JPS6161875B2 - - Google Patents
Info
- Publication number
- JPS6161875B2 JPS6161875B2 JP58177462A JP17746283A JPS6161875B2 JP S6161875 B2 JPS6161875 B2 JP S6161875B2 JP 58177462 A JP58177462 A JP 58177462A JP 17746283 A JP17746283 A JP 17746283A JP S6161875 B2 JPS6161875 B2 JP S6161875B2
- Authority
- JP
- Japan
- Prior art keywords
- adherend
- film
- meth
- protective layer
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011241 protective layer Substances 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 21
- 239000012790 adhesive layer Substances 0.000 claims description 18
- 239000000853 adhesive Substances 0.000 claims description 17
- 230000001070 adhesive effect Effects 0.000 claims description 17
- 239000002131 composite material Substances 0.000 claims description 15
- 239000000203 mixture Substances 0.000 claims description 15
- 239000000178 monomer Substances 0.000 claims description 14
- 229920006243 acrylic copolymer Polymers 0.000 claims description 13
- 239000003504 photosensitizing agent Substances 0.000 claims description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 9
- 150000001875 compounds Chemical class 0.000 claims description 9
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims description 6
- 229920001577 copolymer Polymers 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims description 2
- -1 hydroxypropyl Chemical group 0.000 description 14
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 7
- 239000006185 dispersion Substances 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 238000001723 curing Methods 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 4
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 4
- 229910052753 mercury Inorganic materials 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 244000028419 Styrax benzoin Species 0.000 description 3
- 235000000126 Styrax benzoin Nutrition 0.000 description 3
- 235000008411 Sumatra benzointree Nutrition 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000012965 benzophenone Substances 0.000 description 3
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 description 3
- 235000019382 gum benzoic Nutrition 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- XXROGKLTLUQVRX-UHFFFAOYSA-N allyl alcohol Chemical compound OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- VLKZOEOYAKHREP-UHFFFAOYSA-N methyl pentane Natural products CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 230000002165 photosensitisation Effects 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- IANQTJSKSUMEQM-UHFFFAOYSA-N 1-benzofuran Chemical compound C1=CC=C2OC=CC2=C1 IANQTJSKSUMEQM-UHFFFAOYSA-N 0.000 description 1
- BOCJQSFSGAZAPQ-UHFFFAOYSA-N 1-chloroanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2Cl BOCJQSFSGAZAPQ-UHFFFAOYSA-N 0.000 description 1
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- LTHJXDSHSVNJKG-UHFFFAOYSA-N 2-[2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOCCOC(=O)C(C)=C LTHJXDSHSVNJKG-UHFFFAOYSA-N 0.000 description 1
- FPKCTSIVDAWGFA-UHFFFAOYSA-N 2-chloroanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3C(=O)C2=C1 FPKCTSIVDAWGFA-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical group C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- DIVXVZXROTWKIH-UHFFFAOYSA-N 2-hydroxy-1,2-diphenylpropan-1-one Chemical compound C=1C=CC=CC=1C(O)(C)C(=O)C1=CC=CC=C1 DIVXVZXROTWKIH-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- AGNTUZCMJBTHOG-UHFFFAOYSA-N 3-[3-(2,3-dihydroxypropoxy)-2-hydroxypropoxy]propane-1,2-diol Chemical compound OCC(O)COCC(O)COCC(O)CO AGNTUZCMJBTHOG-UHFFFAOYSA-N 0.000 description 1
