JPS6169622A - Method of transporting semiconductor devices for marking - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Technical Field] The present invention relates to a technology for loading and unloading semiconductor devices in a magazine, and particularly to a sorting device such as a filter, a testing device for testing the functions, etc. of semiconductor devices. Devices, insertion devices that automatically insert semiconductor devices into boards such as printed circuit boards, marking devices that mark the surface of semiconductor devices, and other techniques that are effective when applied to take out semiconductor devices from magazines and supply them to processing units. It is something.

[Background technology]

Generally, in handlers that classify semiconductor devices (hereinafter referred to as ICs) into non-defective products and defective products, in order to supply ICs to the measurement unit, the bottom magazine of the stacked magazines is separated from the top magazine and placed horizontally. After being fed out, the lowermost magazine is given an appropriate inclination and the ICs therein are carried out (for example, see Japanese Patent Laid-Open No. 124240/1983).

However, in such devices there is no mechanism 9 for separating the bottom magazine from the magazine above it.
Since a mechanism for sending out the separated magazine laterally and a mechanism for appropriately tilting the magazine are required, a very complicated mechanism is required to carry out the IC from the magazine. In addition, after unloading ICs from one magazine until the end of the process, there are steps to separate the lowermost magazine, to push the lowermost magazine out to the side, to tilt the magazine that has been pushed out to the side, and to tilt the magazine. There is a process of returning the magazine to a horizontal position, and a process of dropping the empty magazine that has been returned to a horizontal position into a saucer. Therefore, it took a considerable amount of time to supply the IC to the measuring section. Furthermore, in the so-called self-weight drop method in which ICs are carried out from the magazine by tilting the magazine, simply tilting the magazine may cause the IC to get caught in the magazine and not be carried out.

Therefore, it is conceivable to prevent the IC from getting caught in the magazine by applying vibration to the magazine, but this is not preferable because it imparts mechanical stress to the IC. In addition, in such a self-weight dropping method, the ICs do not fall in a series, so when the IC stops falling, the ICs become stuck together, causing the ICs to fall.
was subject to large mechanical stress.

Therefore, the present inventor conducted extensive studies to solve these problems.

[Purpose of the invention]

An object of the present invention is to provide a technique that allows ICs to be easily and quickly removed from a magazine.

An object of the present invention is to provide a technique that allows ICs to be carried out from a magazine with almost no mechanical stress.

The above and other objects and novel features of the present invention are as follows:
It will become clear from the description of this specification and the accompanying drawings.

[Summary of the invention]

A brief overview of typical inventions disclosed in this application is as follows.

That is, from the opening at one end of the stacked magazines,
The IC can be removed from the magazine by spraying gas towards the space where the IC is stored.
With a simple mechanism, multiple I can be removed from the magazine.
Since the Cs are carried out in a connected state, there is no pile-up situation, so it is possible to reduce mechanical stress as well.

〔Example〕

FIG. 1 is a schematic side view of a loader section for explaining an embodiment of the method for carrying out an IC according to the present invention, and FIG. 2 is a schematic side view for explaining an embodiment of the method for carrying out an IC according to the present invention. A schematic front view of the loader section, FIG. 3 is a schematic front view of a rack in which magazines are stored.

As shown in the figure, 1 is a rack for storing a large number of magazines 2. In the rack 1, a partition plate 3 that partitions the magazine 2 in the longitudinal direction is arranged to be slightly wider than the width of the magazine 2, so that a plurality of magazines 2 can be stacked and stored in each partition. . 4 is the rack 1
This mounting table 4 is movable in the vertical direction by a vertical movement shaft 5 that is vertically moved by a motor (not shown). 6 is a rack guide that guides the vertical movement of the rack l. The rack guide 6
On one side of the partition plate 3 in the forming direction, a chute 7 is disposed corresponding to each section, and a gas injection port 8 is disposed corresponding to the inlet lower a of the sea-tough. Reference numeral 9 denotes a nozzle portion for injecting gas, for example, compressed air, from a gas source (not shown) through the gas injection port 8, and in this embodiment, it is disposed corresponding to each shooter. Reference numeral 10 denotes a processing section for processing the IC 12 carried out from the loader section 11, and includes, for example, a measuring section for characteristic testing, a marking section for marking semiconductor devices, and the like. In addition, 1
3a and 13b are the light source and receiver, and C12 is the magazine 2.
It is marked K so that you can check whether it has been taken out.

