JPS6155242B2 - - Google Patents
Info
- Publication number
- JPS6155242B2 JPS6155242B2 JP52065012A JP6501277A JPS6155242B2 JP S6155242 B2 JPS6155242 B2 JP S6155242B2 JP 52065012 A JP52065012 A JP 52065012A JP 6501277 A JP6501277 A JP 6501277A JP S6155242 B2 JPS6155242 B2 JP S6155242B2
- Authority
- JP
- Japan
- Prior art keywords
- polymer
- metal plate
- film
- polymer film
- polymer layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Lining Or Joining Of Plastics Or The Like (AREA)
Description
【発明の詳細な説明】
本発明はエレクトレツト用高分子被膜の製造方
法に関するもので、簡単にエレクトレツト用高分
子フイルムを金属板表面に強力に固定できるよう
にすることを目的とする。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for producing a polymer film for electrets, and an object of the present invention is to easily and strongly fix a polymer film for electrets to the surface of a metal plate.
従来、金属板に高分子フイルムを固定する方法
としては1接着剤を使用して接着する、2高分子
フイルムを熱プレス熱ロール等で熱接着又は熱融
着する、等の方法が考えられている。しかし1の
方法ではエレクトレツトに適した高分子フイル
ム、例えばフツ素樹脂のフイルムは接着に適さ
ず、接着力が弱いためフイルムを接着した金属板
をマイク等の電極に裁断、プレス打抜き等で成形
することが困難で量産性に欠ける上、エレクトレ
ツト化した場合、接着剤によるエレクトレツトの
特性劣化等があつて安定性、信頼性に乏しい欠点
がある。また2の方法で高分子フイルムを金属板
表面に熱接着又は融着する場合、熱プレス、熱ロ
ーラ等の大がかりな設備が必要となり、圧力ム
ラ、温度分布によつて膜の焼付け状態が不均一と
なる。特に焼付けた後の冷却過程で冷却速度を正
確にコントロールすることが製造設備の制約で難
しいため、フイルムの分子配列の配向性がくずれ
て結晶化する場合、均一な結晶が得られず、得ら
れた高分子被膜をエレクトレツト化した場合の安
定性、信頼性に欠ける。 Conventionally, methods of fixing a polymer film to a metal plate include 1) adhering using an adhesive, and 2) thermally bonding or thermally fusing the polymer film with a heat press hot roll, etc. There is. However, in method 1, polymer films suitable for electrets, such as fluororesin films, are not suitable for adhesion and have weak adhesive strength, so the metal plate to which the film is glued is cut into electrodes for microphones, etc., and formed by cutting, press punching, etc. It is difficult to process and is not suitable for mass production, and when it is made into an electret, the adhesive deteriorates the characteristics of the electret, resulting in poor stability and reliability. In addition, when using method 2 to thermally bond or fuse a polymer film to the surface of a metal plate, large-scale equipment such as a heat press and heat roller is required, and the baked state of the film may be uneven due to uneven pressure and temperature distribution. becomes. In particular, it is difficult to accurately control the cooling rate during the cooling process after baking due to constraints on manufacturing equipment, so if the orientation of the film's molecular arrangement is disrupted and crystallization occurs, uniform crystals may not be obtained and It lacks stability and reliability when the polymer coating is made into an electret.
本発明は従来のこの様な欠点を除去して簡単な
製造設備でエレクトレツト用高分子フイルムを電
極に固定する製造方法を提供するものである。 The present invention provides a manufacturing method for fixing a polymer film for an electret to an electrode using simple manufacturing equipment by eliminating these conventional drawbacks.
以下に本発明の一実施例を図面と共に説明す
る。1は熱板、2は高分子層3をコーテイングし
た金属板、4は熱板1を加熱するためのヒータ、
5は高分子フイルム、6は平板、7は断熱層であ
る。 An embodiment of the present invention will be described below with reference to the drawings. 1 is a hot plate; 2 is a metal plate coated with a polymer layer 3; 4 is a heater for heating the hot plate 1;
5 is a polymer film, 6 is a flat plate, and 7 is a heat insulating layer.
今熱板1に真空チヤツキング等で金属板2を吸
着させ、この金属板2上の高分子層3が溶融状態
になるまでヒータ4で加熱する。その後高分子フ
イルム5を緊張して高分子層3から離して保持
し、上から断熱層7を持ちよく研磨した平板6を
押し付けて高分子層3に密着した後平板6を取り
外して高分子被膜が分解しない温度で融着を行
う。高分子フイルム5を高分子層3に密着する場
合に使用する平板6は同じく断熱層を持つたロー
ラでも密着可能である。また以上の工程は高分子
フイルム5と金属板2との間に高分子層3が無く
ても同様の工程で被膜を得ることができるが固定
強度が弱く、金属板2の表面状態が高分子フイル
ムの均一な結晶化を阻害するため、エレクトレツ
ト化して後の安定性、信頼性に欠ける。 Now, the metal plate 2 is adsorbed onto the hot plate 1 by vacuum chucking or the like, and heated by the heater 4 until the polymer layer 3 on the metal plate 2 becomes molten. After that, the polymer film 5 is held under tension and separated from the polymer layer 3, and a well-polished flat plate 6 with a heat insulating layer 7 is pressed onto it to make it adhere to the polymer layer 3. After that, the flat plate 6 is removed and the polymer coating is applied. Fusion is carried out at a temperature that does not decompose. The flat plate 6 used to adhere the polymer film 5 to the polymer layer 3 may also be a roller having a heat insulating layer. In addition, in the above process, a film can be obtained by the same process even without the polymer layer 3 between the polymer film 5 and the metal plate 2, but the fixing strength is weak and the surface state of the metal plate 2 is made of polymer. Since it inhibits uniform crystallization of the film, it lacks stability and reliability after electrification.