- JIGUICYYOYEXFS-UHFFFAOYSA-N 3-tert-butylbenzene-1,2-diol Chemical compound CC(C)(C)C1=CC=CC(O)=C1O JIGUICYYOYEXFS-UHFFFAOYSA-N 0.000 description 1
- UGVRJVHOJNYEHR-UHFFFAOYSA-N 4-chlorobenzophenone Chemical compound C1=CC(Cl)=CC=C1C(=O)C1=CC=CC=C1 UGVRJVHOJNYEHR-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- UKLGHCNOCVQUQZ-UHFFFAOYSA-N C(C(=C)C)(=O)OCC(=O)C=1C(=CC=CC1)C(=O)C(O)C1=CC=CC=C1 Chemical compound C(C(=C)C)(=O)OCC(=O)C=1C(=CC=CC1)C(=O)C(O)C1=CC=CC=C1 UKLGHCNOCVQUQZ-UHFFFAOYSA-N 0.000 description 1
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
- ZCZFEIZSYJAXKS-UHFFFAOYSA-N [3-hydroxy-2,2-bis(hydroxymethyl)propyl] prop-2-enoate Chemical compound OCC(CO)(CO)COC(=O)C=C ZCZFEIZSYJAXKS-UHFFFAOYSA-N 0.000 description 1
- BEUGBYXJXMVRFO-UHFFFAOYSA-N [4-(dimethylamino)phenyl]-phenylmethanone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=CC=C1 BEUGBYXJXMVRFO-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- ZLFVRXUOSPRRKQ-UHFFFAOYSA-N chembl2138372 Chemical compound [O-][N+](=O)C1=CC(C)=CC=C1N=NC1=C(O)C=CC2=CC=CC=C12 ZLFVRXUOSPRRKQ-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- OMNKZBIFPJNNIO-UHFFFAOYSA-N n-(2-methyl-4-oxopentan-2-yl)prop-2-enamide Chemical compound CC(=O)CC(C)(C)NC(=O)C=C OMNKZBIFPJNNIO-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229920002601 oligoester Polymers 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- HVAMZGADVCBITI-UHFFFAOYSA-N pent-4-enoic acid Chemical compound OC(=O)CCC=C HVAMZGADVCBITI-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 229950000688 phenothiazine Drugs 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000004250 tert-Butylhydroquinone Substances 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 235000014692 zinc oxide Nutrition 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Landscapes
- Decoration By Transfer Pictures (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Description
この発明は被着体面に表面保護層を形成する方
法に関するものであつて、さらに詳しくは金属
板、ガラス板、木板、化粧板、プラスチツク板の
如き板状物品などからなる被着体の表面が損傷す
るのを半永久的に防止するための表面保護層を形
成する方法を提供するものである。
従来、板状物品などからなる被着体の表面保護
は、加工前の段階においては表面保護粘着フイル
ムを仮着しておき、加工後においては塗料などを
塗設することによつて行われるのが一般的であ
る。
これらの一連の工程は、板状物品への前記フイ
ルムの貼り付けから始まり、次いで曲げ、絞り、
打抜きなどの加工を行つて、さらにフイルムの剥
離、表面洗浄、塗装、乾燥という順序からなつて
おり、煩雑であるばかりか、洗浄液や塗料には多
量の有機溶剤が含まれているために、安全および
衛生上の種々の問題があつた。
従つてこの発明の第1の目的は、加工前の板状
物品の表面保護から加工後の表面保護までを簡単
に行える表面保護層の形成方法を提供することに
ある。
この発明の第2の目的は、施工時に有機溶剤を
使用することなく、簡単な操作で表面保護層を形
成する方法を提供することにある。
さらにこの発明の第3の目的は、被着体への密
着性にすぐれた表面保護層を形成することにあ
る。
すなわち、この発明は、アクリル系不飽和単量
体と重合性不飽和基を有する光増感剤とを共重合
させてなるアクリル系共重合体および分子中に少
なくとも1個の(メタ)アクリロイル基を有する
光重合性化合物からなる光硬化型粘着組成物を自
己支持性シート(又はフイルム)面に塗設し、光
硬化型粘着層を形成してなる複合シート(又はフ
イルム)を被着体面上に前記光硬化型粘着層を介
して貼り合わせて後光照射して前記光硬化型粘着
層を硬化させ、次いで前記自己支持性シート(又
はフイルム)のみを剥離し、前記被着体面に重合
硬化物からなる表面保護層を形成させることを特
徴とする表面保護層形成方法に係るものである。
この発明の方法によれば、加工前及び加工中の
板状物品などからなる被着体の表面の損傷は、複
合シートを貼り付けておくことによつて防止さ
れ、加工後は光照射して光硬化型粘着層を重合硬
化して形成してなる表面保護層により保護される
ので、被着体表面が損傷されることがない。しか
も施工時に有機溶剤を使用しないので安全および
衛生上の問題もない。
また、一般にベンゾフエノンやベンゾインなど
の光増感剤はアクリル系共重合体との相溶性が悪
く、これらと光重合性化合物とを含む組成物を光
硬化させた場合には硬化が不均一となり、被着体
に対する密着性が低下する場合があるが、この発
明の方法においては、光硬化型粘着組成物中のア
クリル系共重合体にあらかじめ光増感基が導入さ
れているため、光硬化時には硬化が均一となり被
着体に対する密着性のすぐれた表面保護層が形成
できる。
しかも、硬化時にはアクリル系共重合体と光重
合性化合物とが光増感基を介して結合するため表
面保護層の耐溶剤性も良好なものとなる。
この発明の方法におけるアクリル系共重合体を
得るために用いるアクリル系不飽和単量体とは、
アルキル基の炭素数が1〜12個のアクリル酸アル
キルエステルおよびメタクリル酸アルキルエステ
ルが挙げられ、これらの1種または2種以上を使
用する。また、これら(メタ)アクリル酸アルキ
ルエステルとともにアクリル系不飽和単量体中40
重量%以下の割合でこれらと共重合可能な他の不
飽和単量体の1種または2種以上を併用してもよ
い。
他の不飽和単量体としては、酢酸ビニル、プロ
ピオン酸ビニル、(メタ)アクリロニトリル、(メ
タ)アクリルアミド、ジアセトンアクリルアミ
ド、スチレンの如き不飽和単量体、(メタ)アク
リル酸、マレイン酸、フマル酸、イタコン酸、ア
リル酢酸などのカルボキシル基含有単量体、ヒド
ロキシエチル(メタ)アクリレート、ヒドロキシ
プロピル(メタ)アクリレート、アリルアルコー
ル、ポリエチレングリコールと(メタ)アクリル
酸とのモノエステル、ペンタエリスリトールモノ
アクリレート、トリグリセロールモノアクリレー
ト、エチレングリコール又はポリエチレングリコ
ールのモノビニルエーテル、プロピレングリコー
