JPS6181147U - - Google Patents
Info
- Publication number
- JPS6181147U JPS6181147U JP1984166741U JP16674184U JPS6181147U JP S6181147 U JPS6181147 U JP S6181147U JP 1984166741 U JP1984166741 U JP 1984166741U JP 16674184 U JP16674184 U JP 16674184U JP S6181147 U JPS6181147 U JP S6181147U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- electrodes
- insulating member
- main body
- open end
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
Description
第１図は電子部品の一例を示す側断面図、第２
図乃至第６図は第１図電子部品の製造方法を示す
側断面図、第７図及び第８図は本考案の他の実施
例を示す側断面図、第９図は従来の電子部品の一
例を示す側断面図、第１０図は第９図電子部品の
製造に用いられるリードフレームの斜視図である
。 ７……絶縁部材、７ａ，７ｂ……導電層、８…
…電子部品本体、８ａ，８ｂ……電極。
図乃至第６図は第１図電子部品の製造方法を示す
側断面図、第７図及び第８図は本考案の他の実施
例を示す側断面図、第９図は従来の電子部品の一
例を示す側断面図、第１０図は第９図電子部品の
製造に用いられるリードフレームの斜視図である
。 ７……絶縁部材、７ａ，７ｂ……導電層、８…
…電子部品本体、８ａ，８ｂ……電極。
Claims (1)
- 開口両端面に導電層を形成した筒状の絶縁部材
内に、両端に電極を有する電子部品本体を収容し
、絶縁部材の開口端と電子部品本体の電極とを電
気的に接続すると共に封止したことを特徴とする
電子部品。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984166741U JPS6181147U (ja) | 1984-10-31 | 1984-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984166741U JPS6181147U (ja) | 1984-10-31 | 1984-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6181147U true JPS6181147U (ja) | 1986-05-29 |
Family
ID=30724550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984166741U Pending JPS6181147U (ja) | 1984-10-31 | 1984-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6181147U (ja) |
-
1984
- 1984-10-31 JP JP1984166741U patent/JPS6181147U/ja active Pending