以上の工程を経て金属板の表面に固定されたエ
レクトレツト用高分子被膜は次の様な特徴を有す
る。 The polymer coating for electrets fixed to the surface of the metal plate through the above steps has the following characteristics.
1 高分子層3を介在させて金属板2に密着する
ために固定が強力で裁断、プレス打抜等でマイ
クイヤホン、スピーカ等の固定電極に形成でき
る。1. Since it is tightly attached to the metal plate 2 with the polymer layer 3 interposed, it is strongly fixed and can be formed into fixed electrodes for microphone earphones, speakers, etc. by cutting, press punching, etc.
2 熱板1に真空チヤツキング等で強力に吸着し
ており、熱プレス、熱ローラ等に比較して温度
ムラが少いため均一な被膜が得られる。また金
属板温度と熱板温度がほぼ等しいため温度制御
が簡単である。特に冷却時、冷却速度を管理す
ることが容易なため、被膜分子の結晶化を調節
することができ、エレクトレツトとしての安定
性、信頼性を向上できる。2. It is strongly adsorbed to the hot plate 1 by vacuum chucking, etc., and there is less temperature unevenness compared to hot presses, hot rollers, etc., so a uniform coating can be obtained. Furthermore, since the metal plate temperature and the hot plate temperature are approximately equal, temperature control is easy. In particular, during cooling, since the cooling rate can be easily controlled, the crystallization of the coating molecules can be controlled, and the stability and reliability of the electret can be improved.
3 高分子フイルム5を融着する金属板2の表面
から離して高温で保持するためフイルム5表面
の吸着ガスが逃げ気胞の無い平滑な被膜面が得
られ安定性、信頼性の高いエレクトレツト用高
分子被膜となる。3. Since the polymer film 5 is kept at a high temperature away from the surface of the metal plate 2 to be fused, the adsorbed gas on the surface of the film 5 escapes, resulting in a smooth coating surface without air bubbles, which is highly stable and reliable for electrets. It becomes a polymer film.
4 治具の構成が熱プレス、熱ローラ等に比較し
て加圧装置の必要が無いため簡単にでき、安い
コストでエレクトレツト用被膜が得られる。4. Compared to hot presses, hot rollers, etc., the structure of the jig does not require a pressurizing device, so it can be made easily, and a coating for electrets can be obtained at a low cost.
以上実施例により説明した様に本発明によれば
簡単な構成の治具で適当な面積の金属板表面に均
一な高分子被膜を強力に固定できるため、マイ
ク、ヘツドホンスピーカ等の固定電極にプレス又
は裁断で成形でき、平面度が必要な場合は成形
後、平プレス工程を加えて所定の平面度を得るこ
とが可能であり、特に小型マイク、イヤホン等、
小面積の固定電極を安価に歩どまりよく供給でき
る。また比較的大きな面積の電極に対しては電極
成形後、同様の工程によつて被膜を形成すること
ができる。 As explained above in the examples, according to the present invention, a uniform polymer coating can be firmly fixed on the surface of a metal plate of an appropriate area using a jig with a simple configuration, so it can be pressed onto fixed electrodes of microphones, headphone speakers, etc. Alternatively, it can be formed by cutting, and if flatness is required, a flat pressing process can be added after molding to obtain the specified flatness, especially for small microphones, earphones, etc.
Small-area fixed electrodes can be supplied at low cost and with good yield. Further, for electrodes having a relatively large area, a coating can be formed by the same process after electrode molding.
図面は本発明の一実施例におけるエレクトレツ
ト用高分子被膜の製造方法の一工程図である。
1……熱板、2……金属板、3……高分子層、
5……高分子フイルム。
The drawing is a process diagram of a method for manufacturing a polymer coating for electrets according to an embodiment of the present invention. 1... Hot plate, 2... Metal plate, 3... Polymer layer,
5...Polymer film.
Claims (1)
板に吸着させるとともに、上記高分子層より離し
て高分子フイルムを保持し、上記熱板による加熱
により上記高分子層を溶融させた後に、上記高分
子フイルムを上記高分子層上に密着させて上記高
分子フイルムを上記金属板に融着することを特徴
とするエレクトレツト用高分子被膜の製造方法。1. A metal plate having a polymer layer is adsorbed on a hot plate having a large heat capacity, a polymer film is held at a distance from the polymer layer, and the polymer layer is melted by heating with the hot plate, and then the 1. A method for producing a polymer coating for an electret, which comprises bringing a polymer film into close contact with the polymer layer and fusing the polymer film to the metal plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6501277A JPS53149694A (en) | 1977-06-01 | 1977-06-01 | Method of manufacturing macro-molecular film for electrorette |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6501277A JPS53149694A (en) | 1977-06-01 | 1977-06-01 | Method of manufacturing macro-molecular film for electrorette |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS53149694A JPS53149694A (en) | 1978-12-27 |
| JPS6155242B2 true JPS6155242B2 (en) | 1986-11-27 |
Family
ID=13274634
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6501277A Granted JPS53149694A (en) | 1977-06-01 | 1977-06-01 | Method of manufacturing macro-molecular film for electrorette |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS53149694A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5775418A (en) * | 1980-10-29 | 1982-05-12 | Tokyo Shibaura Electric Co | Piezoelectric or pyroelectric element |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS526998A (en) * | 1975-07-07 | 1977-01-19 | Aiwa Co Ltd | Electrolytic film manufacture method |
-
1977
- 1977-06-01 JP JP6501277A patent/JPS53149694A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS53149694A (en) | 1978-12-27 |
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