ルまたはポリプロピレングリコールのモノビニル
エーテルなどの水酸基含有単量体、グリシジルア
クリレート、グリシジルメタクリレートなどのエ
ポキシ基含有単量体、N―メチロール(メタ)ア
クリルアミド、N―n―ブトキシメチルアクリル
アミドなどのN―メチロール基またはN―アルコ
キシメチル基含有単量体などが挙げられる。
このようなアクリル系不飽和単量体と共重合さ
せてアクリル系共重合体を得るために用いられる
重合性不飽和基を有する光増感剤としては、例え
ば、ベンゾイン、ベンゾインメチルエーテル、ベ
ンゾインエチルエーテル、ベンゾインイソプロピ
ルエーテル、α―メチルベンゾインなどのベンゾ
イン類、1―クロロアントラキノン、2―クロロ
アントラキノンなどのアントラキノン類、ベンゾ
フエノン、p―クロロベンゾフエノン、p―ジメ
チルアミノベンゾフエノンなどのベンゾフエノン
類、ベンジルジメチルケタールなどのベンジル類
などに、アルキル基の炭素数が1〜12個の(メ
タ)アクリル酸アルキルエステルなどを用いて、
(メタ)アクリロイル基を導入することによつて
得られる。
この光増感剤の具体例としては、例えば、4―
アクリロイルオキシエチルオキシ―4′―クロロベ
ンゾフエノン、4―メタクリロイルオキシプロピ
ルオキシ―4′―クロロベンゾフエノン、4―アク
リロイルオキシブチルオキシ―4′―クロロベンゾ
フエノン、ベンゾインカルボニルメチルメタクリ
レート、(2―ベンゾイル―4―メトキシ)フエ
ノキシカルボメチルメタクリレート、p―ニトロ
アニリノカルボニルメチルメタクリレート、4―
ニトロ―1―ナフチルアミノカルボニルメチルメ
タアクリレートなどが挙げられる。
前記のアクリル系不飽和単量体と重合性不飽和
基を有する光増感剤とを共重合させるには乳化重
合法、溶液重合法、塊状重合法などの公知の重合
方法でよい。この共重合の際の配合割合としては
前記のアクリル系不飽和単量体100重量部に対し
て前記の光増感剤が通常は1〜10重量部となるよ
うにするのがよい。この光増感剤が少なすぎると
光硬化型粘着層を光硬化させたときの硬化が不充
分となり好ましくない。またこれが多すぎると光
硬化物表面が剥離し易くなり、また硬化物が着色
するので好ましくない。
このようにして得られるアクリル系共重合体と
ともに光硬化型粘着組成物を構成する分子中に少
なくとも1個の(メタ)アクリロイル基を有する
光重合性化合物とは、分子中に重合しうる二重結
合としてのメタアクリロイル基又はアクリロイル
基を少なくとも1個、好ましくは2個以上有する
多官能性のものであり、例えば、1・4―ブチレ
ングリコールジ(メタ)アクリレート、1・6―
ヘキサングリコールジ(メタ)アクリレート、ネ
オペンチルグリコールジ(メタ)アクリレート、
ポリエチレングリコールジ(メタ)アクリレー
ト、トリメチロールプロパントリ(メタ)アクリ
レート、テトラメチロールメタンテトラ(メタ)
アクリレートなどの単量体又はエポキシアクリレ
ート、ウレタン変性アクリレート、オリゴエステ
ルアクリレートなどのオリゴマーなどが挙げら
れ、これらは必要に応じて2種以上を併用しても
よい。
光硬化型粘着組成物におけるこの光重合性化合
物と前記のアクリル系共重合体との配合割合(重
量比)は、前者対後者が80:20〜10:90、好まし
くは70:30〜30:70となるようにするのがよい、
光重合性化合物の配合量が多すぎると光硬化型粘
着層の光照射前の凝集性が劣り、側面への糊はみ
出しなどが起きるため好ましくない。また、この
配合量が少なすぎると光硬化型粘着層が光照射に
より充分に硬化しないため好ましくない。
このようにして得られるこの発明の光硬化型粘
着組成物には目的に応じて他の配合剤を適量添加
することができる。配合剤の例としては、製造中
の熱重合や保存中の反応を防止する重合禁止剤例
えばハイドロキノン、ハイドロキノンモノメチル
エーテル、tert―ブチルカテコール、p―ベンゾ
キノン、2・5―tert―ブチルハイドロキノン、
フエノチアジンなど、着色又は装飾などを目的と
する例えば亜鉛華、黄鉛、ベンガラなどの顔料、
トルイジンレツド、フタロシアニンブルー、フタ
ロシアニングリーンなどの染料、その他金属粉、
ガラスビーズ、ガラス粉末、ガラスフレークな
ど、また被着体面への接着力の向上を目的とする
例えばキシレン樹脂、クマロン樹脂などの粘着性
付与樹脂などが挙げられる。
この発明の方法では、前記のように構成された
光硬化型粘着組成物は光が透過する有色又は無色
透明性の自己支持性シート(又はフイルム)、例
えばポリ塩化ビニルシート又はフイルム、ポリオ
レフイン系シート又はフイルム(エチレン―酢酸
ビニル共重合体及びそのケン化物からなるシート
又はフイルムを含む)、ポリエステルシート又は
フイルム(厚さは10〜300μmが好ましい)など
の片面に乾燥後の厚みが約1〜100μmの範囲で
塗設又は転着され、光硬化型粘着層とされる。
このように構成された自己支持性シート(又は
フイルム)と光硬化型粘着層とからなる複合シー
ト(又はフイルム)は、金属板、ガラス板、木
板、化粧板、プラスチツク板などからなる板状物
品などの被着体面に、粘着層を介して貼り付けら
れる。
前記粘着層を重合硬化させるには、高圧水銀
灯、超高圧水銀灯、メタルハライドランプ、カー
ボンアーク灯、キセノン灯などの光源を用いて
0.3秒以上、好ましくは3秒以上光照射を行う。
なお、光照射の時期は目的により被着体の加工前
でも後でもよい。
光照射後、自己支持性シート(又はフイルム)
のみを剥離することにより、被着体面には重合硬
化物からなる表面保護層が形成される。硬化によ
り粘着層の塑性流動性が失われているため前記シ
ート(又はフイルム)の剥離は容易に行える。
以上のように、この発明の方法によれば、被着
体面の表面保護に用いたた複合シートに光照射
し、自己支持性シートを剥すことによつて、半永
久的に表面を保護しうる表面保護層を形成するこ
とができる。もとより、この発明の方法は被着体
の加工などに関係なく、単に物品面に表面保護層
を形成するだけのためにも使用できる。
次にこの発明の実施例を示す。以下において部
とあるのは重量部を意味する。
実施例 1
エチルメタアクリレート 80部
メチルメタアクリレート 20部
4―アクリロイルオキシエチルオキシ―4′―ク
ロロベンゾフエノン 10部
アクリル酸 5部
ドデシルベンゼンスルホン酸ナトリウム 3部
イオン交換水 100部
上記配合組成物を500mlのフラスコに仕込み、
不活性ガス下で70℃1時間加熱攪拌した後、0.05
部の過硫酸アンモニウムを加えて70℃で5時間反
応させアクリル系共重合体の水分散体を得た。
次にこの水分散体100部(固型分)に対して、
テトラエチレングリコールジメタアクリレート50
部を水分散体を急速攪拌しつつ徐々に滴下して均
一に混合して水分散性光硬化型粘着組成物とし、
これを厚さ60μmのポリエチレンシートの片面に
乾燥後の厚みが10μmとなるように塗布し、100
℃で5分間乾燥して光硬化型粘着層を形成した複
合シートを得た。
この複合シートをBA仕上げステンレス板
SUS304に前記粘着層を介して貼り付けた後、高
圧水銀灯(1KW)で10cmの距離から約5秒間紫
外線照射して前記粘着層を硬化させ、次いでポリ
エチレンシートのみを剥離して、前記ステンレス
板上にアクリル系重合硬化物からなる表面保護層
を形成した。
実施例 2
メチルメタアクリレート 60部
4―アクリロイルオキシブチルオキシ―4′クロ
ロベンゾフエノン 40部
メタクリル酸 5部
ドデシルベンゼンスルホン酸ナトリウム 3部
イオン交換水 100部
上記配合組成物を用い、以下実施例1と同様の
操作にてアクリル系共重合体の水分散体を得た。
一方、ペンタエリスリトールトリアクリレート
60部を1部のドデシルベンゼンスルホン酸ナトリ
ウムを含む水60部に添加して急速攪拌して乳化
し、光重合性化合物の水分散体を得た。
この水分散体を上記アクリル系共重合体水分散
体80部(固形分)に混合し、水分散性光硬化型粘
着組成物を得た。
この組成物を厚さ60μmのポリエチレンシート
の片面に乾燥後の厚みが10μmとなるように塗布
し、85℃で5分間乾燥して複合シートを得た。
この複合シートを用いて実施例1と同様にして
表面保護層を形成した。
実施例 3
エチルアクリレート 80
スチレン 20部
4―メタアクリロイルオキシプロピルオキシ―
4′―クロロベンゾフエノン 10部
アゾビスイソブチロニトリル 0.2部
トルエン 100部
上記配合組成物を70℃で4時間重合し、アクリ
ル系共重合体を得た。
次にこの共重合体70部(固形分)に対して、テ
トラメチロールメタンテトラアクリレート30部を
配合して均一に混合し、厚さ120μmのポリ塩化
ビニルシートの片面に乾燥後の厚さが5μmにな
るように塗布し、100℃で5分間乾燥して複合シ
ートを得た。
この複合シートを用いて実施例1と同様にして
表面保護層を形成した。
上記実施例1〜3で得られた表面保護層につい
て鉛筆硬度、密着力を測定した結果を次表に示
す。なお、密着力については、被着体を銅板およ
びアクリル板として実施例1〜3と同様にして表
面保護層を形成した場合の値を併記した。
また、光照射前の複合シートの接着力(初期接
着力)および光照射後自己支持性シートを剥離す
る際の接着力(自己支持性シート剥離力)につい
て調べた結果も次表に併記した。
The present invention relates to a method for forming a surface protective layer on the surface of an adherend, and more specifically, the present invention relates to a method for forming a surface protective layer on the surface of an adherend, and more specifically, the present invention relates to a method for forming a surface protective layer on the surface of an adherend, and more specifically, the present invention relates to a method for forming a surface protective layer on the surface of an adherend. The present invention provides a method for forming a surface protective layer to semi-permanently prevent damage. Conventionally, surface protection of adherends such as plate-shaped articles has been carried out by temporarily attaching a surface protective adhesive film before processing, and then applying paint after processing. is common. These series of steps begin with pasting the film onto a plate-shaped article, followed by bending, drawing, and
The process involves processing such as punching, followed by film peeling, surface cleaning, painting, and drying, which is not only complicated, but also requires safety because the cleaning fluid and paint contain large amounts of organic solvents. There were also various hygiene problems. Therefore, a first object of the present invention is to provide a method for forming a surface protective layer that can easily carry out the process from protecting the surface of a plate-shaped article before processing to protecting the surface after processing. A second object of the present invention is to provide a method for forming a surface protective layer by a simple operation without using an organic solvent during construction. Furthermore, a third object of the present invention is to form a surface protective layer with excellent adhesion to an adherend. That is, the present invention provides an acrylic copolymer obtained by copolymerizing an acrylic unsaturated monomer and a photosensitizer having a polymerizable unsaturated group, and at least one (meth)acryloyl group in the molecule. A photocurable adhesive composition made of a photopolymerizable compound having the following properties is coated on the surface of a self-supporting sheet (or film), and a composite sheet (or film) formed by forming a photocurable adhesive layer is applied on the surface of the adherend. are bonded together via the photo-curable adhesive layer and irradiated with backlight to cure the photo-curable adhesive layer, then only the self-supporting sheet (or film) is peeled off, and the surface of the adherend is polymerized and cured. The present invention relates to a method for forming a surface protective layer, which is characterized by forming a surface protective layer made of a material. According to the method of this invention, damage to the surface of the adherend consisting of a plate-like article before and during processing can be prevented by pasting the composite sheet, and after processing, it can be prevented from being damaged by light irradiation. Since the surface of the adherend is protected by the surface protective layer formed by polymerizing and curing the photocurable adhesive layer, the surface of the adherend will not be damaged. Furthermore, since no organic solvents are used during construction, there are no safety or hygiene issues. Additionally, photosensitizers such as benzophenone and benzoin generally have poor compatibility with acrylic copolymers, and when a composition containing these and a photopolymerizable compound is photocured, the curing will be uneven; Although the adhesion to the adherend may decrease, in the method of this invention, the photosensitizing group is introduced into the acrylic copolymer in the photocurable adhesive composition in advance, so the adhesiveness is reduced during photocuring. Curing is uniform and a surface protective layer with excellent adhesion to the adherend can be formed. Moreover, since the acrylic copolymer and the photopolymerizable compound are bonded via the photosensitizing group during curing, the surface protective layer also has good solvent resistance. The acrylic unsaturated monomer used to obtain the acrylic copolymer in the method of this invention is:
Examples include acrylic acid alkyl esters and methacrylic acid alkyl esters in which the alkyl group has 1 to 12 carbon atoms, and one or more of these may be used. In addition, along with these (meth)acrylic acid alkyl esters, 40
One or more other unsaturated monomers copolymerizable with these may be used in combination in a proportion of not more than % by weight. Other unsaturated monomers include vinyl acetate, vinyl propionate, (meth)acrylonitrile, (meth)acrylamide, diacetone acrylamide, unsaturated monomers such as styrene, (meth)acrylic acid, maleic acid, and fumaric acid. Acid, carboxyl group-containing monomers such as itaconic acid and allyl acetic acid, hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, allyl alcohol, monoester of polyethylene glycol and (meth)acrylic acid, pentaerythritol monoacrylate , hydroxyl group-containing monomers such as triglycerol monoacrylate, ethylene glycol or polyethylene glycol monovinyl ether, propylene glycol or polypropylene glycol monovinyl ether, epoxy group-containing monomers such as glycidyl acrylate, glycidyl methacrylate, N-methylol (meth) ) N-methylol group- or N-alkoxymethyl group-containing monomers such as acrylamide and Nn-butoxymethylacrylamide. Examples of the photosensitizer having a polymerizable unsaturated group used for copolymerizing with such an acrylic unsaturated monomer to obtain an acrylic copolymer include benzoin, benzoin methyl ether, and benzoin ethyl. ether, benzoin isopropyl ether, benzoins such as α-methylbenzoin, anthraquinones such as 1-chloroanthraquinone, 2-chloroanthraquinone, benzophenones such as benzophenone, p-chlorobenzophenone, p-dimethylaminobenzophenone, Using a (meth)acrylic acid alkyl ester with an alkyl group having 1 to 12 carbon atoms to a benzyl group such as benzyl dimethyl ketal,
Obtained by introducing a (meth)acryloyl group. Specific examples of this photosensitizer include, for example, 4-
Acryloyloxyethyloxy-4'-chlorobenzophenone, 4-methacryloyloxypropyloxy-4'-chlorobenzophenone, 4-acryloyloxybutyloxy-4'-chlorobenzophenone, benzoincarbonylmethyl methacrylate, (2 -benzoyl-4-methoxy) phenoxycarbomethyl methacrylate, p-nitroanilinocarbonylmethyl methacrylate, 4-
