JPS6167984A - Method for manufacturing electronic device module - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention (Technical Field) The present invention relates to a method for manufacturing an electronic device module formed on a glazed ceramic substrate, such as a thermal head or a same-magnification optical sensor, and in particular to a method for manufacturing an electronic device module formed on a glazed ceramic substrate, such as a thermal head or a same-magnification optical sensor. The present invention relates to a method of forming electronic device modules and then cutting the glazed ceramic substrate with a laser beam into individual electronic device modules.

(Prior Art) A glazed ceramic substrate is a ceramic substrate whose surface is coated with a glaze layer containing silicon oxide as a main component.

Among the methods for cutting glazed ceramic substrates, the method using a dicing saw is not suitable for use in the manufacturing process for mass production because the diamond blade used for dicing is expensive and the cutting speed is slow. There is a method that uses a wire saw, but this method has poor cutting accuracy such as chipping of the glaze layer at the cutting part, so it is not suitable for cutting and separating multiple electronic device modules formed on the same glazed ceramic substrate. Not yet.

In contrast to mechanical cutting using a dicing saw or wire saw, there is a laser cutting method that uses laser light irradiation. However, if you try to increase the power of the laser processing machine and cut at high speed using this method, the glaze layer may swell or swell due to the heat during laser cutting, or cracks may occur, damaging the electronic equipment. There is a problem in giving

(Objective) The present invention prevents sag, bulges, or cracks from occurring in the glaze layer when cutting and separating a glazed ceramic substrate on which a plurality of electronic device modules are formed using a laser processing machine.

The purpose of this invention is to provide a method that allows cutting at high speed and with high precision.

(Structure) The method of the present invention includes a step of making a glazed ceramic substrate free from laser processing,
A step of forming a laser mask layer that reflects laser light on areas other than the laser processing margin, a step of irradiating a laser beam along the laser processing margin to cut the ceramic substrate after completing these two steps, and a step of forming a laser mask layer after cutting the ceramic substrate. The method is characterized by including a step of removing the layer.

In order to make the glaze layer not exist in the laser processing allowance part, the glaze layer may be applied to the area excluding the laser processing allowance part by a printing method at the stage of applying the glaze layer to the ceramic substrate, and then fired. Alternatively, a plurality of electronic device modules are formed using a ceramic substrate with a glaze layer formed on the entire surface, and after a laser mask layer is also formed, the glaze layer in the laser processing area is removed using photolithography technology. Good too.

A metal layer such as Cu, Au or Ag is used for the laser mask layer, but it is necessary to perform selective etching between it and metal layers such as electrodes of electronic devices in a later process.
It is necessary to use a different metal from the electrodes of electronic devices.

Since the laser beam is irradiated so that no glaze layer exists in the laser processing area, the glaze layer on the electronic device part does not sag or bulge, which occurs as the glaze layer in the laser processing area melts, unlike conventional methods. , or the occurrence of cranking is prevented.

In addition, since the part other than the laser processing allowance, that is, the electronic device part, is covered with a laser mask layer, even if the laser beam extends beyond the laser processing allowance and is irradiated to the electronic device part, it will be reflected by the laser mask layer. The glaze layer in the electronic device portion is not heated to the extent that it melts, and the glaze layer is prevented from cracking.

An embodiment in which the present invention is applied to a thermal head will be specifically described below.

FIG. 1 shows a glazed ceramic substrate 2, in which a plurality of electronic device regions on the surface of a ceramic substrate 4 made of alumina or the like, excluding a laser processing allowance 6, are coated with a glaze layer 8. This glaze layer 8 is formed by a screen printing method.

As shown in FIG. 2, Ta-N, Ta-5iO2°Cr-3ion
Made of Ta-5i or Ti-N, film thickness 0.3-1μ
m resistor layer 10 is deposited, and Cr or N1 is applied on the resistor layer 10 to improve adhesion with an electrode layer 14, which will be described later.
Metal layer 1 made of cer etc. with a thickness of 300 to 3000A
2 is applied.

Further, on the metal layer 12, an electrode layer 14 made of Au, AQ, Cu, etc. and having a thickness of 0.5 to 1 μm is deposited. Each of these layers 10, 12, and 14 can be formed using a thin film forming technique such as a vacuum evaporation method or a sputtering method.

Next, the electrode layer 14, metal layer 12, and resistor layer 10 in a plurality of electronic device regions are sequentially etched using photolithography to form a heat generating part 16 and an electrode part 18, 20 as shown in FIG. .

In order to protect the heat generating part 16 from oxidation and friction with the recording paper, as shown in FIG.
05,5isN4. SiC.

A wear-resistant layer 22 made of 5io2-Ta2o5 or 5iO2-5iaN4 and having a thickness of 1 to 10 .mu.m is formed by a method such as a sputtering method or a plasma CVD method. After the wear-resistant layer 22 is deposited on the entire surface, it may be patterned into a predetermined shape by etching using photolithography technology, or it may be deposited through a mask. In this way, multiple electronic device modules are formed on the same substrate.

Next, a laser mask layer 24 made of Cu, Au, or Ag and selected to be different from the metal material of the electrode layer 14 is deposited to a thickness of 0.5 to 3 μm.

As shown in FIG. 5, the laser mask layer in the laser processing allowance portion 6 is removed by photolithography.

After that, GO from the pattern surface side using a laser processing machine.
2 laser beam 26 is irradiated to cut the ceramic substrate 4,
After separating each electronic device module, the laser mask layer 24 is removed by etching.

Laser processing machines for cutting ceramic substrates generally use a CO2 laser, but other lasers such as a YAG laser can also be used. Further, the film thickness of each layer is an example, and may be changed as necessary.

(Effects) In the present invention, since the glaze layer in the laser processing allowance is removed, the glaze layer does not sag, bulge, or crack due to heat during laser cutting. In addition, since the electronic device part is covered with a laser mask, there is a possibility that the laser beam may deviate from the laser processing allowance due to accuracy problems of the laser processing machine, or if the laser power is increased and the laser beam diameter increases, the laser beam may Even when the glaze layer protruded beyond the processing allowance, no cracks occurred in the glaze layer in the electronic device area.

As a result, the distance between 300 and 500 m using CO2 laser light
Ceramic substrates can now be cut at a high speed of m7 minutes, and with high precision.

[Brief explanation of drawings]

1 to 5 are cross-sectional views showing an embodiment of the present invention in the order of steps. 2... Glazed ceramic substrate, 6...
...Laser machining allowance part, 24...L/-sa?
26...laser light.

Claims (1)

[Claims] (1) In the method of forming multiple electronic device modules on the same glazed ceramic substrate and then cutting and separating each electronic device module using a laser processing machine, there is no glaze on the laser processing portion of the glazed ceramic substrate. A step of making the layer non-existent, a step of forming a laser mask layer that reflects the laser beam in areas other than the laser processing margin, and after completing the above two steps, irradiating the laser beam along the laser processing margin to cut the ceramic substrate. A method for manufacturing an electronic device module, comprising the steps of: and removing a laser mask layer after cutting the ceramic substrate.