JPS6151987A - Method of forming printed pattern - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for forming printed patterns in the fabrication of hybrid integrated circuits, liquid crystal display devices, plasma display devices, and the like.

In the manufacture of hybrid integrated circuits, liquid crystal display devices, plasma display devices, etc., various patterns are printed on a substrate made of ceramic or glass using a printing paste containing an organic solvent, and then dried or fired using thick film forming technology. Pattern formation is taking place.

In order to increase the density of patterns in such fields,
The pattern width is extremely narrow (in addition, a precision of 11t is required).On the other hand, as the pattern width becomes narrower, pattern defects tend to occur (and a thicker film thickness is also required).

Therefore, it is desired to realize a printing pattern forming method that can simultaneously satisfy these requirements.

[Conventional technology]

FIG. 2 is a diagram showing a conventional printing pattern forming method.
Figure 2 (11) is a flowchart showing the process, Figure 2 (bl is a plan view of the printed pattern, and Figure 2 (C1 is a cross-sectional view of the printed pattern).

In a printing step 1 shown in FIG. 2(a), various patterns are printed on a substrate made of ceramic, glass, etc. using a printing paste containing an organic solvent, and in a drying step 2, the printing paste is dried by heating.

Thereafter, in the firing step 3, if necessary, the product is placed in a firing furnace and heated at, for example, 560"C for 1 hour.

Printing of various patterns in the printing process is carried out by the silk screen method, and the printed patterns are not formed by continuous straight lines but by continuous dots as shown in Figure 2 (bl) and Figure 2 (C). .

The ridges shown in Figure 2 (C) tend to flatten under their own weight, and if the viscosity of the printing paste is low, the ridges flatten and spread in the width direction, reducing the accuracy of the pattern width. descend.

[Problem that the invention seeks to solve]

Conventional printing pattern forming methods dry the printing paste by heating, and even if the printed pattern is highly accurate, the viscosity of the printing paste decreases during the drying process, causing the peaks to flatten and spread in the width direction. There was a problem in that the accuracy of pattern width decreased. In particular, this tendency increases as the film thickness increases; for example, when the width is 70 to 100 μm and the thickness is 10 μm,
In some cases, the pattern width increases by as much as 50% after printing.

[Means for solving problems]

The above problems can be solved by the printed pattern forming method of the present invention, in which various patterns are printed on a substrate using a printing paste and then dried by irradiation with ultraviolet rays.

[Operation j] By drying the printing paste by irradiating it with ultraviolet rays, the viscosity of the printing paste does not decrease even during the drying process, and in order to cure while maintaining the accuracy immediately after printing, a thick pattern of film can be formed. It can be formed with high precision.

〔Example〕

Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a diagram showing a printing pattern forming method according to the present invention.

The difference between the printing pattern forming method according to the present invention and the conventional printing pattern forming method lies in the drying process.

That is, in the drying step 2', drying is performed using ultraviolet light that blocks infrared rays, and the welding agent in the printing paste is evaporated to the extent that the shape immediately after printing does not collapse even when heated. It is then baked.

(Example 1) A printing paste consisting of silver powder, frit glass, a binder, and an organic solvent is printed on a glass substrate by a screen printing method to form a pattern.

Next, the entire surface is irradiated with ultraviolet rays having a wavelength of about 300 nm, which blocks infrared rays, and is dried until the organic solvent contained in the printing paste evaporates. After that, it is placed in a firing furnace and heated gradually and fired at 560°C for 1 hour.

The pattern formed according to this example had a width increase of less than 20% after firing compared to the pattern immediately after printing (width: 100 μm, thickness: about 10 μm).

(Example 2) On a transparent electrode film formed on a glass substrate, an etching resist made of a synthetic resin and an organic solvent is further printed by screen printing to form an etching resist pattern. Next, a wavelength of 300 nm that blocks infrared rays
The etching resist is dried until the organic solvent contained in the etching resist evaporates. After that, final drying is performed using hot air.

In this case as well, if 50% or more of the organic solvent contained in the etching resist is evaporated by ultraviolet 1 (θ) radiation, the width of the pattern will not increase even if subsequent drying is performed with hot air.

〔Effect of the invention〕

As described above, according to the present invention, it is possible to provide a method for forming a printed pattern with high precision and a thick film.

[Brief explanation of drawings]

FIG. 1 is a diagram showing a printing pattern forming method according to the present invention, FIG. 2 is a diagram showing a conventional printing pattern forming method, FIG. Plan view of the pattern, Fig. 2 f
cl is a 1it11 cross-sectional view of the printed pattern. In the figure, 1 indicates a printing process, 2.2 indicates a drying process, and 3 indicates a firing process. Kaya 1 g Kaya 2 Mitsu (ra)

Claims (1)

[Claims] A pattern forming method in which various patterns are printed on a substrate made of ceramic, glass, etc. using a printing paste containing an organic solvent, and then dried or fired. A printed pattern forming method characterized by printing various patterns and then drying them by irradiating them with ultraviolet rays.