Examples include nitro-1-naphthylaminocarbonylmethyl methacrylate. In order to copolymerize the acrylic unsaturated monomer and the photosensitizer having a polymerizable unsaturated group, known polymerization methods such as emulsion polymerization, solution polymerization, and bulk polymerization may be used. The blending ratio during this copolymerization is usually 1 to 10 parts by weight of the photosensitizer to 100 parts by weight of the acrylic unsaturated monomer. If the amount of this photosensitizer is too small, curing of the photocurable adhesive layer will be insufficient, which is not preferable. Moreover, if the amount is too large, the surface of the photocured product will easily peel off, and the cured product will be colored, which is not preferable. A photopolymerizable compound having at least one (meth)acryloyl group in the molecule that constitutes the photocurable adhesive composition together with the acrylic copolymer obtained in this way refers to a photopolymerizable compound having at least one (meth)acryloyl group in the molecule. Polyfunctional ones having at least one, preferably two or more methacryloyl groups or acryloyl groups as a bond, such as 1,4-butylene glycol di(meth)acrylate, 1,6-
Hexane glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate,
Polyethylene glycol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, tetramethylolmethanetetra(meth)
Examples include monomers such as acrylates, and oligomers such as epoxy acrylates, urethane-modified acrylates, and oligoester acrylates, and two or more of these may be used in combination as necessary. The blending ratio (weight ratio) of this photopolymerizable compound and the above-mentioned acrylic copolymer in the photocurable adhesive composition is 80:20 to 10:90, preferably 70:30 to 30: It is better to set it to 70,
If the amount of the photopolymerizable compound is too large, the cohesiveness of the photocurable adhesive layer before irradiation with light will be poor, and the adhesive may ooze out to the side surfaces, which is not preferable. Furthermore, if the amount is too small, the photocurable adhesive layer will not be sufficiently cured by light irradiation, which is not preferable. Appropriate amounts of other compounding agents may be added to the photocurable pressure-sensitive adhesive composition of the present invention thus obtained, depending on the purpose. Examples of compounding agents include polymerization inhibitors that prevent thermal polymerization during production and reactions during storage, such as hydroquinone, hydroquinone monomethyl ether, tert-butylcatechol, p-benzoquinone, 2,5-tert-butylhydroquinone,
Pigments such as zinc white, yellow lead, and red iron for the purpose of coloring or decoration, such as phenothiazine;
Dyes such as toluidine red, phthalocyanine blue, phthalocyanine green, other metal powders,
Examples include glass beads, glass powder, glass flakes, and tackifying resins such as xylene resin and coumaron resin for the purpose of improving adhesive strength to the adherend surface. In the method of the present invention, the photocurable adhesive composition configured as described above is formed into a colored or colorless transparent self-supporting sheet (or film) that transmits light, such as a polyvinyl chloride sheet or film, or a polyolefin sheet. Or a film (including a sheet or film made of ethylene-vinyl acetate copolymer and its saponified product), a polyester sheet or film (thickness preferably 10 to 300 μm), etc. with a thickness of about 1 to 100 μm after drying on one side. It is coated or transferred to form a photocurable adhesive layer. A composite sheet (or film) composed of a self-supporting sheet (or film) and a photocurable adhesive layer configured in this way can be used as a plate-shaped article made of a metal plate, glass plate, wood board, decorative board, plastic board, etc. etc., through an adhesive layer. In order to polymerize and harden the adhesive layer, a light source such as a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a metal halide lamp, a carbon arc lamp, a xenon lamp, etc. is used.