Next, one embodiment of a method for carrying out an IC will be described with reference to the drawings. After the ICs are packed in the magazine 2, the magazine is stored in the rack l. At this time, a certain magazine, for example, the magazine 2a and its upper magazine 2b, form a cylindrical space 14. Add magazine 2 to 1
After storing the rack 1 in the magazine opening 15 at the bottom, set the rack 1 on the mounting table 4 of the loader section 11.
a.

The mounting table 4 is moved to 5 so that the holder 15b faces the gas injection port 8 and the inlet lower a of the KneeTough, respectively. After the movement is completed, the nozzle 9 injects compressed gas that does not generate static electricity on the IC toward the opening 15a at one end of the magazine 2 through the gas injection port.

At this time, since the magazine 2a forms a cylindrical space 14 with the magazine 2b above it, the ICs packed in the magazine 2 are sent out as a series to the shooter 7 and then to the processing section 10. . Then, once the light from the light source 13a reaches the light receiver 13b, all the ICs 12 have been carried out to the processing section 10, so the injection of compressed gas is stopped. Thereafter, the mounting table 4 is lowered to move the primary magazine to a predetermined position, and the above-described operation is repeated.

Note that the cylindrical space 14 can be formed by placing an empty magazine or simply a plate-shaped object on the topmost magazine.

〔effect〕

(1) ICs in the magazine can be transported by simply aligning the opening of the magazine with the chute inlet and gas injection port and injecting gas toward the opening at one end of the magazine. Moreover, it becomes possible to transport the product in a short time.

(2) Since the ICs in the magazine are transported by gas pressure injected from the opening at one end of the magazine, the ICs
will move in sequence.

Therefore, in the gravity drop method, each IC starts falling at a different timing, so when the fall stops, the ICs collide one after another like a ball.
In transportation using gas pressure, the above-mentioned problem does not occur because the ICs are moved in a connected state.

(3) When the magazines are stacked or the topmost magazine is empty or has a plate-like object on it, the IC is being taken out by injecting gas from one end of the magazine from which the IC is being taken out. Since a cylindrical space is formed between the magazine and the magazine above it, gas pressure does not escape and effective conveyance can be performed.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the above Examples and can be modified in various ways without departing from the gist thereof. Nor. For example, in this embodiment, a chute, a nozzle part, and a gas injection port are provided corresponding to each division, but the invention is not limited to this, and the necessary number of common chutes, nozzle parts, and gas injection ports are provided in each division. In this case, a mechanism for moving the rack laterally may be provided to match the positions of the magazine and the shooter.

[Application field]

In the above explanation, the invention made by the present inventor has mainly been explained in terms of the technology for transporting semiconductor devices, which is the application field that forms the background of the invention, but it is not limited thereto. It can also be applied to the removal of goods that have been

[Brief explanation of the drawing]

FIG. 1 is a schematic side view of the loader section for explaining the method of transporting semiconductor devices according to the present invention.
FIG. 3 is a schematic front view of a loader section for explaining an embodiment of the method for carrying out semiconductor devices according to the present invention, and FIG. 3 is a schematic front view of a rack in which a magazine is stored. 1...Rack, 2.2a, 2b...Magazine, 3.
・・Partition plate, 4・Placement table, 5・・Vertical movement axis, 6
... Rack guide, 7... Shooter, 7a... Shooter inlet, 8... Gas injection port, 9... Nozzle, 1
0... Processing section, 11... Loader section, 12... Semiconductor device (IC), 13a... Light source, 13b... Receiver, 14... Cylindrical space, 15 a + 15 b. ...Magazine opening. 2-1 Figure 1 Figure 2 Figure σ Figure 3

Claims (1)

[Claims] 1. After stacking a plurality of magazines containing a plurality of semiconductor devices in series and storing them in a rack, gas is ejected from an opening at one end of the magazine and the semiconductor devices are carried out from an opening at the other end. A method for transporting a semiconductor device, characterized by: