and the lead wire is ), the adhesive 6 is applied. To explain this situation in more detail, as shown in FIG. 3 and dFA, the tip of the adhesive discharge part 4 is shaped to intersect tangentially with the trajectory 7 of the lead wire 5.
The adhesive is applied to the lead wire 5 by retracting the lead #5 while coming into contact with the adhesive discharge end 8 and wiping off the adhesive. Connect the lead wire coated with this adhesive (
C), and then further insert the lead wire to the second predetermined position, and glue the lead wire as shown in FIG. 2(c).
（発明の効果）
本発明は、リード線が接着剤吐出口に吐出した接着剤を
拭い取る様にして、リード線に接着剤を塗布することに
より、リード線への接着剤の塗布ミス及びリード線に塗
布された接着剤と接着剤吐出端との糸引き現象を解決し
、リード線の自動接着装置を提供するものであり、極め
て有益なものである。(Effects of the Invention) The present invention eliminates the possibility of mistakes in applying adhesive to the lead wires and prevents the lead wires from being erroneously applied by wiping off the adhesive discharged from the adhesive outlet. The present invention solves the stringing phenomenon between the adhesive applied to the wire and the adhesive discharge end, and provides an automatic lead wire bonding device, which is extremely useful.
第１図は、本発明に係る一実施例のリード線接着装置を
示す模式図であυ、第２図は、リード線接着工程の断面
図であり、第３図は、接着剤吐出端の様子を示す側面図
であり、第４図は、リード線が接着剤を拭い取る様子を
示す図である０１・・・・・コア、 ２・・・・・
回転円板。
３・・・・・コア保持部、４・・・・・接着剤吐出部。
５・・・・・リード線、 ６・・・・・接着剤。
７・・・・・リード紳軌道、８・・・・・接着剤吐出端
。
第１図
第２図
第 ３ 図
第４図FIG. 1 is a schematic diagram showing a lead wire bonding device according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of the lead wire bonding process, and FIG. 3 is a diagram showing the adhesive discharge end. FIG. 4 is a side view showing the situation, and FIG. 4 is a diagram showing how the lead wire wipes off the adhesive.
rotating disk. 3... Core holding part, 4... Adhesive discharge part. 5...Lead wire, 6...Adhesive. 7...Lead liner track, 8...Adhesive discharge end. Figure 1 Figure 2 Figure 3 Figure 4
Claims (1)
配置し、該吐出端の形状は前記リード線の軌道に対し接
線方向に交わる形状であり、前記リード線が前記軌道を
移動することにより、前記吐出端に吐出した接着剤を前
記リード線に塗布することを特徴とするリード線接着装
置。A discharge end of the adhesive discharge device is disposed on a trajectory along which the lead wire moves, and the shape of the discharge end is such that it intersects in a tangential direction with respect to the trajectory of the lead wire, and the lead wire moves on the trajectory. A lead wire bonding device characterized in that the adhesive discharged to the discharge end is applied to the lead wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17115784A JPS6149408A (en) | 1984-08-17 | 1984-08-17 | Lead bonding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17115784A JPS6149408A (en) | 1984-08-17 | 1984-08-17 | Lead bonding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6149408A true JPS6149408A (en) | 1986-03-11 |
| JPH0224010B2 JPH0224010B2 (en) | 1990-05-28 |
Family
ID=15918042
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17115784A Granted JPS6149408A (en) | 1984-08-17 | 1984-08-17 | Lead bonding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6149408A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6059000A (en) * | 1994-10-27 | 2000-05-09 | Samsung Electro-Mechanics Co., Ltd. | Apparatus for manufacturing bead filter |
-
1984
- 1984-08-17 JP JP17115784A patent/JPS6149408A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6059000A (en) * | 1994-10-27 | 2000-05-09 | Samsung Electro-Mechanics Co., Ltd. | Apparatus for manufacturing bead filter |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0224010B2 (en) | 1990-05-28 |
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