Light irradiation is performed for 0.3 seconds or more, preferably 3 seconds or more.
Note that the timing of the light irradiation may be before or after processing the adherend depending on the purpose. After light irradiation, self-supporting sheet (or film)
By peeling off the adhesive, a surface protective layer made of a cured polymer is formed on the surface of the adherend. Since the plastic fluidity of the adhesive layer is lost due to curing, the sheet (or film) can be easily peeled off. As described above, according to the method of the present invention, by irradiating the composite sheet used for surface protection of the adherend surface with light and peeling off the self-supporting sheet, the surface can be protected semi-permanently. A protective layer can be formed. Of course, the method of the present invention can also be used simply to form a surface protective layer on the surface of an article, regardless of the processing of the adherend. Next, examples of this invention will be shown. In the following, parts mean parts by weight. Example 1 Ethyl methacrylate 80 parts Methyl methacrylate 20 parts 4-acryloyloxyethyloxy-4'-chlorobenzophenone 10 parts Acrylic acid 5 parts Sodium dodecylbenzenesulfonate 3 parts Ion-exchanged water 100 parts The above compounded composition Pour into a 500ml flask,
After heating and stirring at 70℃ for 1 hour under inert gas, 0.05
of ammonium persulfate was added, and the mixture was reacted at 70°C for 5 hours to obtain an aqueous dispersion of an acrylic copolymer. Next, for 100 parts of this water dispersion (solid content),
Tetraethylene glycol dimethacrylate 50
part is gradually added dropwise to the water dispersion while stirring rapidly to mix uniformly to obtain a water-dispersible photocurable adhesive composition,
This was applied to one side of a 60 μm thick polyethylene sheet so that the thickness after drying was 10 μm.
A composite sheet having a photocurable adhesive layer formed thereon was obtained by drying at ℃ for 5 minutes. This composite sheet is made of BA finished stainless steel plate.
After pasting it on SUS304 through the adhesive layer, the adhesive layer was cured by irradiating it with ultraviolet light for about 5 seconds from a distance of 10 cm using a high-pressure mercury lamp (1KW), and then only the polyethylene sheet was peeled off and placed on the stainless steel plate. A surface protective layer made of a cured acrylic polymer was formed on the surface. Example 2 Methyl methacrylate 60 parts 4-acryloyloxybutyloxy-4'chlorobenzophenone 40 parts Methacrylic acid 5 parts Sodium dodecylbenzenesulfonate 3 parts Ion-exchanged water 100 parts Using the above composition, Example 1 is as follows. An aqueous dispersion of an acrylic copolymer was obtained in the same manner as above. On the other hand, pentaerythritol triacrylate
60 parts was added to 60 parts of water containing 1 part of sodium dodecylbenzenesulfonate and emulsified by rapid stirring to obtain an aqueous dispersion of a photopolymerizable compound. This water dispersion was mixed with 80 parts (solid content) of the above acrylic copolymer water dispersion to obtain a water-dispersible photocurable adhesive composition. This composition was applied to one side of a 60 μm thick polyethylene sheet so that the thickness after drying would be 10 μm, and dried at 85° C. for 5 minutes to obtain a composite sheet. A surface protective layer was formed using this composite sheet in the same manner as in Example 1. Example 3 Ethyl acrylate 80 Styrene 20 parts 4-methacryloyloxypropyloxy-
4'-chlorobenzophenone 10 parts Azobisisobutyronitrile 0.2 parts Toluene 100 parts The above blended composition was polymerized at 70°C for 4 hours to obtain an acrylic copolymer. Next, 30 parts of tetramethylolmethanetetraacrylate was blended with 70 parts (solid content) of this copolymer, mixed uniformly, and coated on one side of a 120 μm thick polyvinyl chloride sheet to a thickness of 5 μm after drying. The composite sheet was dried at 100°C for 5 minutes to obtain a composite sheet. A surface protective layer was formed using this composite sheet in the same manner as in Example 1. The results of measuring the pencil hardness and adhesion of the surface protective layers obtained in Examples 1 to 3 above are shown in the following table. In addition, regarding the adhesion force, the values when the surface protection layer was formed in the same manner as in Examples 1 to 3 using a copper plate and an acrylic plate as adherends are also shown. In addition, the results of investigating the adhesive strength of the composite sheet before light irradiation (initial adhesive strength) and the adhesive strength when peeling off the self-supporting sheet after light irradiation (self-supporting sheet peeling force) are also listed in the following table.
