JPS6163839U - - Google Patents

Info

Publication number
JPS6163839U
JPS6163839U JP1984145321U JP14532184U JPS6163839U JP S6163839 U JPS6163839 U JP S6163839U JP 1984145321 U JP1984145321 U JP 1984145321U JP 14532184 U JP14532184 U JP 14532184U JP S6163839 U JPS6163839 U JP S6163839U
Authority
JP
Japan
Prior art keywords
circuit board
plated
wire bonding
plating
wiring portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984145321U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0222992Y2 (2
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984145321U priority Critical patent/JPH0222992Y2/ja
Publication of JPS6163839U publication Critical patent/JPS6163839U/ja
Application granted granted Critical
Publication of JPH0222992Y2 publication Critical patent/JPH0222992Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Wire Bonding (AREA)
JP1984145321U 1984-09-26 1984-09-26 Expired JPH0222992Y2 (2)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984145321U JPH0222992Y2 (2) 1984-09-26 1984-09-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984145321U JPH0222992Y2 (2) 1984-09-26 1984-09-26

Publications (2)

Publication Number Publication Date
JPS6163839U true JPS6163839U (2) 1986-04-30
JPH0222992Y2 JPH0222992Y2 (2) 1990-06-21

Family

ID=30703576

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984145321U Expired JPH0222992Y2 (2) 1984-09-26 1984-09-26

Country Status (1)

Country Link
JP (1) JPH0222992Y2 (2)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5716740A (en) * 1980-07-04 1982-01-28 Hitachi Ltd Protective unit for blower of air conditioner or the like

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5716740A (en) * 1980-07-04 1982-01-28 Hitachi Ltd Protective unit for blower of air conditioner or the like

Also Published As

Publication number Publication date
JPH0222992Y2 (2) 1990-06-21

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