【表】
なお、上記測定は次の方法により行つた。
初期接着力;複合シートを25mm幅に切断し、
BA仕上げステンレス板SUS304に貼り付けて30分
間放置後、180度引き剥し接着力を測定した(引
き剥し速度300mm/min、20℃×65%R.H.)。
自己支持性シート剥離力;複合シートを25mm幅
に切断し、BA仕上げステンレス板SUS304に貼り
付けた後、高圧水銀灯、(80w/cm/1灯)で10
cmの距離から約5秒間紫外線照射後、自己支持性
シートの180度剥離接着力を測定した(引き剥し
速度300mm/min、20℃×65%R.H.)。
鉛筆硬度;JIS―K―5400に準じ、表面保護層
の硬度を測定した。
密着力;表面保護層に、1mm間隔の切れ目を碁
盤目状に100個入れ、これに市販のセロハン粘着
テープを貼り付け、次いでテープを剥して碁盤目
片の残留%で表示した。
上記実施例からも明らかなように、この発明の
方法によれば、被着体上に良好な表面保護層を簡
単に形成できることがわかる。[Table] The above measurements were performed by the following method. Initial adhesive strength: Cut the composite sheet into 25mm width,
After pasting it on a BA-finished stainless steel plate SUS304 and leaving it for 30 minutes, it was peeled off 180 degrees and its adhesive strength was measured (peeling speed 300 mm/min, 20°C x 65% RH). Self-supporting sheet peeling force: After cutting the composite sheet into 25 mm width and pasting it on a BA finish stainless steel plate SUS304, it was peeled off with a high pressure mercury lamp (80w/cm/1 lamp) for 10 minutes.
After UV irradiation for about 5 seconds from a distance of cm, the 180 degree peel adhesive strength of the self-supporting sheet was measured (peel speed 300 mm/min, 20° C. x 65% RH). Pencil hardness: The hardness of the surface protective layer was measured according to JIS-K-5400. Adhesion: 100 cuts at 1 mm intervals were made in a grid pattern on the surface protective layer, commercially available cellophane adhesive tape was pasted thereon, the tape was then peeled off, and the percentage of remaining grid pieces was expressed. As is clear from the above examples, it can be seen that according to the method of the present invention, a good surface protective layer can be easily formed on an adherend.
Claims (1)
有する光増感剤とを共重合させてなるアクリル系
共重合体および分子中に少なくとも1個の(メ
タ)アクリロイル基を有する光重合性化合物から
なる光硬化型粘着組成物を自己支持性シート(又
はフイルム)面に塗設し、光硬化型粘着層を形成
してなる複合シート(又はフイルム)を被着体面
上に前記光硬化型粘着層を介して貼り合わせて後
光照射して前記光硬化型粘着層を硬化させ、次い
で前記自己支持性シート(又はフイルム)のみを
剥離し、前記被着体面に重合硬化物からなる表面
保護層を形成させることを特徴とする表面保護層
形成方法。1 Acrylic copolymer obtained by copolymerizing an acrylic unsaturated monomer and a photosensitizer having a polymerizable unsaturated group, and a photopolymerizable copolymer having at least one (meth)acryloyl group in the molecule A photocurable adhesive composition consisting of a compound is coated on the surface of a self-supporting sheet (or film), and a composite sheet (or film) formed by forming a photocurable adhesive layer is applied on the surface of the adherend. The photocurable adhesive layer is cured by bonding through the adhesive layer and irradiated with backlight, and then only the self-supporting sheet (or film) is peeled off, and a surface protection made of a polymerized cured product is applied to the adherend surface. A method for forming a surface protective layer, the method comprising forming a layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58177462A JPS6068082A (en) | 1983-09-26 | 1983-09-26 | Surface protective layer forming method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58177462A JPS6068082A (en) | 1983-09-26 | 1983-09-26 | Surface protective layer forming method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6068082A JPS6068082A (en) | 1985-04-18 |
| JPS6161875B2 true JPS6161875B2 (en) | 1986-12-27 |
Family
ID=16031352
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58177462A Granted JPS6068082A (en) | 1983-09-26 | 1983-09-26 | Surface protective layer forming method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6068082A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2935371B2 (en) * | 1989-06-27 | 1999-08-16 | 大日本印刷株式会社 | Processing method of polyvinyl chloride resin products including electron beam irradiation process |
| US7351446B2 (en) | 2002-10-17 | 2008-04-01 | E.I. Du Pont De Nemours & Company | Process for the production of paint coating layers |
-
1983
- 1983-09-26 JP JP58177462A patent/JPS6068082A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6068082A (en) | 1985-04-18 |
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